KR102158024B1 - Cutting apparatus, method of attaching semiconductor package and manufacturing method of electronic component - Google Patents

Abstract

The present invention attaches the semiconductor package to the attachment member after cutting the package substrate into a plurality of semiconductor packages.
The cutting device 1 includes a cutting mechanism 7 for cutting a package substrate 2 in which a plurality of semiconductor chips are resin-sealed into a plurality of semiconductor packages P, and a storage table for storing the cut semiconductor packages P ( 12), a plurality of transfer mechanisms 20 for adsorbing the semiconductor package P and transferring the semiconductor package P from the storage table 12 to the attachment member 17, and the operation of the transfer mechanism 20 are controlled. A control unit (CTL) is provided, the plurality of transfer mechanisms (20) are provided with a plurality of adsorption units (23), and the control unit (CTL) is a state in which the plurality of adsorption units (23) adsorb the semiconductor package (P). In, the plurality of transfer mechanisms 20 are sequentially operated to push the semiconductor package P adsorbed on the adsorption part 23 to the attachment member 17 and release the adsorption by the adsorption part 23 to release the adsorption part ( Control to separate 23) from the attachment member 17 is performed.

Description

A cutting device, a method of attaching a semiconductor package, and a method of manufacturing an electronic component {CUTTING APPARATUS, METHOD OF ATTACHING SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT}

The present invention relates to a cutting device, a method for attaching a semiconductor package, and a method for manufacturing an electronic component.

As a prior art, for example, Japanese Unexamined Patent Application Publication No. 2016-21541 (Patent Document 1) discloses a reorganized article provided with a transfer mechanism for transferring the reorganized individualized article to a container by cutting the object using a cutting means. The manufacturing apparatus of is disclosed. The apparatus for manufacturing the individualized article includes a suction source for adsorbing the segmented article, a suction system piping connected to the suction source, a plurality of suction pads provided in the transfer mechanism and for adsorbing a plurality of segmented articles, respectively. , Reorganization by supplying high-pressure gas to a plurality of openings each formed in a plurality of adsorption pads, a plurality of individual pipes provided in the transfer mechanism and each connected to the plurality of openings, and a plurality of individual pipes to pressurize the individualized article A pressurization source for blowing off the fired product from a plurality of suction pads, a pressurization system pipe connected to the pressurization source, an on-off valve provided in the pressurization system pipe to open and close the pressurization system pipe, and a plurality of individual pipes, respectively, A plurality of selector valves for connecting each of the individual pipes and the suction system pipe, or for connecting each of the plurality of individual pipes and the pressure system pipe, and a control unit for controlling at least an on-off valve and a plurality of selector valves.

In addition, for example, Shou Yamazaki, Yusuke Takano, Shoichi Honma, "Electromagnetic shield film formation technology applying sputter film formation in a semiconductor package", Toshiba Review, Toshiba Corporation, December 2016, Vol. 71, No. On pages 6 and 16 to 19 (Non-Patent Document 1), there is disclosed a technique for forming an electronic shield film by a sputter deposition method by attaching an individual semiconductor package to a tape for protecting the back surface of an attachment member.

Japanese Unexamined Patent Publication No. 2016-21541

Shoi Yamazaki, Yusuke Takano, Shoichi Honma, "Electromagnetic Shield Film Formation Technology Using Sputter Film Formation in Semiconductor Packages", Toshiba Review, Toshiba Corporation, December 2016, Vol. 71, No. 6, pages 16-19

However, considering productivity in forming an electronic shield film by attaching a plurality of semiconductor packages to an attachment member as disclosed in Non-Patent Document 1, the package can be formed at high density by maintaining a film-formable gap on the side of the package (sealing resin part). It is desirable to place it. Therefore, precision is required to attach the semiconductor package to the attachment member.

On the other hand, as a current state, a plurality of semiconductor chips as disclosed in Patent Document 1 is using an attachment device separately from a cutting device that cuts a resin-encapsulated package substrate to separate semiconductor packages. In consideration of productivity, a technique of attaching a semiconductor package to an attachment member with high precision using a cutting device is desirable, but no specific technical proposal has been made therefor.

The present invention solves the above-described problems, and after cutting the package substrate into a plurality of semiconductor packages, a cutting device capable of improving productivity in attaching a semiconductor package to an attachment member, a method of attaching a semiconductor package, and an electronic component It aims to provide a manufacturing method.

In order to solve the above problems, the cutting device according to the present invention includes a cutting mechanism for cutting a package substrate having a plurality of semiconductor chips resin-sealed into a plurality of semiconductor packages, a storage table for storing the semiconductor package cut by the cutting mechanism, and , A plurality of transfer mechanisms for adsorbing the semiconductor package and transferring the semiconductor package from the storage table to the attachment member, and at least a control unit for controlling the operation of the transfer mechanism, the plurality of transfer mechanisms having a plurality of adsorption units, and the control unit Control of separating the adsorption unit from the attachment member by pushing the semiconductor package adsorbed on the adsorption unit to the attachment member by sequentially operating a plurality of transfer mechanisms while the plurality of adsorption units adsorb the semiconductor package, and releasing the adsorption by the adsorption unit Do.

In order to solve the above problems, the method of attaching a semiconductor package according to the present invention includes a cutting process of cutting a package substrate having a plurality of semiconductor chips resin-sealed into a plurality of semiconductor packages, a storage process of storing the semiconductor package on a storage table, and , A transfer process in which the semiconductor package is adsorbed by a plurality of adsorption units provided in a plurality of transfer mechanisms to transfer the semiconductor package from the storage table to the upper side of the attachment member, and a semiconductor adsorbed to the adsorption unit by sequentially operating the plurality of transfer mechanisms And an attaching step of attaching the semiconductor package to the attaching member by pushing the package to the attaching member and releasing the adsorption by the adsorbing unit to separate the adsorbing unit from the attaching member.

The above and other objects, features, aspects and advantages of the present invention will become apparent from the following detailed description of the present invention, which is understood in connection with the accompanying drawings.

1 is a plan view showing an outline of the device in a cutting device according to the present invention.
2(a) to 2(c) are schematic cross-sectional views showing an operation of transferring and attaching a semiconductor package from a storage table to an attachment member in the first embodiment.
3A to 3C are schematic cross-sectional views showing an operation of transferring and attaching the following semiconductor package from the storage table to the attachment member in the first embodiment.
Fig. 4 is a plan view showing a state just before a semiconductor package is transferred using two transfer mechanisms in Embodiment 1. [Fig.
Fig. 5 is a plan view showing a state in which a semiconductor package is transferred using two transfer mechanisms in the first embodiment.
6(a) to (c) are schematic diagrams showing the attachment member used in Embodiment 2, where (a) is a plan view showing a plate-shaped member, (b) is a plan view showing a resin sheet, and (c) Is a schematic cross-sectional view showing an attachment member.
7A to 7C are schematic cross-sectional views showing an operation of transferring and attaching a semiconductor package from a storage table to an attachment member in the second embodiment.
8A to 8C are schematic cross-sectional views showing an operation of transferring and attaching a semiconductor package from a storage table to an attachment member in the third embodiment.
9 is a plan view showing a first camera provided in a transfer mechanism and a second camera provided below the transfer mechanism in Embodiment 4;
Fig. 10 is a schematic diagram showing a state in which (a) a second camera is imaging a semiconductor package, and (b) is a state in which the first camera is imaging an opening of an attachment member in the fourth embodiment.
Fig. 11 is a schematic diagram showing a state in which an opening of a plate-like member is imaged using a first camera in the fourth embodiment.
12A to 12D are schematic cross-sectional views showing a process of manufacturing an electronic component by forming a conductive film on the semiconductor package attached to the attachment member in the second embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. Any drawings in the present application are schematically omitted or exaggerated as appropriate for ease of understanding. The same components are denoted by the same reference numerals, and descriptions thereof are appropriately omitted. In addition, the term ``support member'' in this application document is a member that supports a support object such as a chip, an insulating film, a conductive film, and a semiconductor film, and is a general substrate and lead such as a glass epoxy substrate, a ceramic substrate, a resin substrate, and a metal substrate Frames, semiconductor wafers, and the like.

[Embodiment 1]

(Configuration of cutting device)

The configuration of the cutting device according to the present invention will be described with reference to FIG. 1. As shown in Fig. 1, the cutting device 1 is a device that cuts a package substrate, which is an object to be cut, into a plurality of regions, and attaches a semiconductor package as a cut object to an attachment member. The cutting device 1 includes a supply module (A) for supplying a semiconductor package, a cutting module (B) for cutting the package substrate, an inspection module (C) for inspecting the cut semiconductor package, and an attachment module for attaching the inspected semiconductor package. Each of (D) is provided as a component. Each component (each module (A to D)) is detachable and replaceable for each other component.

As a package substrate, a supporting member having a resin portion or the like is cut by the cutting device 1 and divided into pieces. Examples of the supporting member having a resin portion include a sealed substrate in which a plurality of chips mounted on a substrate are resin-sealed, or a sealed wafer in which a plurality of chips mounted on a semiconductor wafer are resin-sealed. It is also possible to cut the support member itself before molding the resin part. In the present embodiment, a case where the sealed substrate is cut as a package substrate, divided into a plurality of regions, and the divided semiconductor package is attached to the attachment member will be described.

The sealed substrate includes a substrate, a plurality of chips mounted on a plurality of regions of the substrate, and a sealing resin molded so that the plurality of regions are collectively covered. A plurality of semiconductor packages separated by cutting the sealed substrate corresponds to each product.

As shown in Fig. 1, the supply module A is provided with a package substrate supply unit 3 for supplying a sealed substrate 2 corresponding to the package substrate. The sealed substrate 2 is transferred from the supply module A to the cutting module B by a transfer mechanism (not shown).

The cutting module B is provided with a cutting table 4 for placing and cutting the sealed substrate 2. The cutting table 4 is movable in the Y direction in the drawing by the moving mechanism 5. Further, the cutting table 4 can be rotated in the θ direction by the rotation mechanism 6. On the cutting table 4, for example, a cutting jig (not shown) may be mounted to place the sealed substrate 2 on the cutting jig.

The cutting module B is provided with a spindle 7 as a cutting mechanism. The cutting device 1 is, for example, a cutting device having a single spindle configuration provided with one spindle 7. The spindle 7 can independently move in the X and Z directions. A rotating blade 8 is mounted on the spindle 7. The spindle 7 is provided with a cutting water nozzle for spraying cutting water toward the rotating blade 8 rotating at a high speed, a cooling water nozzle (not shown) and the like for spraying cooling water, respectively. The sealed substrate 2 is cut by relatively moving the cutting table 4 and the spindle 7. The rotating blade 8 cuts the sealed substrate 2 by rotating in a plane perpendicular to the X axis.

It is also possible to use a cutting device having a twin spindle configuration in which two spindles are provided in the cutting module B. In the case of cutting a large-area package substrate, since the total distance of the package substrate cut by the rotary blade becomes longer, it is desirable to provide two spindles to efficiently cut the package substrate. Further, in order to improve the productivity of the cutting device, two cutting tables may be provided, and a twin cut table configuration in which the package substrate is cut at each cutting table may be employed.

An inspection table 9 is provided in the inspection module C. On the inspection table 9, a cut-off substrate 10, which is an assembly of semiconductor packages P that has been cut into pieces by cutting the sealed substrate 2, is transferred. The cut-off substrate 10 is transferred from the cutting table 4 on the inspection table 9 by a transfer mechanism (not shown). The examination table 9 is movable in the X direction and can be rotated about the Y direction as an axis.

The semiconductor package P itself, which has been cut into pieces by cutting the sealed substrate 2, corresponds to each product. As products, for example, products such as Land Grid Array (LGA), Ball Grid Array (BGA), Chip Size Package (CSP), and Quad Flat Non-leaded package (QFN) are manufactured.

In the inspection module C, the plurality of semiconductor packages P are inspected, for example, by the camera 11 for inspection as an inspection mechanism for their surface condition and the degree of manufacture (state). In accordance with the structure of the semiconductor package P, an inspection mechanism for inspecting the front side, the back side and the four sides of the semiconductor package P can be employed. The inspected semiconductor package P is sorted into good and defective products. The inspected semiconductor package P is transferred from the inspection table 9 to the storage table 12. The storage table 12 is movable in the Y direction.

The attachment module D is provided with an attachment member supply part 13 for supplying an attachment member. As the attachment member, a resin sheet or the like attached to the support base is used. For example, when a frame-shaped member 15 having a circular opening 14 is used as a support base, and an attachment member 17 having a resin sheet 16 mounted on the frame-shaped member 15 is used. Explain about.

As the frame-shaped member 15, a metal frame such as stainless steel or aluminum is used. As the shape of the frame-shaped member 15, for example, a square shape, a chamfered square shape, and a circular shape are used. You may use shapes other than these. Also, the shape of the opening 14 is not particularly limited, such as a circular shape or a square shape. In FIG. 1, a case of using a rectangular frame-shaped member 15 having a circular opening 14 and having a chamfered shape is shown.

The resin sheet 16 is a sheet in which an adhesive is applied to both surfaces of a resin sheet-like substrate. As the adhesive, a pressure sensitive adhesive (pressure sensitive adhesive) can be used. As the resin sheet 16, for example, a resin sheet in which a silicone pressure-sensitive adhesive is applied on both surfaces of a polyimide film is used. Here, the adhesive may be applied to at least the surface to which the semiconductor package P is attached, but by applying it on both sides, the resin sheet 16 may be attached to the support base. Further, the surface to which the semiconductor package P is attached and the surface to which the support base is attached may be the same side.

Moreover, as a support base, a metal plate, a glass plate, a resin plate, a semiconductor wafer, etc. can be used. Moreover, you may use a laminated board which laminated these. In addition, the shape of the support base is not particularly limited, such as a circular shape or a square shape. In addition, an opening may be formed or an opening may not be formed. An optimal support base can be used depending on the application.

A receiving cassette (not shown) is disposed in the attachment member supplying portion 13. A plurality of attachment members 17 are accommodated in the accommodation cassette. The attachment member 17 is transferred from the attachment member supply part 13 to the attachment table 18 by a transfer mechanism (not shown). The attachment table 18 is provided with an alignment mechanism 19 capable of aligning the attachment members 17, for example. The attachment table 18 is movable in the Y direction.

As the alignment mechanism 19, for example, an alignment mechanism that aligns the positions in the X direction and the Y direction by fitting the attachment member 17 from both sides can be used. The alignment mechanism 19 is preferably arranged above the attachment table 18 so that a part of the alignment mechanism 19 overlaps the attachment table 18. Thereby, it is possible to suppress an increase in the area of the entire cutting device 1. It is not limited to this, and as the alignment mechanism 19, an alignment mechanism for aligning the attachment member 17 using a positioning pin may be used. Any alignment mechanism capable of aligning the attachment member 17 in the X and Y directions may be sufficient. Furthermore, a positioning mechanism for aligning the attachment member 17 with the attachment table 18 may be provided.

The attachment module (D) includes a plurality of transfer mechanisms (20) for adsorbing the semiconductor package (P) inspected by the inspection module (C) and transferring the semiconductor package (P) from the storage table (12) to the attachment member (17). It is prepared. In this case, for example, two transfer mechanisms 20 are provided. The transfer mechanism 20 is movable in the X direction. Further, the transfer mechanism 20 can be moved in the Z direction. The semiconductor package P is transferred from the storage table 12 to the attachment member 17 by two transfer mechanisms 20 and is attached on the resin sheet 16 of the attachment member 17. The attaching member 17 to which the semiconductor package P is attached is returned to the attaching member supplying portion 13, and is accommodated in the original position of the receiving cassette.

The attachment module D is provided with a vacuum pump 21 serving as a suction mechanism. The vacuum pump 21 is used to adsorb the sealed substrate 2 onto the cutting table 4, and the cut substrate 10, which is an assembly of the semiconductor package P, is placed on the inspection table 9 and the storage table 12. ), the transport mechanism 20 adsorbs the semiconductor package P, and the like. In FIG. 1, for convenience, only one vacuum pump 21 is provided in the attachment module D, but in reality, a plurality of vacuum pumps are provided in the cutting device 1.

A control unit CTL is provided in the supply module A. The control unit (CTL) includes an adsorption unit to be described later and controls at least the operation of the transfer mechanism, in which the operation of the cutting device 1, the transfer of the sealed substrate 2, the cutting of the sealed substrate 2, and the cut substrate The transport of (10), inspection of the semiconductor package P, supply of the attaching member 17, transport of the semiconductor package P, and the like are controlled. In this embodiment, the control unit CTL is provided in the supply module A. It is not limited to this, and the control unit CTL may be provided in another module. Further, the control unit CTL may be divided into a plurality and provided in at least two of the supply module A, the cutting module B, the inspection module C, and the attaching module D.

In addition, since Fig. 1 shows the case of cutting the sealed substrate 2 having a rectangular (rectangular) shape as a package substrate, the cutting table 4, the inspection table 9, and the storage table 12 It was assumed to have a square shape. This is not limited to this, and in the case of handling a semiconductor wafer including a sealing resin portion as a package substrate, for example, the cutting table 4, the inspection table 9, and the storage table 12 are formed in a circular shape. You may do it.

(Configuration of storage table and transfer mechanism)

The configuration of the storage table 12 and the transfer mechanism 20 will be described with reference to FIG. 2. As shown in Fig. 2(a), the storage table 12 has suction holes 22 for adsorbing a plurality of semiconductor packages P, corresponding to each of the semiconductor packages P. Each suction hole 22 is connected to the vacuum pump 21 (see Fig. 1) through respective pipes (not shown). The cut semiconductor package P is adsorbed to the storage table 12 through each of the adsorption holes 22. For example, if the size of the semiconductor package P is the same size (a) (a × a) in the X and Y directions, the semiconductor package P is the same as the size of the semiconductor package in the X and Y directions ( It is adsorbed on the storage table 12 according to the pitch (a). In FIG. 2A, for convenience, 13 semiconductor packages P are arranged in the X direction.

In this case, the semiconductor package P was adsorbed onto the storage table 12 at the same interval (pitch a) as the size of the semiconductor package P in accordance with the size (a×a) of the semiconductor package P. The present invention is not limited to this, and the semiconductor package P may be adsorbed onto the storage table 12 at an interval (pitch) larger than the size of the semiconductor package P.

The transfer mechanism 20 includes a plurality of adsorption portions 23 for adsorbing the semiconductor package P. Each of the plurality of adsorption units 23 is independently movable in the Z direction. Each adsorption part 23 is connected to the vacuum pump 21 (refer FIG. 1) through each pipe (not shown). In FIG. 2, for example, the case where seven suction parts 23 are provided in the conveyance mechanism 20 is shown. In addition, for ease of explanation, the seven adsorption units 23 are referred to as 23a, 23b, 23c, 23d, 23e, 23f, and 23g in order from the left (toward the +X direction) as shown in Fig. 2(a). do. The adsorption portions 23a to 23g have a variable spacing between them.

The transfer mechanism 20 can collectively adsorb seven semiconductor packages P by the seven adsorption portions 23 (23a to 23g). The transfer mechanism 20 transfers the adsorbed seven semiconductor packages P from the storage table 12 to the attachment member 17. Each of the adsorption units 23 can be adjusted by changing the distance between each adsorption unit 23 by a distance adjustment mechanism (not shown). Therefore, even if the size of the semiconductor package P or the pitch in which the semiconductor packages P are arranged are different, the distance between the respective adsorption units 23 can be changed to collectively adsorb the semiconductor packages P. In this case, seven adsorption units 23 are provided in the transfer mechanism 20, but any number of adsorption units may be provided in the transfer mechanism 20. It is also possible to provide three or more transfer mechanisms.

The transfer mechanism 20 is movable in the X direction, and each of the adsorption portions 23 (23a to 23g) is independently movable in the Z direction. Thereby, the semiconductor package P can be adsorbed using only the specific adsorption part 23 among the plurality of adsorption parts 23. For example, if seven or more semiconductor packages P are arranged on the storage table 12, the seven semiconductor packages P can be collectively adsorbed by the seven adsorption portions 23. If the number of semiconductor packages P arranged on the storage table 12 is 6 or less, the suction unit 23 can adsorb the semiconductor packages P according to the number of the arranged semiconductor packages P. . Therefore, the seven adsorption units 23 can arbitrarily select and adsorb seven semiconductor packages P from one.

In addition, only good products can be selected and adsorbed from among the semiconductor packages P arranged on the storage table 12 by the seven adsorption units 23. In other words, the transfer mechanism 20 can transfer the semiconductor package P from the storage table 12 to the attachment member 17 by adsorbing only good products without adsorbing defective products. Alternatively, only defective products may be adsorbed and removed from the storage table 12 in advance.

In addition, it is also possible to allow the transfer mechanism 20 to be movable in the X and Z directions, and not to make the suction unit 23 movable in the Z direction. In this case, for example, the semiconductor package (defective product) that is not transferred may be left in a state where it is adsorbed to the storage table 12 without being adsorbed by the adsorption unit 23. Only the semiconductor package (good product) to be transferred may be transferred by the adsorption unit 23 adsorbing it.

(Moving and attaching the semiconductor package)

2 to 3, the semiconductor package P is transferred from the storage table 12 to the attachment member 17 using the transfer mechanism 20, and the semiconductor package is transferred onto the resin sheet 16 of the attachment member 17. The operation of attaching the package P will be described. For convenience, first, a case where one transfer mechanism 20 adsorbs the semiconductor package P and transfers and attaches it to the attachment member 17 will be described.

First, as shown in Fig. 2(a), in the transfer mechanism 20, the spacing (pitch) of each suction unit 23 is determined by the pitch a in which the semiconductor package P is arranged on the storage table 12. Change it to be the same. Next, the transfer mechanism 20 is moved above the seven semiconductor packages P1 to be transferred this time. In Fig. 2A, seven semiconductor packages indicated by P1 correspond to the semiconductor packages transferred in this operation. Further, the three semiconductor packages indicated by P0 correspond to the semiconductor packages transferred in the previous operation, and the three semiconductor packages indicated by P2 correspond to the semiconductor packages transferred in the next operation.

Next, in a state in which the intervals of the respective suction units 23 are aligned with the pitch a, the respective suction units 23 (23a to 23g) are lowered, and the seven semiconductor packages P1 are moved to the seven suction units 23 ) Collectively and adsorbed. In this case, the respective adsorption portions 23 are lowered to collectively adsorb the semiconductor package P1. The present invention is not limited to this, and the transfer mechanism 20 may be lowered and the seven semiconductor packages P1 may be collectively adsorbed, or both the transfer mechanism 20 and the adsorption unit 23 may be lowered to lower the semiconductor package P1. You may adsorb.

Next, as shown in Fig. 2(b), with the seven semiconductor packages P1 adsorbed, the transfer mechanism 20 is moved from the storage table 12 to the upper side of the attachment member 17. During this movement, in the transfer mechanism 20, the spacing between the respective adsorption portions 23 is changed to a constant spacing, for example a pitch b, in which the semiconductor packages P1 are arranged in the attachment member 17. The pitch (b) is an interval larger than the pitch (a) (the size of the semiconductor package P). The transfer mechanism 20 is stopped at a predetermined position on the resin sheet 16 of the attachment member 17. 2(b) shows a case in which 10 semiconductor packages P are arranged in the X direction at intervals of a pitch b. In addition, the two semiconductor packages indicated by P0 correspond to the semiconductor packages attached in the previous operation.

Next, as shown in Fig. 2(c), by lowering the seven adsorption portions 23 (23a to 23g), the seven semiconductor packages P1 are collectively attached to the resin sheet 16 of the attachment member 17. Push.

Next, in the state where the seven semiconductor packages P1 are pressed against the resin sheet 16, the adsorption of the seven adsorption portions 23 is released. Then, the seven adsorption portions 23 are raised so as to be separated from the attachment member 17 to return to their original positions. In this state, in addition to the attachment of the two semiconductor packages P0 by the previous operation, seven new semiconductor packages P1 are attached to this row F in the attachment member 17.

Next, the transfer mechanism 20 is moved from the top of the attachment member 17 to the top of the storage table 12. In the conveyance mechanism 20, the spacing of each suction part 23 is changed from the pitch (b) to the pitch (a).

Next, as shown in Fig. 3(a), in the storage table 12, for example, the three adsorption portions 23e to 23g of the transfer mechanism 20 are transferred to the remaining three semiconductors. It is arranged above the package P2. The three adsorption portions 23e to 23g are lowered to adsorb the three semiconductor packages P2. The three adsorption portions 23e to 23g are returned to their original positions.

Next, by moving the storage table 12 in the -Y direction and further moving the transfer mechanism 20 in the +X direction, the four semiconductor packages P2 (not shown) arranged in the next row are Four adsorption portions 23a to 23d are arranged above. The four adsorption portions 23a to 23d are lowered to adsorb the four semiconductor packages P2. The four adsorption portions 23a to 23d are returned to their original positions. In this state, the transfer mechanism 20 is divided into two and adsorbs seven semiconductor packages P2.

Next, with the seven semiconductor packages P2 adsorbed, the transport mechanism 20 is moved from the storage table 12 to the upper side of the attachment member 17. During this movement, the transfer mechanism 20 changes the spacing of the suction portions 23 from the pitch (a) to the pitch (b).

Next, as shown in Fig. 3(b), in the attachment member 17, for example, the suction part 23g of the transfer mechanism 20 is attached after the seven semiconductor packages P1 are attached. Place it above the position. The suction portion 23g is lowered to attach one semiconductor package P2 on the resin sheet 16. The adsorption portion 23g is returned to its original position. In this state, two semiconductor packages P0, seven semiconductor packages P1, one semiconductor package P2, and a total of ten semiconductor packages P are attached to this row. The adsorption portions 23a to 23f remain in a state in which the semiconductor package P2 attached to the next row is respectively adsorbed.

Next, as shown in Fig. 3(c), by moving the attachment table 18 in the -Y direction and further moving the transfer mechanism 20 in the +X direction, the six suction portions 23a to 23f ) Is placed above the attachment position where the semiconductor package P2 is attached in the next row. The six adsorption portions 23a to 23f are lowered to attach the six semiconductor packages P2 on the resin sheet 16. The adsorption portions 23a to 23f are returned to their original positions. In this state, the transfer mechanism 20 divides into two and attaches seven semiconductor packages P2 to the attachment member 17. In addition, in Fig. 3C, the four semiconductor packages indicated by P3 correspond to the semiconductor packages attached in the next operation. By repeating this operation a plurality of times, the semiconductor package P is transferred from the storage table 12 to a predetermined position of the attachment member 17 to sequentially attach the semiconductor package P to the attachment member 17.

The operation of the transfer mechanism 20 including the adsorption and adsorption release operation by the adsorption unit 23 here is controlled by the control unit CTL described above.

(Action of transferring and attaching semiconductor packages using two transfer mechanisms)

Hereinafter, the operation of transferring and attaching the semiconductor package P using the two transfer mechanisms 20 will be described, but a detailed description will be provided for the same contents as the operation when the one transfer mechanism 20 is used. Do not repeat. In addition, the operation of the transfer mechanism 20 including the adsorption and adsorption release operation by the adsorption unit 23 here is controlled by the control unit CTL described above.

Referring to Figs. 4 to 5, the semiconductor package P is transferred from the storage table 12 to the attachment member 17 using two transfer mechanisms 20, and the resin sheet 16 of the attachment member 17 is transferred. The operation of attaching the semiconductor package P to the device will be described.

As a state immediately before transporting the semiconductor package P, for example, as shown in FIG. 4, the storage table 12, the attachment member 17, and the two transport mechanisms 20a, 20b are placed in the X direction. It is arranged so as to be symmetrical with respect to the center line CL (shown by the thin one-dot chain line) extending along the line. The two transfer mechanisms 20a and 20b are, for example, X according to the transfer rails R1 and R2 (shown by thin broken lines) provided at positions separated by a distance L in the Y direction from the center line CL. Move in the direction

In FIG. 4, a plurality of individualized semiconductor packages P are arranged in a lattice shape on the storage table 12. For example, 7 in the X direction, 15 in the Y direction, and 105 semiconductor packages P in total are arranged in a lattice shape. Each of the semiconductor packages P is arranged at intervals of pitch a in the X and Y directions. For convenience, an aggregate of seven semiconductor packages P arranged along the X direction is referred to as a group (G1, G2, G3, ..., G4, G5, G6, G14, G15) from the left.

The transfer mechanisms 20a and 20b are each provided with seven suction portions 23 (23a to 23g: see Fig. 2). The spacing between the adsorption portions 23 of the transfer mechanisms 20a and 20b is set to a pitch a equal to the pitch a of the semiconductor packages P arranged on the storage table 12.

The frame member 15 of the attachment member 17 is provided with an opening 14 corresponding to, for example, a 300 mm wafer. The resin sheet 16 is attached to the frame-shaped member 15 so as to cover the opening 14. In such an attachment member 17, for example, the semiconductor package P is attached to the resin sheet 16 covering the opening 14 at intervals of pitch b in the X and Y directions together with the attachment member 17 The case of attaching to will be described. 4 to 5 show a case where 89 semiconductor packages P are transferred and attached from the storage table 12 to the attachment member 17.

An operation of transferring the semiconductor package P using the two transfer mechanisms 20a and 20b and attaching the semiconductor package P to the attachment member 17 will be described with reference to FIG. 5. As shown in FIG. 5, first, the storage table 12 is moved in the +Y direction, and the seven semiconductor packages P of the group G1 are arrange|positioned below the conveyance rail R1. Next, the transfer mechanism 20a is moved along the transfer rail R1 in the -X direction to stop above the seven semiconductor packages P of the group G1. Next, the seven suction portions 23 of the transfer mechanism 20a are lowered, and the seven semiconductor packages P are sucked by the seven suction portions 23. Then, the seven adsorption portions 23 are returned to their original positions. This series of operations is a suction operation in which the transfer mechanism 20a sucks the semiconductor package P.

Next, the transfer mechanism 20a is moved along the transfer rail R1 in the +X direction. While the transfer mechanism 20a is moving from the storage table 12 to the attachment member 17, the spacing of each suction unit 23 is changed from the pitch (a) to the pitch (b). Next, the attachment table 18 is moved in the ±Y direction, and the transfer mechanism 20a is moved in the ±X direction, so that the respective adsorption portions 23 are attached to the respective attachment positions on the attachment member 17. Move to the top of. Next, the semiconductor packages P are attached on the resin sheet 16 at intervals of the pitches b by lowering the respective adsorption portions 23 at each attachment position. Next, each suction unit 23 is returned to its original position. This series of operations becomes an attaching operation in which the transfer mechanism 20a attaches the semiconductor package P.

For example, in the attachment member 17, if there is an attachment region to which seven or more semiconductor packages P are attached, seven semiconductor packages P are collectively attached on the resin sheet 16. When there is only an attaching area to which six or less semiconductor packages P are attached, as many as the number of attachable semiconductor packages P are attached on the resin sheet 16. The remaining semiconductor package P is attached to the attachment region in the next row. In this way, the seven semiconductor packages P are collectively or divided and affixed on the resin sheet 16.

In this case, the operation of attaching a plurality of semiconductor packages P together on the resin sheet 16 has been described. The present invention is not limited to this, and the semiconductor packages P adsorbed to the seven adsorption portions 23 (23a to 23g) may be attached to the resin sheet 16 one by one.

The transfer mechanism 20a performs an attachment operation on the attachment member 17, and the transfer mechanism 20b performs a suction operation on the storage table 12. When the transfer mechanism 20b performs the suction operation, the storage table 12 is further moved in the +Y direction, and the seven semiconductor packages P of the group G2 are arranged under the transfer rail R2. Next, the transfer mechanism 20b is moved in the -X direction along the transfer rail R2 to stop above the seven semiconductor packages P of the group G2. Next, the seven suction portions 23 of the transfer mechanism 20b are lowered, and the seven semiconductor packages P are sucked by the seven suction portions 23. Then, the seven adsorption portions 23 are returned to their original positions. This series of operations is a suction operation in which the transfer mechanism 20b sucks the semiconductor package P.

Next, the transfer mechanism 20b is moved in the +X direction along the transfer rail R2. While the transfer mechanism 20b is moving from the storage table 12 to the attachment member 17, the spacing of each suction unit 23 is changed from the pitch (a) to the pitch (b). Next, the attachment table 18 is moved in the ±Y direction, and the transfer mechanism 20b is moved in the ±X direction, so that the transfer mechanism 20a becomes the seven semiconductor packages P of the group G1. Each adsorption part 23 of the conveyance mechanism 20b is moved above the attachment position after attaching. Next, the semiconductor packages P are attached on the resin sheet 16 at intervals of the pitches b by lowering the respective adsorption portions 23 at each attachment position. Next, each suction unit 23 is returned to its original position. This series of operations becomes an attaching operation in which the transfer mechanism 20b attaches the semiconductor package P. The seven semiconductor packages P are collectively or divided by the attaching operation and attached on the resin sheet 16.

The transfer mechanisms 20a and 20b in the attachment member 17 complete the attachment operation, respectively, and during the movement from the attachment member 17 to the storage table 12, the distance between the adsorption portions 23 is pitched (b) To pitch (a). With the transfer mechanisms 20a and 20b making the interval between the suction portions 23 the pitch a, the following suction operation is performed on the storage table 12. The transfer mechanisms 20a and 20b transfer and attach the semiconductor package P to the attachment member 17 from the storage table 12 by alternately performing the suction operation and the attachment operation.

FIG. 5 is a state in which, for example, the transfer mechanism 20b completes the adsorption operation of adsorbing the seven semiconductor packages P of the group G4, and is moving from the storage table 12 to the attachment member 17 Is shown. Next, the transfer mechanism 20b performs an attaching operation to attach the seven semiconductor packages P of the group G4 to the attaching position to attach the seven semiconductor packages P of the group G3. At the same time, the transfer mechanism 20a completes the attaching operation of attaching the seven semiconductor packages P of the group G3, and is moving from the attaching member 17 to the storage table 12. Next, the transfer mechanism 20a performs an adsorption operation of adsorbing the seven semiconductor packages P of the group G5. Thus, the semiconductor package P can be efficiently attached to the attachment member 17 from the storage table 12 by alternately performing the suction operation and the attachment operation by the two transfer mechanisms 20a and 20b. That is, by sequentially operating these transfer mechanisms 20 using a plurality of transfer mechanisms 20, the semiconductor package P adsorbed on the adsorption unit 23 is pushed against the attachment member 17, and the adsorption unit 23 By releasing the adsorption by releasing the adsorption portion 23 from the attachment member 17 and performing the attachment operation, efficient bonding of the semiconductor package P to the attachment member 17 becomes possible.

In addition, in FIG. 5, hatching showing the seven semiconductor packages P arranged in the groups G1 to G5 of the storage table 12, respectively, and the hatching showing the semiconductor packages P attached to the attachment member 17, respectively, are They are drawn with the same hatching to correspond.

(How to attach the semiconductor package)

Hereinafter, a method of attaching the semiconductor package P will be described, but the detailed description will not be repeated for the contents already described.

The cutting process is performed in the cutting module B. The sealed substrate 2, which is a package substrate placed on the cutting table 4, is cut using the rotary blade 8 of the spindle 7 as a cutting mechanism (see Fig. 1). Thereby, the sealed substrate 2 is brought into the state of the cut substrate 10 which is an assembly of a plurality of semiconductor packages P. After that, in the above-described inspection module C, the cut-off substrate 10 may be transferred to the inspection table 9 to perform an inspection process.

The storage process following the cutting process is performed in the inspection module C. The cut-off substrate 10 cut in the cutting process is placed on the storage table 12 and stored (see FIG. 1).

The transfer process following the storage process is performed in the inspection module (C) and the attachment module (D). From the cut-off substrate 10 placed on the storage table 12 by the plurality of adsorption units 23 provided in the plurality of transfer mechanisms 20a and 20b by lowering the plurality of transfer mechanisms 20a, 20b, a plurality of The semiconductor package P of is adsorbed (refer to Figs. 2(a) and 3(a)). In a state in which the plurality of adsorption portions 23 adsorb the semiconductor package P, it moves upward of the attachment member 17 placed on the attachment table 18 (Fig. 2(b), Fig. 3(b)). , See FIGS. 4 and 5).

The interval adjustment step is after adsorption of the semiconductor package P by the adsorption unit 23 in the transfer step, and is performed in at least one of the inspection module C and the attaching module D before the next attaching step. The distance between the plurality of adsorption units 23 in a state in which the semiconductor package P is adsorbed is adjusted to have a predetermined size (see Figs. 2(b), 3(b), 4 and 5). . This predetermined size is a size corresponding to the arrangement pitch of the plurality of semiconductor packages P to be attached to the attachment member 17 in the next attachment step, and is set in advance.

The attachment process following the transfer process and the interval adjustment process is performed in the attachment module D. The plurality of transfer mechanisms 20a and 20b are sequentially operated to lower the transfer mechanisms 20a and 20b to attach the semiconductor package P adsorbed to the adsorption unit 23 to the resin sheet 16 of the attachment member 17. After pushing and releasing adsorption by the adsorption part 23 in that state, the semiconductor package P is attached to the resin sheet 16 by separating the adsorption part 23 from the attachment member 17 (Fig. 2(c), 3(b), 3(c), 4, 5).

In the manner described above, the plurality of semiconductor packages P can be attached to the attachment member 17.

Incidentally, in the above description, the spacing between the plurality of adsorption portions 23 of the transfer mechanisms 20a and 20b is variable, but is not limited thereto. The spacing between the plurality of adsorption portions 23 of the transfer mechanisms 20a and 20b may not be variable. In addition, in the case of a device configuration in which the spacing of the plurality of adsorption units 23 of the transfer mechanisms 20a, 20b is not variable, in the description of the operation and method, the adjustment of the spacing of the plurality of adsorption units 23 is omitted. do. This is also the same in the embodiment described below.

(Action effect)

The cutting device 1 of the present embodiment comprises a spindle 7 as a cutting mechanism for cutting a sealed substrate 2, which is a package substrate in which a plurality of semiconductor chips are resin-sealed, into a plurality of semiconductor packages P, and a spindle 7 A storage table 12 for storing the semiconductor package P cut by ), and a plurality of storage tables P for adsorbing the semiconductor package P and transferring the semiconductor package P from the storage table 12 to the attachment member 17. The transfer mechanism 20a, 20b, and at least a control unit (CTL) for controlling the operation of the transfer mechanisms 20a, 20b are provided, the plurality of transfer mechanisms 20a, 20b are provided with a plurality of adsorption units 23, , The control unit CTL sequentially operates the plurality of transfer mechanisms 20a and 20b in a state in which the plurality of adsorption units 23 adsorb the semiconductor package P, and the semiconductor package adsorbed to the adsorption unit 23 ( P) is pushed against the attachment member 17 and the adsorption by the adsorption unit 23 is released, and control is performed to separate the adsorption unit 23 from the attachment member 17.

The method of attaching a semiconductor package of the present embodiment includes a cutting process of cutting the sealed substrate 2, which is a package substrate in which a plurality of semiconductor chips are resin-sealed, into a plurality of semiconductor packages P, and a storage table for storing the semiconductor package P. The storage process of storing in (12) and the semiconductor package P are adsorbed by the plurality of adsorption parts 23 provided in the plurality of transfer mechanisms 20a, 20b, and the semiconductor package P is removed from the storage table 12. A transfer process of transferring the attachment member 17 upward and a plurality of transfer mechanisms 20a, 20b are sequentially operated to attach the semiconductor package P adsorbed to the adsorption unit 23 to the resin sheet of the attachment member 17 Including the attaching process of attaching the semiconductor package P to the attachment member 17 by pushing on 16 and releasing adsorption by the adsorption unit 23 to separate the adsorption unit 23 from the attachment member 17. do.

According to this configuration, the sealed substrate 2 is cut by the spindle 7 serving as a cutting mechanism to produce a plurality of semiconductor packages P. The semiconductor package P cut by the plurality of adsorption portions 23 provided in the transfer mechanisms 20a and 20b can be attached on the resin sheet 16 attached to the attachment member 17.

According to this embodiment, the cutting process of manufacturing the semiconductor package P corresponding to the product by separating the sealed substrate 2 and the attachment process of attaching the semiconductor package P to the attachment member 17 are the same device. You can do it using Accordingly, the cutting step and the attaching step are not performed using different devices, and the cost of the equipment can be reduced. Therefore, it is possible to suppress the manufacturing cost of the product. Therefore, it is possible to improve productivity.

In addition, in the cutting device 1 of the present embodiment, the plurality of adsorption units 23 have a variable distance from each other, and the control unit CTL is in a state in which the plurality of adsorption units 23 adsorb the semiconductor package P. By adjusting the distance between the plurality of adsorption units 23 and sequentially operating the plurality of transfer mechanisms 20a and 20b, the semiconductor package P adsorbed on the adsorption unit 23 is pushed to the attachment member 17. It has a configuration in which control is performed to release the adsorption by the adsorption part 23 and detach the adsorption part 23 from the attachment member 17 after sticking.

The method of attaching a semiconductor package of the present embodiment further includes a distance adjustment step of adjusting the distance between the plurality of adsorption portions 23 in a state in which the semiconductor package P is adsorbed, and after the distance adjustment step, an attaching step Do.

According to this configuration, the transfer mechanisms 20a and 20b are provided with a plurality of adsorption portions 23 with variable intervals from each other. The semiconductor package P can be attached at arbitrary intervals on the resin sheet 16 attached to the attachment member 17 by the plurality of adsorption portions 23 provided in the transfer mechanisms 20a and 20b. Accordingly, it is possible to improve the positional accuracy of the semiconductor package P attached to the attachment member 17.

According to the present embodiment, a plurality of adsorption portions 23 having variable intervals from each other are provided in the transfer mechanisms 20a and 20b. The transfer mechanisms 20a, 20b collectively or dividedly adsorb the plurality of semiconductor packages P by the plurality of adsorption portions 23, and the plurality of semiconductor packages P are adsorbed from the storage table 12 to the attachment member 17. ) Can be transferred collectively. Since a plurality of semiconductor packages P are collectively transferred and attached to the attachment member 17, the productivity of attaching the semiconductor package P to the attachment member 17 can be improved.

Further, the transfer mechanisms 20a and 20b alternately perform the suction operation on the storage table 12 and the attachment operation on the attachment member 17. Thereby, the suction operation and the attachment operation can be simultaneously performed using the two transfer mechanisms 20a and 20b. By using the two transfer mechanisms 20a and 20b, the productivity of transferring and attaching the semiconductor package P from the storage table 12 to the attachment member 17 can be improved.

According to this embodiment, in the transfer mechanisms 20a and 20b, each of the adsorption portions 23 can independently move in the Z direction. Thereby, the semiconductor package P can be adsorbed using only the specific adsorption part 23 among the plurality of adsorption parts 23. Accordingly, among the semiconductor packages P arranged on the storage table 12, except for defective products, only good products can be adsorbed and transferred to the attachment member 17.

In the present embodiment, while the transfer mechanisms 20a and 20b are moving between the storage table 12 and the attachment member 17, the spacing between the respective suction units 23 is adjusted. In this case, in order to check whether or not the distance between the respective adsorption units 23 is properly adjusted, under the transfer mechanisms 20a and 20b, the adsorption units 23 of the transfer mechanisms 20a and 20b A camera for capturing the semiconductor package P may be provided. As a result, each of the adsorption units 23 adsorbs the semiconductor package P at correct intervals and can be attached at correct intervals.

In the present embodiment, in the attachment member supply unit 13, the attachment member 17 is supplied and the attachment member 17 is accommodated using the same storage cassette. Thereby, in the attachment module D, the attachment member supply part 13 was set as a device configuration in which both supply of the attachment member 17 and accommodation of the attachment member 17 are performed. Accordingly, an increase in the area of the attachment module D was suppressed, and an increase in the area of the entire cutting device 1 was suppressed. The present invention is not limited to this, and an attachment member supplying portion for supplying the attachment member 17 and an attachment member accommodating portion accommodating the attachment member 17 may be configured as a device.

[Embodiment 2]

The configuration of the attachment member used in Embodiment 2 and the operation of transferring and attaching the semiconductor package to the attachment member will be described with reference to FIGS. 6 to 7. The difference from Embodiment 1 is that a plate-shaped member having a plurality of first openings is used as a support base for the attachment member, and a resin sheet having a second opening is used as a plate-shaped member so as to correspond to the positions of the first openings of the plate-shaped member. It is to use the attachment member attached to. Other device configurations and operations are the same as those of the first embodiment, and description thereof will be omitted.

(Configuration of attachment member)

An attachment member used in Embodiment 2 will be described with reference to FIG. 6. As shown in Fig. 6(a), as a support base for the attachment member, for example, a plate-shaped member 25 having a plurality of first openings 24 is used. The plurality of first openings 24 are collectively formed into a plate-shaped member 25 by pressing or etching. As the material of the plate-shaped member 25, stainless steel, aluminum, or the like is used. As the shape of the plate-shaped member 25, a square shape, a chamfered square shape, a circular shape, and the like are used. You may use shapes other than these.

As shown in Fig. 6(a), the first opening 24 is formed in a square shape (square shape). The size of the first opening 24 is, for example, the same size as the semiconductor package (see FIG. 7) attached to the attachment member. If the size of the semiconductor package is the same size (c) in both the X and Y directions, the first openings 24 are formed in the same size (c) in the X and Y directions. When the semiconductor package is attached to the attachment member at intervals of pitch d in the X and Y directions, the first openings 24 are also formed at intervals of pitch d in the X and Y directions according to this. In Fig. 6A, a plurality of first openings 24 are formed in a region 26 corresponding to, for example, a 300 mm wafer.

As shown in Fig. 6(b), the resin sheet 27 mounted on the plate-like member 25 includes, for example, a plurality of second openings smaller than the first openings 24 formed in the plate-like member 25. (28) is formed. When the resin sheet 27 is mounted on the plate-like member 25, the second opening 28 is formed by overlapping the second opening 28 in the first opening 24 in a plan view. . In other words, a resin sheet having no openings is provided in the plate-shaped member 25 having a plurality of first openings 24, and the resin sheet region covering the first openings 24 has a smaller first opening 24 than the first opening 24. The resin sheet 27 is fabricated by forming the two openings 28.

The second openings 28 are formed with the same size (e) in the X and Y directions, for example. The second opening 28 is formed with the same pitch d as the first opening 24 in the X and Y directions so as to overlap the first opening 24 in plan view. Like the first opening 24, a plurality of second openings 28 are formed in the region 26 corresponding to a 300 mm wafer.

As shown in Fig. 6(c), the resin sheet 27 is attached to the plate-shaped member 25 to form the attachment member 29. The resin sheet 27 is attached to the plate-like member 25 so that the second opening 28 of the resin sheet 27 overlaps the first opening 24 of the plate-like member 25. Accordingly, a protruding portion 27a of the resin sheet 27 is formed on the outer circumferential portion of the first opening 24. The length f of the protruding portion 27a is f=(c-e)/2. As illustrated in FIG. 7, an outer periphery of the semiconductor package is attached on the protruding portion 27a, and the semiconductor package is attached to the attachment member 29.

In this case, a plate-like member 25 having a plurality of first openings 24 was used as a support base for the attachment member 29. The present invention is not limited thereto, and a frame member such as metal may be provided on the outer periphery of the plate member 25 again, and the frame member may be configured as a support base. In this case, for example, the plate-shaped member 25 and the frame-shaped member may be arranged on the same side with respect to the resin sheet 27. The resin sheet 27 is formed in a frame-shaped member having an opening larger than that of the plate-shaped member 25 by making the size of the resin sheet 27 larger than that of the plate-shaped member 25 in which the plurality of first openings 24 are formed. It may be provided, and the thickness of the frame-like member can be made thicker than the thickness of the plate-like member 25. By setting it as the attachment member of such a structure, the frame-shaped member can be used as a member for conveyance. In addition, the attachment member 29 may be configured such that a frame-shaped member made of metal is used as a support base, and a resin sheet 27 is attached to cover the inner opening of the frame-shaped member. In this case, a plurality of The opening (the second opening 28) is formed only by the resin sheet 27.

(Moving and attaching the semiconductor package)

An operation of transferring the semiconductor package from the storage table 12 to the attachment member 29 using a transfer mechanism and attaching the semiconductor package onto the resin sheet 27 of the attachment member 29 will be described with reference to FIG. 7 do.

As shown in Fig. 7(a), a semiconductor package P4 cut into pieces is arranged on the storage table 12. In this case, the semiconductor package P4 is, for example, a BGA (Ball Grid Array) package. The semiconductor package P4, which is a BGA package, has a plurality of ball electrodes 30 serving as external electrodes on the outer periphery of the substrate side (rear side). The size of the semiconductor package P4 is, for example, the same size c in both the X and Y directions. Accordingly, the semiconductor packages P4 are arranged on the storage table 12 at intervals of pitch c in the X and Y directions.

In the semiconductor package P4 (BGA package), the area where the ball electrode 30 is not formed at the outer periphery of the substrate side of the semiconductor package P4 has been reduced as the package size is reduced. As shown in Fig. 7A, the outer periphery of the semiconductor package P4 on the substrate side is represented as a distance g from the end of the ball electrode 30 to the end of the semiconductor package P4. With the miniaturization of the package size, the distance g of the outer periphery has also become extremely short.

The transfer mechanism 31 is provided with, for example, four adsorption portions 23 (23a, 23b, 23c, 23d). Each of the four adsorption units 23 is independently movable in the Z direction. In the conveyance mechanism 31, the interval (pitch) of each suction unit 23 is adjusted so that the semiconductor package P4 is equal to the pitch c arranged on the storage table 12. Next, the transfer mechanism 31 is moved above the four semiconductor packages P4 to be transferred this time. Next, the four adsorption portions 23 are lowered to adsorb the four semiconductor packages P4.

Next, as shown in FIG. 7B, the transfer mechanism 31 is moved upward from the storage table 12 to the attachment member 29 in a state in which the four semiconductor packages P4 are adsorbed. During this movement, in the transfer mechanism 31, the spacing of the respective adsorption portions 23 is changed to a pitch d in which the semiconductor packages P4 in the attachment member 29 are arranged. The transfer mechanism 31 is stopped by arranging the suction unit 23 above the second opening 28 formed in the resin sheet 27 of the attachment member 29.

Next, for example, of the four adsorption parts 23, only the adsorption part 23a is lowered, and the outer periphery of the semiconductor package P4 is attached to the protruding part 27a of the resin sheet 27. In this case, the plurality of ball electrodes 30 formed on the substrate side of the semiconductor package P4 may be accommodated in the second opening 28 of the resin sheet 27 and the first opening 24 of the plate-shaped member 25. , The outer periphery of the semiconductor package P4 is attached to the protruding portion 27a of the resin sheet 27. In this way, by attaching the semiconductor package P4 to the protruding portion 27a of the resin sheet 27, the ball electrode 30 is attached to the attaching member 29 without contacting the end portion of the plate-shaped member 25. Package (P4) can be attached. Next, after the adsorption part 23a attaches the semiconductor package P4 to the protruding part 27a of the resin sheet 27, the adsorption of the adsorption part 23a is released. Then, the adsorption portion 23a is raised to return it to its original position.

Next, as shown in Fig. 7C, the suction portion 23b is lowered to attach the outer periphery of the semiconductor package P4 to the protruding portion 27a of the resin sheet 27. Next, the suction portion 23c is lowered to attach the outer periphery of the semiconductor package P4 to the protruding portion 27a of the resin sheet 27. Finally, the suction portion 23d is lowered to attach the outer periphery of the semiconductor package P4 to the protruding portion 27a of the resin sheet 27. In this way, by sequentially lowering the four adsorption portions 23 (23a to 23d), the four semiconductor packages P are sequentially attached to the protruding portions 27a of the resin sheet 27.

By repeating this operation a plurality of times, the semiconductor package P4 is transferred from the storage table 12 to the attachment member 29 and the semiconductor package P is sequentially attached to the attachment member 29. The operation of transferring the semiconductor package P4 from the storage table 12 to the attachment member 29 using the two transfer mechanisms 31 can be performed in the same manner as in the first embodiment.

The size of the ball electrode 30 formed on the substrate side of the semiconductor package P4 varies depending on the product. In some cases, the size of the ball electrode 30 is larger than the thickness of the resin sheet 27. Further, the distance g from the outer periphery of the semiconductor package P4, that is, from the end of the ball electrode 30 to the end of the semiconductor package P4, may be extremely short. In these cases, alignment between the semiconductor package P4 and the second opening 28 of the resin sheet 27 and the first opening 24 of the plate-shaped member 25 is strict. Therefore, it is strict to accommodate the ball electrode 30 formed on the substrate side of the semiconductor package P4 in the second opening 28 of the resin sheet 27 and the first opening 24 of the plate-shaped member 25. Lose. If the position at which the semiconductor package P4 is attached is shifted, there is a concern that the ball electrode 30 may be damaged by contacting the end portion of the plate-shaped member 25. The ball electrode 30 may be damaged and damaged, thereby causing an appearance defect or a reliability defect of the semiconductor package P4.

In order to accurately insert the ball electrode 30 of the semiconductor package P4 into the second opening 28 of the resin sheet 27 and the first opening 24 of the plate-shaped member 25, the semiconductor package P4 and the resin The alignment of the second opening 28 formed in the sheet 27 and the first opening 24 of the plate-like member 25 becomes very important. Therefore, for example, by detecting the position of the semiconductor package P4, the position of the second opening 28, and the position of the first opening 24 using a camera or the like, positioning can be achieved with high precision. Equipment may be provided. Thereby, it becomes possible to attach the outer periphery of the semiconductor package P4 with the protruding part 27a of the resin sheet 27 with high precision.

Note that the method of attaching the semiconductor package of the present embodiment is almost the same as that of the first embodiment, and the different points are described in the description of the above-described configuration and operation, so the description is omitted.

(Action effect)

The cutting device 1 of the present embodiment includes a spindle 7 as a cutting mechanism for cutting a sealed substrate 2, which is a package substrate in which a plurality of semiconductor chips are resin-sealed, into a plurality of semiconductor packages P4, and a spindle 7 A storage table 12 for storing the semiconductor package P4 cut by ), and a plurality of storage tables P4 for adsorbing the semiconductor package P4 and transferring the semiconductor package P4 from the storage table 12 to the attachment member 29 A transfer mechanism 31 and at least a control unit (CTL) for controlling the operation of the transfer mechanism 31 are provided, and the plurality of transfer mechanisms 31 are provided with a plurality of adsorption units 23 whose intervals are variable. , The control unit (CTL) adjusts the distance between the plurality of adsorption units 23 in a state in which the plurality of adsorption units 23 adsorb the semiconductor package P4, and sequentially operates the plurality of transfer mechanisms 31 So that the semiconductor package P4 adsorbed by the adsorption part 23 is pushed against the attachment member 29, and the adsorption by the adsorption part 23 is released, and the adsorption part 23 is separated from the attachment member 29. Do.

In addition, in this embodiment, the attachment member 29 has a plate-shaped member 25 having a plurality of first openings 24 and a plurality of second openings 28, and the second opening 28 is the first It has a structure including a resin sheet 27 attached to the plate-like member 25 so as to correspond to the opening 24.

The method of attaching a semiconductor package of this embodiment includes a cutting process of cutting the sealed substrate 2, which is a package substrate in which a plurality of semiconductor chips are resin-sealed, into a plurality of semiconductor packages P4, and a storage table for the semiconductor package P4. The storage process of storing in (12) and the semiconductor package (P4) is adsorbed by the plurality of adsorption units (23) provided in the plurality of transfer mechanisms (31), and the semiconductor package (P4) is attached from the storage table (12). After the transfer process of transferring the member 29 to the upper side, the distance adjustment process of adjusting the distance between the plurality of adsorption units 23 in a state in which the semiconductor package P4 is adsorbed, and the distance adjustment process, a plurality of By sequentially operating the transfer mechanism 31, the semiconductor package P4 adsorbed on the adsorption part 23 is pushed against the resin sheet 27 of the attachment member 29, and adsorption by the adsorption part 23 is released. It includes an attaching step of attaching the semiconductor package P4 to the attaching member 29 by separating the portion 23 from the attaching member 29.

According to this configuration, the transfer mechanism 31 includes a plurality of adsorption portions 23 (23a to 23d), each of which has a variable distance from each other. The attachment member 29 includes a plate-shaped member 25 having a plurality of first openings 24 and a resin sheet 27 having a plurality of second openings 28. The distance between the adsorption parts 23 of the conveyance mechanism 31 is adjusted, and the adsorption parts 23 are disposed above the second opening 28 of the resin sheet 27. In this state, the outer periphery of the semiconductor package P4 is attached to the resin sheet 27 disposed on the outer periphery of the second opening 28. Thereby, a plurality of ball electrodes 30 formed on the substrate side of the semiconductor package P4 are put in the second opening 28 of the resin sheet 27 and the first opening 24 of the plate-shaped member 25, The package P4 can be attached to the attachment member 29.

According to this embodiment, the attachment member 29 is constituted by a plate-shaped member 25 having a plurality of first openings 24 and a resin sheet 27 having a plurality of second openings 28. The second opening 28 of the resin sheet 27 is smaller than the first opening 24 of the plate-shaped member 25. The resin sheet 27 is provided on the plate-like member 25 so that the second opening 28 of the resin sheet 27 overlaps the first opening 24 of the plate-like member 25. Thereby, the protruding part 27a of the resin sheet 27 is arrange|positioned in the outer peripheral part of the 2nd opening part 28. The outer periphery of the semiconductor package P4 can be attached to the protruding portion 27a. Accordingly, the plurality of ball electrodes 30 formed on the substrate side of the semiconductor package P4 can be put in the second opening 28 of the resin sheet 27 and the first opening 24 of the plate-shaped member 25.

According to the present embodiment, the plurality of ball electrodes 30 formed on the substrate side of the semiconductor package P4 are provided in the second opening 28 of the resin sheet 27 and the first opening 24 of the plate-shaped member 25. By putting inside, the semiconductor package P4 can be attached to the attachment member 29. Thereby, when the semiconductor package P4 is lowered, the ball electrode 30 comes into contact with the end of the plate-like member 25, and damage to the ball electrode 30 can be suppressed. Accordingly, it is possible to suppress the occurrence of poor appearance or reliability of the semiconductor package P4 due to the breakage of the ball electrode 30.

[Embodiment 3]

(Configuration of attachment member)

A configuration of the attachment member used in the third embodiment will be described with reference to FIG. 8. The difference from the attachment member 29 shown in the second embodiment is that in the attachment member, the sizes of the plurality of third openings formed in the plate-shaped member and the plurality of fourth openings formed in the resin sheet are the same. Configurations other than that are basically the same as those of the second embodiment, and thus description thereof is omitted.

As shown in Fig. 8A, the configuration of the storage table 12, the size of the semiconductor packages P4 arranged on the storage table 12, and the configuration of the transfer mechanism 31 are the same as those of the second embodiment. Therefore, similarly to the second embodiment, the semiconductor package P4 is a BGA package having the ball electrodes 30. The size of the semiconductor package P4 is the same size (c) in both the X and Y directions. The semiconductor packages P4 are arranged on the storage table 12 at intervals of pitch c in the X and Y directions together.

As shown in Fig. 8(b), the attachment member 32 includes a plate-shaped member 34 having a plurality of third openings 33 and a resin sheet 36 having a plurality of fourth openings 35 do. The third opening 33 of the plate-shaped member 34 and the fourth opening 35 of the resin sheet 36 have the same size. The third opening 33 and the fourth opening 35 are formed in the same size (e) in the X and Y directions. The resin sheet 36 is attached to the plate-like member 34 so that the fourth opening 35 of the resin sheet 36 overlaps the third opening 33 of the plate-like member 34. The pitch of the third opening 33 and the pitch of the fourth opening 35 are formed at the same pitch d in the X and Y directions. Therefore, in the attachment member 32, the resin sheet formed in Embodiment 2 is not formed with a protruding portion.

Transferring the semiconductor package P4 from the storage table 12 to the attachment member 32, and attaching the outer periphery of the semiconductor package P4 to the resin sheet 36 disposed at the outer periphery of the fourth opening 35 The description is omitted because it is basically the same as the second embodiment. In addition, in the third embodiment, the same effect as in the second embodiment is achieved. Further, similarly to the second embodiment, a frame-shaped member such as metal may be provided on the outer periphery of the plate-shaped member 34 again, and the frame-shaped member may be used as a support base.

[Embodiment 4]

A method of accurately attaching the semiconductor package P4 to the attachment member 29 by aligning the semiconductor package P4 to the opening of the attachment member 29 shown in Embodiment 2 will be described with reference to FIGS. 9 to 11. . Operations other than alignment are the same as those of the second embodiment, and thus explanations are omitted. In addition, in order to simplify the description here, as a basic configuration, two moving mechanisms are described in the description of a configuration in which the moving mechanism 20, the first camera 37, and the second camera 38 are each one. The prepared configuration will be described later.

(Positioning mechanism by camera)

A positioning mechanism using two cameras will be described with reference to FIG. 9. As shown in Fig. 9, the transfer mechanism 20 includes an opening of the attachment member 29 (the second opening 28 formed in the resin sheet 27 and the first opening 24 formed in the plate member 25). A first camera 37 is provided as an imaging mechanism for imaging. The transfer mechanism 20 is provided with seven suction units 23. In Figs. 9 to 10, for convenience, a case where one transfer mechanism 20 is provided will be described.

The first camera 37 is mounted in a fixed state with respect to the transfer mechanism 20. In this case, the first camera 37 is mounted at a position adjacent to the X-axis direction in which the transfer mechanism 20 moves. The first camera 37 may be attached to the transfer mechanism 20 in a fixed state, or may be attached to a position adjacent to the Y-axis direction of the transfer mechanism 20.

A second camera 38 for capturing an image of the semiconductor package P4 adsorbed by the adsorption unit 23 of the transfer mechanism 20 is provided below the transfer mechanism 20. The second camera 38 is movable in the Y direction by a driving mechanism (not shown).

(Positioning method by camera)

A method of attaching the semiconductor package P4 to the opening of the attachment member 29 with high accuracy will be described with reference to FIG. 10. As shown in Fig. 10A, the transfer mechanism 20 is moving from the upper side of the storage table 12 to the upper side of the attachment member 29 by adsorbing the semiconductor package P4 to the suction unit 23. In this case, the semiconductor package P4 is a BGA package, and a ball electrode 30 is formed on the substrate side (rear side) of the semiconductor package P4. While the transfer mechanism 20 is moving, the semiconductor package P4 is imaged from below using the second camera 38. The semiconductor package P4 is imaged to acquire positional data of the semiconductor package P4.

Next, as shown in Fig. 10(b), the first camera 37 attached to the transfer mechanism 20 from above the attachment member 29 is the opening of the attachment member 29 (resin sheet 27 The second opening 28 formed in) or the first opening 24 formed in the plate-shaped member 25 is captured. The opening of the attachment member 29 is imaged to obtain positional data of the opening. The opening of the attachment member 29 imaged by the first camera 37 should be at least one of the first opening 24 formed in the plate-shaped member 25 and the second opening 28 formed in the resin sheet 27. I can.

The ball electrode 30 formed on the substrate side of the semiconductor package P4 is put into the second opening 28 of the resin sheet 27 and the first opening 24 of the plate-shaped member 25, and the semiconductor package P4 ) Is required to be attached to the attachment member 29. The ball electrode 30 may be damaged by contacting the end of the plate-shaped member 25 with the ball electrode 30. Therefore, it is important to accurately align the semiconductor package P4 with the first opening portion 24 formed in the plate-like member 25.

The position data of the semiconductor package P4 imaged by the second camera 38 and the positional data of the opening of the attachment member 29 imaged by the first camera 37 are all of the control unit (CTL) of the cutting device 1 ) (See Fig. 1). The control unit CTL aligns the semiconductor package P4 with the opening of the attachment member 29 based on the positional data of the semiconductor package P4 and the positional data of the opening of the attachment member 29. In this way, by performing alignment using two cameras, the semiconductor package P4 can be accurately attached to the opening of the attachment member 29. Accordingly, the ball electrode 30 formed on the substrate side of the semiconductor package P4 can be reliably inserted into the second opening 28 of the resin sheet 27 and the first opening 24 of the plate-like member 25. .

The alignment between the semiconductor package P4 and the opening of the attachment member 29 is specifically performed in the X direction of the transfer mechanism 20 and the Y direction of the attachment table 18 on which the attachment member 29 is placed. It is done by the movement of. In the attachment table 18, since the attachment member 29 is positioned together in the X and Y directions by the alignment mechanism 19 (see Fig. 1), the opening of the semiconductor package P4 and the attachment member 29 Alignment of the wah can be performed with high precision. Accordingly, the semiconductor package P4 can be accurately attached to the opening of the attachment member 29. Further, if necessary, a rotation mechanism for rotating the mounting table 18 may be provided.

In addition, imaging of the opening of the attachment member 29 by the first camera 37 and the imaging of the semiconductor package P4 by the second camera 38 are performed by the suction unit 23 of the transfer mechanism 20. It may be after the semiconductor package P4 is adsorbed and before the semiconductor package P4 is attached to the attachment member 29. Regarding the order of these imaging, imaging by the second camera 38 may be performed after imaging by the first camera 37, or by the second camera 38 before imaging by the first camera 37. Imaging may be performed.

For example, as shown in FIG. 4, the case where two transfer mechanisms 20 are provided is demonstrated. When two transfer mechanisms 20 are provided, a total of two first cameras 37a and 37b and second cameras 38a and 38b may be provided in correspondence with each of the transfer mechanisms 20a and 20b on both sides. , You may provide the common 1st camera 37 and the 2nd camera 38 one by one to both the transfer mechanisms 20a, 20b. When the first camera 37 and the second camera 38 are common to the two transfer mechanisms 20a, 20b, the first camera 37 is fixed to one of the two transfer mechanisms 20a, 20b. It may be mounted in a state and a configuration capable of moving the second camera 38 in the Y-axis direction in FIG. For example, one first camera 37 acquires the imaging data of the openings of the attachment members 29 corresponding to the two transfer mechanisms 20a, 20b, and based on the imaging data, the two transfer mechanisms It is sufficient to generate coordinate data of the opening of the attachment member 29 corresponding to (20a, 20b). Here, as the order of acquisition of the image data by the first camera 37 and the second camera 38, for example, the image pickup of the semiconductor package P4 adsorbed by the transfer mechanism 20a by the second camera 38 , Image of the opening of the attachment member 29 corresponding to the transfer mechanism 20a, 20b by the first camera 37, the semiconductor package P4 adsorbed by the transfer mechanism 20b by the second camera 38 It is also possible to use the order of imaging.

(Configuration of infrared camera)

The configuration of the first camera 37 shown in FIG. 10 will be described with reference to FIG. 11. As shown in FIG. 11, the first camera 37 includes, for example, an infrared light source 39, a beam splitter 40, and an infrared imaging device 41. The beam splitter 40 is an optical member for making the incident light 42b and the reflected light 43 coaxial as will be described later. As this optical member, what is necessary is just to make the incident light 42b and the reflected light 43 coaxial by reflecting the infrared light 42a and transmitting the reflected light 43, such as a beam splitter or a half mirror. The first camera 37 is an infrared camera using so-called coaxial illumination. In addition, the infrared light source 39 may be a light source that emits light in an infrared region capable of being imaged by the infrared imaging element 41 as at least a part, and does not mean only a light source that emits light only in the infrared region.

(Method of imaging with an infrared camera)

Referring to FIG. 11, a method of imaging the first opening portion 24 formed in the plate-like member 25 of the attachment member 29 using the first camera 37 will be described. First, the infrared light 42a is irradiated from the infrared light source 39 toward the beam splitter 40 in the -X direction. The infrared light 42a irradiated from the infrared light source 39 changes its traveling direction by 90 degrees by the beam splitter 40 and proceeds in the -Z direction.

The infrared light 42b whose traveling direction is changed in the -Z direction by the beam splitter 40 enters the resin sheet 27. When the resin sheet 27 is formed of, for example, polyimide resin, the resin sheet 27 is colored yellow. The infrared light 42b passes through the resin sheet 27 colored in yellow. As a result, the infrared light 42b enters the flat surface of the metal plate-shaped member 25 in the -Z direction and generates a reflected light 43 that is reflected in the +Z direction. The reflected light 43 reflected by the plate-shaped member 25 passes through the beam splitter 40 and enters the infrared imaging device 41. The position of the plate-shaped member 25 is recognized by the reflected light 43 incident on the infrared imaging element 41. Therefore, the position of the first opening portion 24 formed in the plate-shaped member 25 can be specified with high precision. Accordingly, it is possible to accurately align the semiconductor package P4 with the first opening portion 24 formed in the plate-shaped member 25. Accordingly, the semiconductor package P4 can be accurately attached to the opening portion of the attachment member 29. The ball electrode 30 formed on the substrate side of the semiconductor package P4 can be reliably placed in the second opening 28 of the resin sheet 27 and the first opening 24 of the plate-like member 25.

(Action effect)

According to this embodiment, the 1st camera 37 for imaging the opening part of the attachment member 29 is attached to the conveyance mechanism 20. A second camera 38 for capturing an image of the semiconductor package P4 adsorbed by the suction unit 23 of the transfer mechanism 20 is provided below the transfer mechanism 20. Based on the position data of the semiconductor package P4 imaged by the second camera 38 and the position data of the opening of the attaching member 29 imaged by the first camera 37, the opening of the attachment member 29 is On the other hand, the semiconductor package P4 is aligned. By performing alignment, the semiconductor package P4 can be accurately attached to the opening portion of the attachment member 29. Thereby, the ball electrode 30 formed on the substrate side of the semiconductor package P4 can be put in the second opening 28 of the resin sheet 27 and the first opening 24 of the plate-shaped member 25. Therefore, it is possible to suppress the contact of the ball electrode 30 to the end portion of the plate-shaped member 25 and to suppress damage to the ball electrode 30.

According to the present embodiment, the first camera 37 includes an infrared light source 39, a beam splitter 40 that is an optical member, and an infrared imaging element 41. The infrared light 42a irradiated from the infrared light source 39 is changed in the traveling direction by 90 degrees by the beam splitter 40, and the infrared light 42b is made to enter the resin sheet 27. The infrared light 42b transmits through the resin sheet 27 colored in yellow and is reflected on the surface of the metal plate-shaped member 25 to generate the reflected light 43. The reflected light 43 reflected by the plate-shaped member 25 passes through the beam splitter 40 and enters the infrared imaging device 41. Thereby, the infrared imaging device 41 can recognize the position of the plate-shaped member 25 with high precision. Accordingly, it is possible to accurately align the semiconductor package P4 with the first opening portion 24 formed in the plate-shaped member 25. Thereby, the contact of the ball electrode 30 to the end of the plate-shaped member 25 can be suppressed, and damage to the ball electrode 30 can be suppressed.

[Embodiment 5]

(Manufacturing method of electronic components)

A method of manufacturing an electronic component for manufacturing an electronic component by forming an electronic shield film on the semiconductor package P4 attached to the attachment member 29 shown in the second embodiment will be described with reference to FIG. 12.

As shown in Fig. 12(a), the attachment member 29 taken out from the cutting device 1 is mounted on, for example, the sample stand 45 of the sputtering device 44. In this state, the ball electrode 30 formed on the substrate side of the semiconductor package P4 is put in the second opening 28 of the resin sheet 27 and the first opening 24 of the plate-like member 25. . Accordingly, the top and four surfaces of the semiconductor package P4 are exposed, but the ball electrode 30 formed on the substrate side (rear side) of the semiconductor package P4 is not exposed.

Next, as shown in Fig. 12B, in the sputtering apparatus 44, a metal film 46 as a conductive film is formed on the plurality of semiconductor packages P4 attached to the attachment member 29. As shown in FIG. As a result, the metal film 46 is formed on the front surface side of the semiconductor package P4, that is, the top surface and the fourth surface, which are the exposed surfaces of the semiconductor package P4, but the metal film 46 is formed on the back surface side of the semiconductor package P4. Do not go back Therefore, the ball electrodes 30 are not short-circuited by the metal film 46 being inserted between the ball electrode 30 and the ball electrode 30 formed on the back side of the semiconductor package P4. The ball electrode 30 is protected as it is in its original state.

The metal film 46 is formed on the top and four surfaces of the semiconductor package P4, but the gap between the semiconductor package P4 and the semiconductor package P4 is very narrow, and the metal film 46 is hardly formed. Further, even if the metal film 46 is formed, it becomes a very thin metal film. In addition, it is preferable to apply a formation condition in which the metal film 46 is hardly formed between the semiconductor package P4 and the semiconductor package P4. As the metal film 46, for example, copper (Cu), aluminum (Al), nickel (Ni), or the like is used. By forming the metal film 46 on the front side (top and four surfaces) of the semiconductor package P4, the semiconductor package P4 corresponding to the product can be electronically shielded by the metal film 46.

In this case, a metal film 46 was formed on the semiconductor package P4 attached to the attachment member 29 by sputtering. This is not limited to this, and methods of forming metal films include physical vapor deposition (PVD method: Physical Vapor Deposition), chemical vapor deposition (CVD method: Chemical Vapor Deposition), plating method, screen printing such as vacuum deposition method and ion plating method. Law, etc. can be used. Even in the case of using these methods, it is preferable to apply formation conditions in which a metal film is hardly formed between the semiconductor package P4 and the semiconductor package P4. In addition to the metal film, a conductive film having conductivity, such as a porous film having conductivity and a resin film having conductivity, may be used.

Next, as shown in Fig. 12(c), the attachment member 29 is taken out from the sputtering device 44. The attachment member 29 having the metal film 46 formed on the semiconductor package P4 is temporarily mounted on the table 47.

Next, as shown in Fig. 12(d), the semiconductor packages P4 attached to the resin sheet 27 (protruding portion 27a) of the attachment member 29 are taken out from the attachment members 29, respectively. For example, the semiconductor package P4 is taken out from the attachment member 29 by lifting the semiconductor package P4 from the back side. At this time, since the metal film 46 formed between the semiconductor package P4 and the semiconductor package P4 is very thin, the semiconductor package P4 is automatically separated and taken out from the metal film 46 in that part. can do. The semiconductor package P4 having the metal film 46 taken out in this way becomes the electronic component 48 having the electronic shield film. Accordingly, the electronic component 48 can reduce radiated noise and incident noise by the metal film 46.

Further, since the metal film 46 formed between the semiconductor package P4 and the semiconductor package P4 is very thin, the semiconductor package P4 can be automatically separated and taken out from the portion. It is not limited to this, and is formed between the semiconductor package P4 and the semiconductor package P4 using, for example, a laser or a rotating blade, before taking out the semiconductor package P4 from the attachment member 29. It is also possible to remove the thin metal film 46 in advance.

(Action effect)

According to this embodiment, the metal film 46 which is a conductive film is formed collectively on the plurality of semiconductor packages P4 attached to the attachment member 29. The metal film 46 is formed on the top and four surfaces of the semiconductor package P4, but the metal film 46 does not return to the ball electrode 30 formed on the back side of the semiconductor package P4. The ball electrode 30 on the back side of the semiconductor package P4 is put in the second opening 28 of the resin sheet 27 and the first opening 24 of the plate-shaped member 25, and the ball electrode 30 Do not expose this. Accordingly, the metal film 46 serving as the shielding film can be collectively formed on the top and four surfaces of the semiconductor package P4. Accordingly, it is possible to efficiently produce the electronic component 48 having an electronic shielding film.

According to the present embodiment, a plurality of semiconductor packages P4 are arranged so that the gap between the semiconductor package P4 and the semiconductor package P4 is narrowed. As a result, the metal film 46 is formed on the top and four surfaces of the semiconductor package P4, but the metal film is hardly formed between the semiconductor package P4 and the semiconductor package P4. Therefore, when the semiconductor package P4 is taken out from the attachment member 29, the semiconductor package P4 can be automatically separated and taken out from the metal film in that portion. Therefore, the process of manufacturing the electronic component 48 having the electronic shield film can be reduced, and the manufacturing cost can be reduced.

In each embodiment, as the package substrate, the case of cutting the package substrate having a rectangular shape has been shown. This is not limited to this, and the contents described so far can be applied even when cutting a package substrate having a substantially circular shape such as a semiconductor wafer.

As described above, the cutting device of the embodiment includes a cutting mechanism for cutting a package substrate having a plurality of semiconductor chips resin-encapsulated into a plurality of semiconductor packages, a storage table for storing the semiconductor packages cut by the cutting mechanism, and a semiconductor package. A plurality of transfer mechanisms for adsorbing and transferring the semiconductor package from the storage table to the attachment member, and at least a control unit for controlling the operation of the transfer mechanism, the plurality of transfer mechanisms have a plurality of adsorption units, and the control unit includes a plurality of adsorption units. In a state in which the semiconductor package is adsorbed, a plurality of transfer mechanisms are sequentially operated to push the semiconductor package adsorbed on the adsorption part to the attachment member, release the adsorption by the adsorption part, and control to separate the adsorption part from the attachment member. Are doing.

According to this configuration, after the package substrate is cut into a plurality of semiconductor packages, productivity can be improved in attaching the semiconductor package to the attachment member.

Further, in the cutting device of the above embodiment, the plurality of adsorption units have a variable distance between each other, and the control unit adjusts the distance between the plurality of adsorption units while the plurality of adsorption units adsorb the semiconductor package, and sequentially operates the plurality of transfer mechanisms. The semiconductor package adsorbed by the adsorption unit is pushed to the attachment member by operating in the same manner as to release the adsorption by the adsorption unit, and the adsorption unit is separated from the attachment member.

According to this configuration, the positional accuracy of the semiconductor package attached to the attachment member can be improved.

In addition, in the cutting apparatus of the above embodiment, the attachment member has a structure including a frame-shaped member and a resin sheet attached to the frame-shaped member so as to cover the inner opening of the frame-shaped member.

According to this configuration, the weight of the attachment member can be reduced. Therefore, it is possible to easily convey the attachment member.

Further, in the cutting apparatus of the above embodiment, the attachment member has a plate-shaped member having a plurality of first openings, a plurality of second openings, and a resin sheet attached to the plate-shaped member so that the second openings correspond to the first openings. It has a configuration including. Here, the size of the first opening and the second opening may be the same, or the size of the first opening may be larger than the size of the second opening.

According to this configuration, for example, the protruding electrode of the semiconductor package can be put in the second opening portion of the resin sheet and the first opening portion of the plate-shaped member. Thereby, damage to the protruding electrode can be suppressed. Accordingly, it is possible to suppress the occurrence of poor appearance or reliability of the semiconductor package due to damage of the protruding electrode.

Further, the cutting device of the above embodiment has a configuration including an alignment mechanism for aligning the attachment member with the attachment table or a positioning mechanism for positioning.

According to this configuration, the attachment members can be accurately arranged or positioned on the attachment table and mounted.

In addition, in the cutting device of the above embodiment, the transfer mechanism is provided with a first camera for capturing the first opening or the second opening, and a second camera for capturing the semiconductor package adsorbed to the suction unit from below. Are doing.

According to this configuration, it is possible to accurately align the semiconductor package with the opening of the attachment member. Therefore, it is possible to suppress the protrusion-shaped electrode from coming into contact with the end of the plate-shaped member, and to suppress damage to the protrusion-shaped electrode.

In addition, in the cutting device of the above embodiment, the first camera transmits the infrared light source, the infrared imaging element, and the incident light incident on the plate-shaped member through the resin sheet from the infrared light source and the reflected light reflected by the plate-shaped member. It is set as the structure provided with the optical member for making it coaxial.

According to this configuration, it is possible to accurately align the semiconductor package with the first opening portion formed in the plate-like member of the attachment member. Therefore, it is possible to suppress the protrusion-shaped electrode from coming into contact with the end of the plate-shaped member, and to suppress damage to the protrusion-shaped electrode.

In addition, in the cutting device of the above embodiment, the semiconductor package has a configuration including a resin portion and a plurality of protruding electrodes.

According to this configuration, the semiconductor package can be attached to the attachment member without damaging the protruding electrode of the semiconductor package.

The method of attaching a semiconductor package of the above embodiment includes a cutting process of cutting a package substrate having a plurality of semiconductor chips resin-sealed into a plurality of semiconductor packages, a storage process of storing the semiconductor package on a storage table, and transferring a plurality of semiconductor packages. A transfer process in which the semiconductor package is adsorbed by a plurality of adsorption units provided in the mechanism to transfer the semiconductor package from the storage table to the upper side of the attachment member, and the semiconductor package adsorbed by the adsorption unit is pushed against the attachment member by sequentially operating the plurality of transfer mechanisms. And attaching the semiconductor package to the attachment member by releasing adsorption by the adsorption unit and separating the adsorption unit from the attachment member.

According to this method, after cutting the package substrate into a plurality of semiconductor packages, the semiconductor package is attached to the attachment member, so that the productivity can be improved.

In addition, the method of attaching a semiconductor package of the above embodiment further includes a gap adjusting step of adjusting a gap between the plurality of suction portions in a state in which the semiconductor package is adsorbed, and an attaching step is performed after the gap adjusting step.

According to this method, the positional accuracy of the semiconductor package attached to the attachment member can be improved.

Further, in the method of attaching the semiconductor package of the above embodiment, the resin sheet is attached to the attaching member so as to cover the opening inside the frame-like member, and the semiconductor package is attached to the resin sheet in the attaching step.

According to this method, the weight of the attachment member can be reduced. Therefore, it is possible to easily convey the attachment member.

In addition, in the method of attaching the semiconductor package of the above embodiment, the attachment member has a plate-shaped member having a plurality of first openings, a plurality of second openings, and is attached to the plate-shaped member so that the second openings correspond to the first openings. The prepared resin sheet is provided, and in the attaching step, the semiconductor package is attached on the resin sheet disposed on the outer periphery of the second opening.

According to this method, for example, the protruding electrode of the semiconductor package can be put in the second opening portion of the resin sheet and the first opening portion of the plate-shaped member. Thereby, damage to the protruding electrode can be suppressed. Accordingly, it is possible to suppress the occurrence of poor appearance or reliability of the semiconductor package due to the breakage of the protruding electrode.

In addition, in the method of attaching the semiconductor package of the above embodiment, after the semiconductor package is adsorbed by the adsorption unit in the transfer step, and before attaching the semiconductor package to the attaching member in the attaching step, the semiconductor package adsorbed to the adsorption unit is removed from below. It includes a first imaging process for imaging and a second imaging process for imaging the first opening or the second opening from above, and the attaching process includes imaging data of the semiconductor package imaged in the first imaging process and imaging in the second imaging process. And a step of aligning the semiconductor package with respect to the first opening or the second opening based on the captured data of the first opening or the second opening.

According to this method, it is possible to accurately align the semiconductor package with the opening of the attachment member. Therefore, it is possible to suppress the protrusion-shaped electrode from coming into contact with the end of the plate-shaped member, and to suppress damage to the protrusion-shaped electrode.

Further, in the method of attaching a semiconductor package according to the above embodiment, the semiconductor package includes a resin portion and a plurality of protruding electrodes.

According to this method, the semiconductor package can be attached to the attachment member without damaging the protruding electrode of the semiconductor package.

Further, in the method of manufacturing an electronic component, a conductive film is formed on the semiconductor package attached to the attaching member by the attaching method of the semiconductor package of the above embodiment.

According to this method, a conductive film can be formed on the top and four surfaces of the semiconductor package. Therefore, the semiconductor package can be electronically shielded by the conductive film.

Although the embodiment of the present invention has been described, it should be considered that the embodiment disclosed this time is illustrative and not restrictive in all respects. The scope of the present invention is indicated by the claims, and it is intended that the meanings equivalent to the claims and all changes within the scope are included.

1: cutting device 2: sealed substrate (package substrate)
3: package substrate supply unit 4: cutting table
5: moving mechanism 6: rotating mechanism
7: spindle (cutting mechanism) 8: rotating blade
9: inspection table 10: cut board
11: inspection camera 12: storage table
13: attachment member supply part 14: opening (opening)
15 frame member 16 resin sheet
17: attachment member 18: attachment table
19: alignment mechanism 20, 20a, 20b: transfer mechanism
21: vacuum pump 22: suction hole
23, 23a, 23b, 23c, 23d, 23e, 23f, 23g: adsorption unit
24: first opening 25, 34: plate-shaped member
26: regions 27, 36: resin sheet
27a: protruding portion 28: second opening
29, 32: attachment member 30: ball electrode
31: transfer mechanism 33: third opening (first opening)
35: fourth opening (second opening) 37, 37a, 37b: first camera
38, 38a, 38b: second camera 39: infrared light source
40: beam splitter (optical member) 41: infrared imaging element
42a: infrared light 42b: infrared light (incident light)
43: reflected light 44: sputtering device
45: sample stand 46: metal film (conductive film)
47: table 48: electronic components
A: Supply module B: Cutting module
C: Inspection module D: Attachment module
P, P0, P1, P2, P3, P4: semiconductor package
CTL: control unit CL: center line
R1, R2: Transfer rail L: Distance from center line
G1, G2, G3,… , G14, G15: Group a, c, e: size
a, b, c, d: pitch f: length
g: distance

Claims (17)

A cutting tool for cutting a package substrate having a plurality of semiconductor chips sealed with a resin into a plurality of semiconductor packages,
A storage table for storing the semiconductor package cut by the cutting tool,
A plate-shaped member having a plurality of first openings, a plurality of second openings, and the second openings are attached to the plate-shaped member so as to correspond to the first openings from the storage table by adsorbing the semiconductor package. A plurality of transfer mechanisms for transferring the semiconductor package to an attachment member having a resin sheet,
A first camera for photographing the first opening provided in the transfer mechanism,
And at least a control unit for controlling the operation of the transfer mechanism,
The plurality of transfer mechanisms include a plurality of adsorption units,
The first camera coaxially includes an infrared light source, an infrared imaging element, incident light incident on the plate-shaped member from the infrared light source through the resin sheet, and reflected light reflected by the plate-shaped member. It has an optical member for,
The control unit is configured by sequentially operating the plurality of transfer mechanisms in a state in which the plurality of adsorption units adsorb the semiconductor package, and the image data of the semiconductor package adsorbed to the adsorption unit, and the infrared imaging element. Based on the image data of the first opening to be imaged, the semiconductor package is positioned with respect to the first opening, and the semiconductor package adsorbed by the adsorption unit is pushed against the attachment member and adsorbed by the adsorption unit. A cutting device, characterized in that control is performed to release the suction unit and to separate the suction unit from the attachment member. The method of claim 1,
The plurality of adsorption units, the distance between each other is variable,
The control unit is configured to adjust the distance between the plurality of adsorption units in a state in which the plurality of adsorption units adsorb the semiconductor package, and sequentially operate the plurality of transfer mechanisms, so that the semiconductor package adsorbed to the adsorption unit is A cutting device comprising: pressing against the attachment member, releasing adsorption by the adsorption unit, and performing control to separate the adsorption unit from the attachment member. The method of claim 1,
A cutting device comprising: an alignment mechanism for aligning the attachment member to the attachment table or a positioning mechanism for positioning. The method of claim 1,
A cutting device, characterized in that a second camera is provided for photographing the semiconductor package adsorbed by the suction unit from below. The method of claim 1,
A cutting device, characterized in that, while providing two transfer mechanisms, the first camera is disposed in one of the two transfer mechanisms, and one of the first cameras is common to two of the transfer mechanisms. The method according to any one of claims 1 to 5,
The semiconductor package is a cutting apparatus comprising a resin portion and a plurality of protruding electrodes. The method according to any one of claims 1 to 5,
The cutting device, wherein the resin sheet contains a polyimide film. The method of claim 6,
The cutting device, wherein the resin sheet contains a polyimide film. A cutting process of cutting the package substrate in which the plurality of semiconductor chips are resin-sealed into a plurality of semiconductor packages,
A storage process of storing the semiconductor package on a storage table,
A plate-shaped member having a plurality of first openings, a plurality of second openings, and the second opening by adsorbing the semiconductor package by a plurality of suction units provided in a plurality of conveying mechanisms to hold the semiconductor package from the storage table A transfer step of transferring to an upper side of an attachment member having a resin sheet attached to the plate-shaped member so as to correspond to the first opening,
An opening portion imaging step of imaging the first opening from above by a first camera,
The semiconductor package by sequentially operating the plurality of transfer mechanisms to push the semiconductor package adsorbed on the adsorption unit to the attachment member to release adsorption by the adsorption unit, and to separate the adsorption unit from the attachment member, Including an attachment process of attaching the package to the attachment member,
In the opening imaging process, the first camera receives an infrared light source, an infrared imaging device, and incident light incident on the plate-like member from the infrared light source through the resin sheet, and reflected light reflected by the plate-like member. It has an optical member to make it coaxial,
In the attaching step, the semiconductor package is positioned with respect to the first opening based on the image data of the semiconductor package and the image data of the first opening that is imaged by the infrared imaging device in the opening image capturing step. How to attach a semiconductor package The method of claim 9,
Further comprising a gap adjustment step of adjusting a gap between the plurality of adsorption units in a state in which the semiconductor package is adsorbed,
A method of attaching a semiconductor package, wherein the attaching step is performed after the interval adjusting step. The method of claim 9,
In the attaching process, the semiconductor package is attached to the resin sheet. The method of claim 9,
After adsorbing the semiconductor package by the adsorption unit in the transfer process, and before attaching the semiconductor package to the attachment member in the attaching process, a semiconductor package for photographing the semiconductor package adsorbed by the adsorption unit from below A method of attaching a semiconductor package, further comprising an imaging process. The method of claim 9,
A method for attaching a semiconductor package, characterized in that two transfer mechanisms are provided, the first camera is disposed in one of them, and one of the first cameras is common to two of the transfer mechanisms. The method of claim 12,
The semiconductor package attaching method, wherein the semiconductor package includes a resin portion and a plurality of protruding electrodes. The method of claim 9,
The method of attaching a semiconductor package, wherein the resin sheet contains a polyimide film. A method for manufacturing an electronic component, comprising forming a conductive film on the semiconductor package in a state attached to the attachment member by the method for attaching the semiconductor package according to any one of claims 9 to 15. delete

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