JP4715301B2 - Element transfer device, element transfer method, and display device manufacturing method - Google Patents

Description

  The present invention embeds an element attached to an adhesive layer formed on a first substrate in an uncured resin layer formed on a second substrate, so that the element is connected to the second substrate from the first substrate side. TECHNICAL FIELD The present invention relates to a transfer device, a transfer method, and a display device manufacturing method, in which parallel transfer between substrates is easy.

  The element attached to the adhesive layer formed on the first substrate is embedded in an uncured resin layer formed on the second substrate, thereby transferring the element from the first substrate side to the second substrate side. Techniques are known (see, for example, Patent Documents 1 and 2). In this embedded transfer technology, the first substrate and the second substrate are made parallel as much as possible, the first substrate and the second substrate are brought close to each other while maintaining the parallel state, and only elements on the first substrate are attached to the second substrate. By uniformly contacting the formed resin layer, the element is transferred from the first substrate side to the second substrate side.

  At this time, if the first substrate and the second substrate are in direct contact with each other due to poor parallelism between the first substrate and the second substrate, the adhesive layer of the first substrate and the uncured resin layer of the second substrate Adheres, making it difficult to separate the first substrate from the second substrate. If it is peeled off forcibly, the uncured resin layer of the second substrate will be damaged, and the transfer quality will be remarkably deteriorated.

  For this reason, in the embedded transfer, it is important to have paralleling accuracy in which the first substrate and the second substrate are parallel to each other.

  The conventional method of parallelism between two substrates is a method in which the substrates are directly pressed against each other so that one substrate follows the other, or the dimensional accuracy between two substrates is extremely high. In other words, a method in which a substrate is pressed between high spherical spacers has been employed (for example, see Non-Patent Documents 1 and 2). However, the direct pressing method is inappropriate as described above. Also, the method of pressing with a spherical spacer is also unsuitable because there is no place to insert the spacer when the transfer area of the second substrate is larger than the first substrate.

JP 2004-273596 A JP 2004-281630 A Bond aligner BA6, [online], 2002, SUSS Microtech Co., Ltd., homepage, site map, product introduction, substrate bonder / aligner, BA6 bond aligner, [March 31, 2005 search], Internet <URL: http : //www.suss.jp/html/ba6.html> SUSS Microtech Co., Ltd. (formerly Carl Sousse Japan Co., Ltd.) “Board Bonder / Aligner, BA6 Bond Aligner Brochure” 2002

  The problem to be solved is that the element attached to the adhesive layer formed on the first substrate is buried in an uncured resin layer formed on the second substrate, so that the element is placed on the first substrate side. In the technique of transferring from the first substrate to the second substrate side, the first substrate and the second substrate cannot be paralleled without contacting the first substrate and the second substrate.

Element transfer apparatus of the present invention includes a first substrate supporting portion where the first substrate is mounted, a second substrate support portion for supporting the second substrate disposed to face the first substrate, the first substrate When such a second substrate is parallel, the tilt unit for adjusting the position of the first substrate supporting portion, a movable stage for moving the Oh cage portion supporting and, the distance between the first substrate and the second substrate And the tilting part has three actuators that are located at the apex of the triangle and each move up and down the first substrate support part, and are orthogonal to each other at the distal end side of the movable part of the actuator. A pivot shaft and a pivot shaft are provided, and the pivot adjustment shaft and the pivot shaft allow the first substrate support portion to rotate and swing as the actuator is moved up and down to adjust the position of the first substrate support portion. It is characterized by performing .

  In the element transfer apparatus, by providing the tilt portion, the first substrate can be arranged in parallel to the second substrate by finely adjusting the tilt of the first substrate. Further, by providing a movable stage for moving the tilt part, it is possible to move the first substrate supported on the movable stage via the tilt part and the first substrate support part to a desired position directly below the second substrate. become. Further, by providing a measurement unit that measures the distance between the first substrate and the second substrate in a non-contact manner between the first substrate and the second substrate, an adhesive layer is formed on the opposing surfaces of both substrates. However, the measuring part does not come into contact with the adhesive layer.

The element transfer method of the present invention is an element transfer method in which an element bonded to a first substrate is bonded to an adhesive layer formed on a second substrate, and the first substrate and the second substrate are respectively supported by the first substrate. parts and is supported by the second substrate supporting unit, and the substrate approaching step of approximating, as the first substrate and on the basis of the measured values obtained by measuring the distance between the first substrate and the second substrate and the second substrate is parallel comprising parallel out step of adjusting, and the first substrate and the element bonding step of bonding the first substrate and the second substrate is brought closer to element in contact adhesive layer in a state where parallel is maintained between the second substrate In the paralleling step, there are three actuators for raising and lowering the first substrate support portion, and a tilt portion having a rotation axis and a swing axis provided at the distal end side of the movable portion of the actuator. , The pivot shaft and the swing shaft And it allows the rotation and swinging of the first substrate supporting portion due to the vertical movement of the motor, characterized in <br/> to perform the positional adjustment of the first substrate supporting section.

  In the element transfer method, after the first substrate and the second substrate are brought close to each other, the first substrate and the second substrate become parallel based on a measurement value obtained by measuring the distance between the first substrate and the second substrate. By adjusting as described above, the first substrate can be arranged in parallel to the second substrate. Therefore, the element bonded to the first substrate in a non-contact state between the first substrate and the second substrate is bonded to the adhesive layer formed on the second substrate.

According to a method for manufacturing a display device of the present invention, in a method for manufacturing a display device in which a plurality of light emitting elements are arranged and mounted by bonding a light emitting element bonded to a first substrate to an adhesive layer formed on a second substrate. In the method of bonding an element bonded to one substrate to an adhesive layer formed on a second substrate , the first substrate and the second substrate are supported by the first substrate support portion and the second substrate support portion, respectively , and are brought close to each other. a substrate approaching step, parallel out step in which the first substrate and on the basis of the measured values obtained by measuring the distance between the first substrate and the second substrate and the second substrate is adjusted to be parallel, and the first substrate and the second and a device bonding process to a state where parallel is maintained with the substrate is brought closer to the first substrate and the second substrate is bonded to the contact adhesive layer element, in parallel-out step, lifting the first substrate supporting section It has three actuators to perform the operation and Using a tilting portion having a rotation axis and a swinging shaft that are orthogonal to each other provided on the distal end side of the moving portion, the first substrate support portion is rotated by the rotation shaft and the swinging shaft as the actuator moves up and down. Further, the position adjustment of the first substrate support portion is performed while allowing the swing .

  In the manufacturing method of the display device, since the element bonded to the first substrate by the element transfer method of the present invention is bonded to the second substrate serving as the substrate of the display device, the same operation as the above-described element transfer method is achieved. can get. That is, since the first substrate can be arranged in parallel to the second substrate, the element bonded to the first substrate in a non-contact state between the first substrate and the second substrate is formed on the second substrate. Is adhered to the adhesive layer.

  Since the element transfer apparatus according to the present invention includes the movable stage, the first substrate can be easily moved to a desired position directly below the second substrate, and since the tilt portion is provided, the first substrate and the second substrate are provided. Can be easily arranged in parallel, and the distance between the first substrate and the second substrate can be measured in a non-contact manner by providing a measurement unit that performs non-contact measurement. The element attached to the first substrate can be pressed in parallel to the second substrate side. At this time, since the first substrate and the second substrate are parallel, the substrates do not contact each other. For this reason, there is an advantage that the element on the first substrate side can be pressed against the second substrate side without damaging the second substrate. Therefore, the yield in the element transfer technology can be improved.

  In the element transfer method of the present invention, after the first substrate and the second substrate are brought close to each other, the first substrate and the second substrate are parallel to each other based on a measurement value obtained by measuring the distance between the first substrate and the second substrate. Therefore, the first substrate and the second substrate can be easily arranged in parallel. In addition, it is possible to press the element attached to the first substrate in parallel to the second substrate side in a state where the parallelism between the first substrate and the second substrate is maintained. At this time, since the first substrate and the second substrate are parallel, the substrates do not contact each other. For this reason, there is an advantage that the element on the first substrate side can be pressed against the second substrate side without damaging the second substrate. Therefore, the yield in the element transfer technology can be improved.

  In the method for manufacturing a display device of the present invention, when the element on the first substrate side is transferred to the second substrate side, the first substrate and the second substrate are held in parallel. There is no. For this reason, there is an advantage that the element on the first substrate side can be pressed against the second substrate side without damaging the second substrate. Therefore, it is possible to improve the yield when manufacturing the display device using the element transfer technique.

  An adhesive layer (for example, an uncured resin layer) formed on the second substrate by holding the element on which the element is mounted in parallel with the second substrate on which the element is transferred is held in parallel. ) Is realized by finely adjusting the parallelism between the substrates at the tilt portion while measuring the distance between the substrates at the measurement portion. Details thereof will be described below.

  An example of one embodiment of the element transfer apparatus of the present invention will be described with reference to the schematic configuration diagram of FIG. 1, the enlarged view of the main part of FIG. 2, and the plan layout diagram of FIG.

  As shown in FIGS. 1 to 3, the element transfer apparatus 1 includes a first substrate support unit 11 on which a first substrate 51 is placed, and a second substrate 52 disposed so as to face the first substrate 51. A second substrate support portion 12 that supports the first substrate support portion 11, a tilt portion 21 that adjusts the position of the first substrate support portion 11 so that the first substrate 51 and the second substrate 52 are parallel, and the tilt portion 21. And a movable stage 31 that can move in the x, y, z, and θ directions, and a measurement unit 41 that measures the distance between the first substrate 51 and the second substrate 52.

  The movable stage 31 includes, for example, a coarse movement stage 32 and a fine movement stage 33. The coarse movement stage 32 is basically a stage that can be moved quickly in a long distance (for example, about several tens of cm to 2 m) in, for example, the x, y, z, and θ directions. As a result, the first substrate 51 can be loaded, unloaded and moved to the tiling location at high speed. The fine movement stage 33 is basically a stage capable of fine movement over a short distance (for example, about several μm to several mm) in the x, y, z, and θ directions, for example. This achieves high resolution and high stop position accuracy during alignment. Further, a part of the operation of the coarse movement stage 32 can be combined with the operation of the fine movement stage 33. For example, the movement of the coarse movement stage 32 in the θ direction can be combined with the movement of the fine movement stage 33 in the θ direction. Further, the movement of the fine movement stage 33 in the z direction can be combined with the movement of the tilt portion 21 which will be described in detail later in the Z direction. In the present specification, the x direction, the y direction, and the z direction are axes in the three-dimensional orthogonal coordinate system, and the θ direction is a rotation direction around the z axis.

  The movable stage 31 can move the first substrate 51 to a predetermined position directly below the second substrate 52 via the tilt portion 21. Therefore, the first substrate 51 can be moved to a desired position with respect to the second substrate 52 by the movable stage 31.

  The tilt portion 21 is supported by the movable stage 31, and is moved by the movable stage 31 to a predetermined position directly below the second substrate 52, and the second substrate support portion 12. It adjusts so that the 2nd board | substrate 52 currently supported by 2 may become parallel. Details of the mechanism will be described below.

The tilt portion 21 is for positioning the first substrate 51 in parallel with the second substrate 52, and is provided with three uniaxial directions (for example, z-axis direction) provided on the movable stage 31. The actuator 22 can be moved up and down. The actuators 22 are arranged at positions that are the apexes of the triangle. Usually, in order to support the substrate and adjust the inclination, the substrate can be supported at three points. Therefore, also in this embodiment, the first substrate support portion 11 is supported at three points by the three actuators 22. As shown in FIG. 3, the support point is preferably located at the apex of an equilateral triangle whose center coincides with the center of the first substrate support portion 11. In addition, although it can also support at four or more points, since three points may contact the 1st board | substrate support part 11 and the remaining one point may not contact, three support points are enough. In addition, by positioning the support point at the apex of an equilateral triangle whose center coincides with the center of the first substrate support part 11, it becomes easy to adjust the inclination of the first substrate 51 via the first substrate support part 11. Further, in order to increase the precision of fine adjustment, as shown in the drawing, the lower surface side of the first substrate support portion 11 (the side opposite to the side where the first substrate 51 is supported) is more than the first substrate support portion 11. A large support portion fixing plate 13 is provided, and in this case, a spherical bearing 23 described below is provided on the back surface side (the side on which the first substrate support portion 11 is fixed) of the support portion fixing plate 13 as illustrated. If the position does not overlap with the sensor unit 15, the surface side of the support unit fixing plate 13 (the side on which the first substrate support unit 11 is fixed via the sensor unit 15) may be provided. when it. its be provided is to the support portion fixing plate 13, the rocking shaft 28 to be described later it is necessary to provide through it hole (not shown) so as not to contact. Thus, spherical mounting position of the bearing 23, mechanism design, it can be appropriately selected

  A rotary bearing 24 is provided at the tip of the movable portion of each actuator 22, and the rotary bearing 24 includes a linear motion bearing 26 that is supported by a linear motion shaft 25 fixed on a movable stage 31 so as to be movable up and down. ing. A rotary shaft 27 is rotatably supported on the rotary bearing 24, and a swing shaft 28 orthogonal to the rotary shaft 27 is formed at the center of the rotary shaft 27. Therefore, the rotation shaft 27 and the swing shaft 28 are formed in a T shape. The tip of the swing shaft 28 is formed in a spherical shape, and the spherical bearing 23 that receives the spherical portion 29 is on the back surface of the first substrate support portion 11 (the surface opposite to the surface that supports the first substrate 51). Is provided. Since the support portion fixing plate 13 is provided in the drawing as described above, the spherical bearing 23 is installed on the support portion fixing plate 13.

  Mounted on the tilt portion 21 is the first substrate support portion 11 that supports the first substrate 51 on which the element 55 to be transferred to the second substrate 52 side is attached. A second substrate support unit 12 that supports the second substrate 52 disposed to face the first substrate 51 supported by the first substrate support unit 11 is provided above the first substrate support unit 11. It has been.

  Since the tilt portion 21 can be moved up and down in the z-axis direction by the actuator 22, the operation of the movable stage 31 in the Z-axis direction can also be used. In this case, an operation mechanism in the z-axis direction can be omitted in the movable stage 31.

  In addition, a measurement unit 41 for measuring the distance between the first substrate 51 and the second substrate 52 is provided above the first substrate 51, for example, and the measurement unit 41 includes the first substrate 51 and the second substrate. It is preferable to use a measuring instrument that optically measures the distance between the first substrate 52 and the second substrate 51 in a non-contact manner. For example, an optical displacement meter can be used. Therefore, for example, the second substrate support 12 needs to be formed of a material that transmits the wavelength of the light beam used for measurement, or a window 14 through which the light beam passes. The window 14 may be open, but preferably a transparent base material such as a transparent glass substrate or quartz substrate is provided. The second substrate 52 needs to be formed of a material that transmits the wavelength of light used for measurement.

  The substrate support method of the first substrate support part 11 and the second substrate support part 12 may be mechanical support, support by vacuum suction, or other support means. In short, the first substrate support unit 11 may be any unit as long as the first substrate 51 is supported and fixed, and the second substrate support unit 12 may be any unit as long as the second substrate 52 is supported and fixed.

  The element transfer apparatus 1 includes an alignment unit 45 for positioning the first substrate 51 at a predetermined position with respect to the second substrate 52 supported by the second substrate support unit 12 by the first substrate support unit 11. For example, it is installed above the second substrate support part 12. For example, the alignment unit 45 operates the movable stage 31 so that the alignment mark formed on the first substrate 51 coincides with the alignment mark formed on the second substrate 52. One substrate 51 is aligned.

  In the element transfer apparatus 1, by providing the tilt portion 21, the first substrate 51 can be arranged in parallel to the second substrate 52 by finely adjusting the inclination of the first substrate 51. Further, by providing the movable stage 31 for moving the tilt portion 21, the first substrate 51 supported on the movable stage 31 via the tilt portion 21 and the first substrate support portion 11 is directly below the second substrate 52. It can be moved to a position. In addition, since the measurement unit 41 that measures the distance between the first substrate 51 and the second substrate 52 without contacting the first substrate 51 and the second substrate 52 is provided, the first substrate 51 and the second substrate 52 are Even if an adhesive layer (the first adhesive layer 53 and the second adhesive layer 54) is formed on the opposing surfaces, the measurement unit 41 does not contact the first adhesive layer 53 and the second adhesive layer 54. In the element transfer apparatus 1 having such a feature, the element 55 attached to the first substrate 51 can be pressed in parallel to the second substrate 52 side. At this time, since the first substrate 51 and the second substrate 52 are parallel to each other, the substrates do not contact each other. Therefore, there is an advantage that the element 55 on the first substrate 51 side can be pressed against the second substrate 52 side without damaging the second substrate 52. Therefore, the yield in the transfer technique of the element 55 can be improved.

  Next, an example of an embodiment according to the element transfer method of the present invention will be described with reference to the flowchart of FIG. The element transfer method of the present invention is a method that is performed using the element transfer apparatus 1 of the present invention. Therefore, please also refer to FIG. 1, FIG. 2, and FIG. In addition, the reference numerals of the constituent parts shown in the explanation of the element transfer device are given to the constituent parts in the following explanation.

  The element transfer method of the present invention is an element transfer method in which an element 55 bonded to a first substrate 51 via a first adhesive layer 53 is bonded to an adhesive layer 54 formed on a second substrate 52. The first substrate 51 and the second substrate 52 are made parallel to each other based on the substrate approach step for bringing the first substrate 51 and the second substrate 52 closer to each other and the measurement value obtained by measuring the distance between the first substrate 51 and the second substrate 52. A parallel alignment step for adjusting the first substrate 51 and the second substrate 52 in a state where the first substrate 51 and the second substrate 52 are kept parallel to each other. Process. This will be specifically described below.

  As shown in FIG. 4, the “substrate approach step” S1 is performed. In this step, first, a “first substrate support step” S11 is performed. In this step, the first substrate 51 is supported by the first substrate support portion 11. This support method is, for example, vacuum suction or mechanically fixed with the front surface (first adhesive layer 53 side) of the first substrate 51 facing up and the back surface of the first substrate 51 facing the first substrate support portion 11 side. To be supported. For the first substrate 51, for example, a substrate having a diameter of about Φ = 30 mm to about Φ200 mm (8 inches) is used. The element 55 adhered to the first adhesive layer 53 formed on the surface of the first substrate 51 has a size of about 3 μm to 300 μm, for example, and a height of about 3 μm to 300 μm. The number of the first substrate 51 bonded is about 10 to 1 million.

  Next, the “second substrate supporting step” S12 is performed. In this step, the second substrate 52 is supported by the second substrate support unit 12. This support method is, for example, vacuum suction or mechanically fixed with the front surface (second adhesive layer 54 side) of the second substrate 52 facing down and the back surface of the second substrate 52 facing the second substrate support portion 12 side. To be supported. For the second substrate 52, for example, a substrate having a diameter Φ = 50 mm (2 inches) to about 2 m square is used. The second substrate 52 can be a substrate larger than the 2 m silicon method. A second adhesive layer 54 is formed on the surface of the second substrate 52. The second adhesive layer 54 has a greater adhesive force with respect to the element 55 than the adhesive force of the first adhesive layer 53 to which the element 55 is bonded. The second adhesive layer 54 formed on the second substrate 52 is made of, for example, an uncured resin layer. The uncured resin layer is made of, for example, a so-called tack-resistant resist film by spin coating, printing, It is formed by a film forming method such as a laminating method. Note that either the “first substrate support step” S11 or the “second substrate support step” S12 may be performed first.

  Next, an “alignment step” S13 is performed. In this step, the first substrate 51 and the second substrate 52 are opposed to each other with a predetermined distance. Specifically, the movable stage 31 is moved to a predetermined position directly below the first substrate 51 and the second substrate 52 by moving the movable stage 31 in, for example, the xy direction and the θ direction based on the measurement of the alignment unit 45. . Further, the first substrate 51 is moved closer to the second substrate 52 by a predetermined distance by moving the movable stage 31 in the z direction, for example. For example, the distance between the first substrate 51 and the second substrate 52 is made close to the height of the element 55 plus about 100 μm to 300 μm.

  Next, the “substrate interval measuring step” S14 is performed. In this step, the distance between the first substrate 51 and the second substrate 52 is measured. This measurement position is preferably performed at three locations that do not lie on the same straight line. In this measurement, for example, the center of the first substrate 51 and the center of the equilateral triangle are matched so that the measurement position is not aligned by the measurement unit 41, and the distance between the substrates at the vertex position of the equilateral triangle is measured. To do. In other words, three equally spaced points around the center of the first substrate 51 are taken as measurement points. Further, in the above measurement, a plurality of locations in the vicinity (which may include the measurement location itself) may be measured with respect to one measurement location, and the average value thereof may be handled as the value at that location.

  Next, a “substrate interval determining step” S15 is performed. In this step, it is determined whether or not the distance between the first substrate 51 and the second substrate 52 is within a reference range.

  If the interval between the first substrate 51 and the second substrate 52 is not within the reference range in the “substrate interval determining step” S15, that is, it is determined “No”, the “substrate interval adjusting step” S16 is performed. I do. In this step, the first substrate 51 and the second substrate 52 are separated by the movable stage 31 or the tilt part 21 so that the distance between the first substrate 51 and the second substrate 52 is within a predetermined range. Adjust the interval. And it returns to said "board | substrate space | interval measurement process" S14. By measuring the substrate interval again, the desired substrate interval can be accurately set. In order to shorten the adjustment time of the substrate interval, after performing the “substrate interval adjustment step” S16, the next step “substrate paralleling step” S2 is performed without returning to the “substrate interval measurement step” S14. May be.

  If the interval between the first substrate 51 and the second substrate 52 is within the reference range in the “substrate interval determining step” S15, that is, it is determined “Yes”, the “substrate paralleling step” S2 I do.

  In the “substrate parallel alignment step” S2, first, “a parallel measurement step between substrates” S21 is performed. In this step, the distance between the first substrate 51 and the second substrate 52 is measured. In this measurement, for example, the center of the first substrate 51 and the center of the equilateral triangle are matched so that the measurement position is not aligned by the measurement unit 41, and the distance between the substrates at the vertex position of the equilateral triangle is measured. To do. In other words, three equally spaced points around the center of the first substrate 51 are taken as measurement points. Further, in the above measurement, a plurality of locations in the vicinity (which may include the measurement location itself) may be measured with respect to one measurement location, and the average value thereof may be handled as the value at that location.

  Next, a “parallel determination step between substrates” S22 is performed. In this step, it is determined whether or not the first substrate 51 and the second substrate 52 are parallel. At this time, it is desirable that the first substrate 51 and the second substrate 52 be parallel to each other, but it is regarded as parallel if it is within the allowable range.

  When it is determined that the first substrate 51 and the second substrate 52 are not in the range in which the first substrate 51 and the second substrate 52 are parallel in the “parallelity determination step between substrates” S22, that is, “No” is determined. “Parallel adjustment process between substrates” S23 is performed. In this step, the distance between the first substrate 51 and the second substrate 52 is adjusted so that the first substrate 51 and the second substrate 52 are parallel to each other. For example, the substrate interval is adjusted by the three-axis actuator 22 of the tilt portion 21 so that the three measured values measured by the measuring portion 41 are all within the same value or within an allowable error range.

  The “parallel measurement step between substrates” S21, “parallel measurement step between substrates” S22 and “parallel adjustment step between substrates” S23 may be performed only once, but the above “parallel measurement step between substrates”. It is more preferable to repeat the process until it is determined in S22 that the first substrate 51 and the second substrate 52 are parallel. Further, in order to shorten the parallel alignment time between the substrates, after performing the “parallel adjustment step between substrates” S23, the process does not return to the “parallel measurement step between substrates” S21 but the “element bonding step” of the next step. S3 may be performed.

  When it is determined that the first substrate 51 and the second substrate 52 are in a range in which the first substrate 51 and the second substrate 52 are parallel in the “parallelism determination step between substrates” S22, that is, “Yes” is determined. “Element bonding step” S3 is performed. In this step, the first substrate 51 and the second substrate 52 are brought close to each other in the state where the first substrate 51 and the second substrate 52 are kept parallel to the first adhesive layer 53 of the first substrate 51. The bonded element 55 is bonded to the second bonding layer 54 formed on the second substrate 52.

  Specifically, first, the “first substrate approach step” S31 is performed. In this step, the first substrate 51 and the second substrate 52 are brought close to each other so that the distance between the first substrate 51 and the second substrate 52 is about the height of the element 55 plus about 20 μm to 100 μm. This operation may be performed by the actuator 22 or may be performed using the fine movement stage 33 of the movable stage 31.

  Next, a “precision alignment step” S32 is performed. In this step, the alignment unit 45 performs precise alignment in the x, y, and θ directions while confirming the alignment mark, and the element 55 that is bonded to the first substrate 51 is accurately bonded to the second substrate. Move to position. This precise alignment can be performed using the fine movement stage 33 of the movable stage 31. Thereafter, the “substrate interval measuring step” S14 to “substrate interval adjusting step” S16 are performed again, and the interval between the first substrate 51 and the second substrate 52 becomes the height of the element 55 plus about 20 μm to 100 μm. Normally, the “substrate second approach step” S33 may be performed.

  Thereafter, the “substrate second approach step” S33 is performed. In this step, until the element 55 on the first substrate 51 comes into contact with the second adhesive layer 54 of the second substrate 52 or a part thereof is embedded (for example, embedded to about half the height of the element 55). The first substrate 51 is raised to the second substrate 52 side. At this time, the first adhesive layer 53 formed on the first substrate 51 and the second adhesive layer 54 formed on the second substrate 52 are not brought into contact with each other.

  Next, an “element adhesion holding step” S34 is performed. In this step, the state in which the element 55 is bonded to the second adhesive layer 54 is maintained for a certain time. For example, the element 55 is held until it is sufficiently adhered by the second adhesive layer 54 formed on the second substrate 52 side. Here, the term “sufficiently bonded” means that the second adhesive layer 54 formed on the second substrate 52 has a greater adhesive force than the element 55 is bonded to the first adhesive layer 53 formed on the first substrate 51. It means that the adhesive force to which the is bonded increases. This utilizes the fact that an adhesive layer made of an uncured resin is cured after a certain amount of time has elapsed, so that the adhesive force to an object adhered to the uncured resin layer is increased.

  Next, a “substrate separation step” S35 is performed. In this step, the first substrate 51 and the second substrate 52 are quickly separated while the element 55 is adhered to the second adhesive layer 54, and the first substrate 51 is separated from the element 55. Depending on the adhesive strength of each adhesive layer, for example, the layers are pulled apart at a speed of 0.1 mm / s or more. As a result, the element 55 bonded to the first substrate 51 is bonded to the second adhesive layer 54 formed on the second substrate 52. Here, the adhesive force of the first adhesive layer 53 formed on the first substrate 51 to the element 55 needs to be weaker than the adhesive force of the second adhesive layer 54 formed on the second substrate 52 to the element 55. . For example, it is sufficient for the first adhesive layer 53 formed on the first substrate 51 to have an adhesive force that does not move the element 55 when the first substrate 51 is moved. The element 55 does not need to be firmly bonded to the first substrate 51 by the first adhesive layer 53 formed on the first substrate 51.

  In the element transfer method, after the first substrate 51 and the second substrate 52 are brought close to each other, the first substrate 51 and the second substrate 52 are measured based on the measured values obtained by measuring the distance between the first substrate 51 and the second substrate 52. Therefore, the first substrate 51 and the second substrate 52 can be easily arranged in parallel. In addition, in a state where the first substrate 51 and the second substrate 52 are kept parallel, the element attached to the first substrate 51 can be pressed in parallel to the second substrate 52 side. At this time, since the first substrate 51 and the second substrate 52 are parallel to each other, the substrates do not contact each other. Therefore, there is an advantage that the element 55 on the first substrate 51 side can be pressed against the second substrate 52 side without damaging the second substrate 52. Therefore, the yield in the transfer technique of the element 55 can be improved.

  The element transfer method can be repeated. Next, a method of repeatedly performing the element transfer method will be described with reference to the flowcharts of FIGS.

  As shown in FIG. 5, after performing the “substrate approaching step” S1, the “paralleling step” S2 and the “element bonding step” S3 in order, the “first substrate replacing step” S4 (S41) is performed. . In this step, the first substrate 51 used for element transfer is replaced with the first substrate 51 to which the new element 55 is bonded, and the “substrate approaching step” S1, the “paralleling step” S2, and the “element bonding” are exchanged. Step “S3” is performed in order, and a new element 55 (552) is bonded to a region different from the bonding region of the element 55 (551) previously bonded to the second adhesive layer 54 of the second substrate 52.

  Further, by repeating the “first substrate exchanging step” S4 (S41) and the “substrate approaching step” S1, the “paralleling step” S2, and the “element bonding step” S3, the second substrate 52 is widened. The element 55 can be transferred to the range.

  Further, as shown in FIG. 6, after performing the “substrate approaching step” S1, the “paralleling step” S2 and the “element bonding step” S3 in this order, the “first substrate replacing step” S4 (S42). I do. In this step, the first substrate 51 is replaced with a new element 55 (552) bonded to a position different from the position of the element bonded to the first substrate 51 previously used for element transfer. Then, using the new first substrate 51, the “substrate approaching step” S1, the “paralleling step” S2, and the “element bonding step” S3 are performed in order. As a result, in the adhesion region of the element 55 (551) that has been first adhered to the second adhesive layer 54 of the second substrate 52, a new element 55 (in a position different from the adhesion position of the element 55 (551) that has been adhered first). 552) can be glued. That is, different types of elements can be transferred to a predetermined area.

  Further, the “first substrate replacement step” S4 (S42) and the “substrate approach step” S1, the “paralleling step” S2, and the “element bonding step” S3 are repeatedly performed, whereby the second substrate 52 is predetermined. Multiple types of elements can be transferred to the region.

  Next, the manufacturing method of the display device of the present invention will be described with reference to the manufacturing process diagram of FIG. FIG. 7 illustrates a method for manufacturing a display device in which a light emitting element bonded to a first substrate is bonded to an adhesive layer formed on a second substrate, and a plurality of light emitting elements are arranged and mounted. Specifically, a method for manufacturing a display device on which the red light emitting element 55R, the green light emitting element 55G, and the blue light emitting element 55B are mounted will be described.

  As shown in FIG. 7A, the first substrate 51 in which the red light emitting element 55R is bonded to a predetermined position of the first adhesive layer 53 is used as the first substrate 51. Next, as shown in FIG. 7B, the second adhesive layer in which the red light emitting element 55R bonded to the first substrate 51 side is formed on the second substrate 52 by the element transfer method of the present invention described above. Adhesive transfer to 54. Then, as shown in FIG. 7 (3), as described with reference to FIG. 5, the red light emitting element 55R is bonded and transferred to the entire predetermined region of the second substrate 52.

  Next, as shown in FIG. 7 (4), as the first substrate 51, the first substrate 51 in which the green light emitting element 55G is bonded to a predetermined position of the first adhesive layer 53 is used. Next, as shown in FIG. 7 (5), the second adhesive layer in which the green light emitting element 55G bonded to the first substrate 51 side is formed on the second substrate 52 by the element transfer method of the present invention described above. Adhesive transfer to 54. At that time, as shown in FIG. 7 (6), a new green light emitting element 55G is bonded to a predetermined position different from the bonding position of the previously bonded red light emitting element 55R by the method described with reference to FIG. Then, as shown in FIG. 8 (7), the green light emitting element 55G is adhered and transferred to the entire predetermined region of the second substrate 52 by the method described with reference to FIG.

  Next, as shown in FIG. 8 (8), as the first substrate 51, the first substrate 51 in which the blue light emitting element 55 </ b> B is bonded to a predetermined position of the first adhesive layer 53 is used. Next, as shown in FIG. 8 (9), the second adhesive layer in which the blue light emitting element 55B bonded to the first substrate 51 side is formed on the second substrate 52 by the element transfer method of the present invention described above. Adhesive transfer to 54. At that time, as shown in FIG. 7 (6), a new blue light emitting element is formed at a predetermined position different from the bonding position of the red light emitting element 55R and the green light emitting element 55G previously bonded by the method described with reference to FIG. Adhere 55B. Then, as shown in FIG. 8 (7), the blue light emitting element 55B is adhered and transferred to the entire predetermined region of the second substrate 52 by the method described with reference to FIG.

  In this manner, each color light emitting element (red light emitting element 55R, green light emitting element 55G, and blue light emitting element 55B) used in the display device could be transferred from the first substrate 51 to the second substrate 52.

  In the manufacturing method of the display device of the present invention, the first substrate 51 and the second substrate 52 are held in parallel when the element 55 on the first substrate 51 side is transferred to the second substrate 52 side. There is no contact between them. Therefore, there is an advantage that the element 55 on the first substrate 51 side can be pressed against the second substrate 52 side without damaging the second substrate 52. Therefore, it is possible to improve the yield when manufacturing the display device using the transfer technology of the element 55.

It is the schematic block diagram which showed an example of one Embodiment which concerns on the element transfer apparatus of this invention. It is a principal part enlarged view which showed an example of one Embodiment which concerns on the element transfer apparatus of this invention. It is the schematic block diagram which showed an example of one Embodiment which concerns on the element transfer apparatus of this invention. It is the flowchart figure which showed an example of one Embodiment which concerns on the element transfer method of this invention. It is the flowchart figure which showed an example of one Embodiment which concerns on the element transfer method of this invention. It is the flowchart figure which showed an example of one Embodiment which concerns on the element transfer method of this invention. It is the manufacturing process figure which showed an example of one Embodiment which concerns on the manufacturing method of the display apparatus of this invention. It is the manufacturing process figure which showed an example of one Embodiment which concerns on the manufacturing method of the display apparatus of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Element transfer apparatus, 11 ... 1st board | substrate support part, 12 ... 2nd board | substrate support part, 21 ... tilt part, 31 ... movable stage, 41 ... measurement part

Claims (14)

A first substrate support on which a first substrate is placed on the surface ;
A second substrate support part for supporting a second substrate disposed to face the first substrate;
A tilt portion for adjusting the position of the first substrate support portion so that the first substrate and the second substrate are parallel to each other;
A movable stage that supports and moves the tilt part;
A measuring unit for measuring a distance between the first substrate and the second substrate ;
The tilt portions are positioned at the apexes of the triangles, and each lifts and lowers the first substrate support portion 3
The first substrate having a plurality of actuators and having a rotating shaft and a swinging shaft orthogonal to each other on the distal end side of the movable portion of the actuator, and accompanying the lifting and lowering operation of the actuator by the rotating shaft and the swinging shaft An element transfer device that adjusts the position of the first substrate support portion while allowing the support portion to rotate and swing . A spherical portion is provided at the tip of the swing shaft, and the spherical portion is provided on the back surface of the first substrate support portion.
Has a spherical bearing to receive
The element transfer apparatus according to claim 1. The first substrate support portion is provided on a surface of a support portion fixing plate larger than the first substrate support portion, and the spherical bearing is provided on a back surface of the support portion fixing plate.
The element transfer apparatus according to claim 2. An alignment unit is provided for aligning the first substrate with respect to the second substrate .
Element transfer device 請 Motomeko 1 wherein. The tilting portion raises the element bonded to the first substrate to a position where the element is bonded to the adhesive layer formed on the second substrate;
It intends rows and operation of separating the first substrate from the device in the state of being bonded to the element to the adhesive layer
Element transfer device 請 Motomeko 1 wherein. The movable stage that Do from those moving x, y, z, the swinging unit in the θ direction
Element transfer device 請 Motomeko 1 wherein. The movable stage is
An operation of raising the element bonded to the first substrate to a position where the element is bonded to an adhesive layer formed on the second substrate;
The first substrate from the device in the state of being bonded to the element to the adhesive layer intends rows and operation for separating
Element transfer device 請 Motomeko 1 wherein. An element transfer method for bonding an element bonded to a first substrate to an adhesive layer formed on a second substrate,
The first substrate and the second substrate are supported by a first substrate support part and a second substrate support part, respectively.
A substrate approaching process to approach,
A parallelizing step of adjusting the first substrate and the second substrate to be parallel based on a measurement value obtained by measuring a distance between the first substrate and the second substrate;
An element adhering step of adhering the element to the adhesive layer by bringing the first substrate and the second substrate closer to each other while the first substrate and the second substrate are kept parallel ;
Three actuators for raising and lowering the first substrate support in the paralleling step
And a tilting portion provided on the distal end side of the movable portion of the actuator and having a rotation shaft and a swing shaft that are orthogonal to each other, and the actuator is moved up and down by the rotation shaft and the swing shaft. An element transfer method for adjusting the position of the first substrate support portion while allowing the first substrate support portion to rotate and swing . The substrate approach step includes
An alignment step in which the first substrate and the second substrate are opposed to each other while maintaining a predetermined distance;
A substrate interval measuring step for measuring an interval between the first substrate and the second substrate;
A substrate interval determining step for determining whether or not an interval between the first substrate and the second substrate is within a reference range;
When the interval between the first substrate and the second substrate is not within a predetermined range, the first substrate and the second substrate are set such that the interval between the first substrate and the second substrate is within a reference range. by adjusting the distance between the second substrate, and a substrate gap adjusting step of returning to the substrate gap measuring step
請 Motomeko 8 device transferring method according. The paralleling step includes
A substrate paralleling step of adjusting the first substrate and the second substrate in parallel;
A parallel measurement step between the substrates for measuring the distance between the first substrate and the second substrate;
A parallel determination step between the substrates for determining whether or not the first substrate and the second substrate are parallel;
When the first substrate and the second substrate are not within the allowable range of being parallel, the first substrate and the second substrate are arranged so that the first substrate and the second substrate are parallel to each other. A parallel adjustment step between the substrates that adjusts the interval and returns to the parallel measurement step between the substrates .
請 Motomeko 8 device transferring method according. After the element bonding step,
An element bonding holding step for holding the element bonded to the adhesive layer;
A substrate separation step of separating the first substrate from the element by separating the first substrate and the second substrate in a state where the element is adhered to the adhesive layer .
請 Motomeko 8 device transferring method according. After adhering the element bonded to the first substrate to the adhesive layer formed on the second substrate,
A step of replacing the first substrate with a first substrate to which a new element is bonded;
Then, it said substrate approaching step, the parallel out step, performed with the device bonding process, Ru to adhere the pre SL new element to a different position of the second substrate
請 Motomeko 8 device transferring method according. After adhering the element bonded to the first substrate to the adhesive layer formed on the second substrate,
A step of replacing the first substrate with a first substrate to which a new element is bonded;
Thereafter, the substrate approaching step, the paralleling step, and the element bonding step are performed,
To repeat a plurality of times to adhere the new element to a different position of the second substrate
請 Motomeko 12 device transferring method according. In a manufacturing method of a display device in which a light emitting element bonded to a first substrate is bonded to an adhesive layer formed on a second substrate, and a plurality of light emitting elements are arranged and mounted.
The method of adhering the element adhered to the first substrate to the adhesive layer formed on the second substrate is as follows:
The first substrate and the second substrate are supported by a first substrate support part and a second substrate support part, respectively.
A substrate approaching process to approach,
A parallelizing step of adjusting the first substrate and the second substrate to be parallel based on a measurement value obtained by measuring a distance between the first substrate and the second substrate;
An element adhesion step of adhering the element to the adhesive layer by bringing the first substrate and the second substrate closer to each other while the first substrate and the second substrate are kept parallel to each other ;
Three actuators for raising and lowering the first substrate support in the paralleling step
And a tilting portion having a rotation shaft and a swing shaft that are orthogonal to each other and provided on the distal end side of the movable portion of the actuator, and the actuator is moved up and down by the rotation shaft and the swing shaft. The position of the first substrate support portion is adjusted by allowing the first substrate support portion to rotate and swing.
Manufacturing method of the table shows the device.

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