JP2000049199A - Parallelism adjusting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a higher accuracy in setting the position of a chip component in a parallelism adjusting device, compared with the conventional accuracy. SOLUTION: An chucking part 75 which chucks chip components is provided at the tip of a bar-shaped axle 102, and the chucking part 75 freely supports a position which is away by a prescribed distance (X) from the tip of the said axle with the help of supporters (100, 100A, and 101), even in waving movement. In addition, adjusters (103-110) are provided to adjust the parallelism of the chucking part to set at a position which is away by a longer distance (Y) than the distance between the tip and the supporters. As a result, the parallelism of the chucking part against the substrate can be finely adjusted, and fluctuations of the parallelism can be avoided by bonding the chip components. Thus, position setting at higher accuracy than ever can be ensured.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a parallelism adjusting device, for example, an IC before package divided from a wafer.
The present invention is suitably applied to a flip chip bonder in which an (Integrated Circuit) chip (hereinafter, referred to as a bare chip) is mounted at a predetermined position on a printed circuit board.

[0002]

2. Description of the Related Art Conventionally, a flip chip bonder has a bare chip mounted on a predetermined position of a conductor pattern formed on a printed circuit board and thermocompression-bonded to electrically connect a bare chip electrode to a predetermined position of the conductor pattern. It is made to connect. This flip chip bonder has a portion for adsorbing a bare chip (hereinafter referred to as a bonding tool), a tilting mechanism for adjusting the parallelism of the bonding tool to the printed circuit board, and a tool control mechanism for controlling the operation of the bonding tool. And

In this flip chip bonder, when mounting a bare chip on a printed circuit board, the user operates a tilt mechanism to adjust the parallelism of the bonding tool to the printed circuit board in advance. After the bare chip is attracted to the bonding tool, the flip chip bonder presses the bare chip to a predetermined position on the printed circuit board via the tilting mechanism and the bonding tool by a pressing operation of the tool control mechanism. In this state, the flip chip bonder bonds the bare chip to the printed circuit board by heating the bare chip with a heater for heating incorporated in a bonding tool.

FIG. 10 shows the structure of a conventional swing mechanism 1. A tool control mechanism (not shown) is provided on an upper surface 1A of the tilt mechanism 1, and a lower surface 1B thereof is provided.
Through a heater unit 2 that houses a heater for heating.
A bonding tool 3 for sucking bare chips is provided.

The tilt mechanism 1 comprises a first tilt portion 5 for adjusting the parallelism in the X direction in the drawing and a second tilt portion 6 for adjusting the parallelism in the Y direction in the drawing. 1A
Is fixed by a tool control mechanism (not shown). A through hole 7 is formed in the first tilting portion 5 in the Y direction in the figure, and a slit 8 having a predetermined width is cut off so as to be connected to the through hole 7. Further, a concave portion 9 is cut off at an end of the first tilt portion 5 so as to be connected to the slit 8 according to the shape of the wedge 10. The tilt adjusting screw 11 is screwed into a screw hole (not shown) formed in the first tilt portion 5 and a screw hole 12 formed in the wedge 10. The user rotates the tilt adjustment screw 11 to
The wedge 10 is slid in the direction a or a 'in the figure.

Similarly, a through hole 15 is formed in the second swing portion 6 in the X direction in FIG.
The slit 16 having a predetermined width is cut off so as to be connected to the fifth slit 5. Further, a concave portion 17 is cut off at an end of the second tilting portion 6 so as to be connected to the slit 16 according to the shape of the wedge 18. The tilt adjustment screw 19 is
A screw hole (not shown) drilled in the tilt portion 6;
The wedge 18 is screwed into a screw hole 20 formed in the wedge 18. By rotating the tilt adjustment screw 19, the user slides the wedge 20 in the direction b or b 'in the figure.

As shown in FIG. 11A, when the wedges 10 and 18 are located at predetermined reference positions, the lower surface 1B is parallel to the upper surface 1A. I have. In this state, when the user rotates the tilt adjustment screw 11 to slide the wedge 10 in the direction of the arrow a in the figure, the width of the slit 8 gradually decreases. In response to this, in the tilting mechanism 1, one end 25 of the lower surface 1 </ b> B is fixed, and the other end 26 is pushed up in the direction of arrow c in the figure.

On the other hand, when the user rotates the tilt adjustment screw 11 to slide the wedge 10 in the direction of the arrow a 'in the figure, the width of the slit 8 gradually increases. Accordingly, in the tilting mechanism 1,
With one end 25 of the lower surface 1B fixed, the other end 26 is pushed down in the direction of arrow c 'in the figure.
In this way, the user can adjust the inclination of the lower surface 1B in the X direction with respect to the upper surface 1A in a state where the upper surface 1A of the tilt mechanism unit 1 is fixed by turning the tilt adjustment screw 11. I have.

Similarly, as shown in FIG. 11B, in the tilting mechanism 1, when the wedges 10 and 18 are located at predetermined reference positions, the lower surface 1B is parallel to the upper surface 1A. ing. In this state, the user
By rotating the tilt adjustment screw 19, the wedge 1
When the slider 8 is slid in the direction of arrow b in the figure, the width of the slit 16 gradually decreases. In response to this, in the tilting mechanism 1, one end 30 of the lower surface 1B is fixed and the other end 31 is pushed up in the direction of arrow d in the figure.

[0010] On the other hand, when the user rotates the tilt adjusting screw 19 to slide the wedge 18 in the direction of the arrow b 'in the figure, the width of the slit 16 gradually increases. In response to this, in the tilting mechanism 1, one end 30 of the lower surface 1 </ b> B is fixed, and the other end 31 is pushed down in the direction of the arrow d ′ in the figure. In this manner, the user can adjust the tilt of the lower surface 1B with respect to the upper surface 1A in the Y direction in the drawing while the upper surface 1A of the tilt mechanism mechanism 1 is fixed by turning the tilt adjustment screw 19. I have.

[0011]

However, in the tilting mechanism 1 having such a configuration, it is unavoidable that the structure and the shape are complicated, and it is also necessary to avoid the increase in size and weight. There was a problem that could not be obtained.

Further, since the tilt mechanism 1 has an asymmetric shape with respect to the center axis 35, when the bare chip is heated by the heater 2, the heat of the heater 2 is transmitted to the tilt mechanism 1. As a result, the shape is deformed, and the parallelism between the previously adjusted bonding tool and the printed board is deviated, resulting in a problem that accuracy is deteriorated.

The tilting mechanism 1 has an asymmetrical shape with respect to the central axis 35, and a part for transmitting pressure and a part for adjusting parallelism are integrated with each other. When the bare chip is repeatedly pressed on the printed circuit board by the unit, the parallelism between the bonding tool and the printed circuit board is deviated due to the load transmitted from the tool control mechanism, and accuracy is deteriorated.

Further, since the tilting mechanism 1 is provided with a function of adjusting the parallelism in the path to which the pressure is transmitted from the tool control mechanism, the parallelism is adjusted by the load transmitted from the tool control mechanism. There is a problem that it is difficult to make fine adjustments and that the workability of the user is deteriorated.

The present invention has been made in view of the above points, and can more accurately position a chip component than before, and improve the reliability when the chip component can be connected to a substrate. It is intended to propose a parallelism adjusting device that can be used.

[0016]

According to the present invention, there is provided a bonding apparatus for mounting a chip component at a predetermined position on a substrate and thermocompression-bonding the chip component. In the parallelism adjusting device for adjusting the parallelism, the suction unit is provided at the tip end, and is formed so that stress is generated symmetrically with respect to a central axis passing through the center of the suction unit and along the moving direction of the suction unit. A rod-shaped shaft member, which is pivotally supported at a position separated by a predetermined distance from the distal end of the shaft member as a fulcrum, and is provided so as to move in the direction of crimping the chip component by predetermined driving means; A supporting means formed so that stress is generated symmetrically with respect to the shaft, and a shaft which is away from the supporting means by a distance longer than a distance between the tip and the supporting means in a direction opposite to the tip. It was provided and adjustment means for adjusting the parallelism of the substrate adsorption unit by changing the inclination of the timber.

A suction portion is provided at the tip of a rod-shaped shaft member which is formed so that stress is generated symmetrically with respect to a center axis passing through the center of the suction portion and along the moving direction of the suction portion. The support means is formed so that a stress is generated symmetrically with respect to the shaft member. The support means is pivotally supported at a position distant from the distal end of the shaft member by a predetermined distance as a fulcrum. An adjusting means for changing the inclination of the shaft member to adjust the parallelism of the suction portion to the substrate at a position away from the tip portion by a long distance as compared with the The parallelism can be finely adjusted, and the parallelism can be prevented from being changed by bonding the chip components.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to the drawings.

In FIG. 1, reference numeral 50 denotes the configuration of a flip chip bonder as a whole. The flip chip bonder 50 includes a flip chip bonder main body 51, a control section 52 for controlling the flip chip bonder main body 51, an operation section 53 as operation means, and a monitor 54 for displaying a predetermined image. I have.

Hereinafter, the structure of the flip chip bonder main body 51 will be described with reference to FIGS. In the flip chip bonder main body 51, a frame 55 constituting the entire apparatus is provided.
A Y table 57 is mounted on a base 56 via a base 56. The Y table 57 further has a chip tray 59
Is mounted at a predetermined position by a guide (not shown) of the Y table 57, and can move in the Y-axis direction in the figure according to the driving of the motor 58. A plurality of bare chips 60 are placed at predetermined positions on the chip tray 59, and the plurality of bare chips 60 can be sequentially supplied.

An X table 65 is placed on the base 56. A chip reversing cylinder 66 is further mounted on the X table 65. A tip reversing arm 67 is attached to a tip portion of the tip reversing cylinder 66 so that the tip reversing arm 67 can move in the X-axis direction in the figure in response to driving of the motor 68 and can rotate 180 degrees in the arrow h direction in the figure. Has been made. A tip suction nozzle (not shown) is attached to a tip portion of the chip reversing arm 67 so that a desired one of the plurality of bare chips 60 placed on the chip tray 59 can be suctioned. I have.

A sub-frame 70 is implanted on the base 56, and a tool control mechanism 72 is attached to the sub-frame 70 via a linear guide 71, and is held movably in the Z-axis direction in the drawing. Have been. The tool control mechanism 72 includes a tool rotation shaft 73 in the Z-axis direction in the drawing.
The bonding tool 75 is attached via the swing mechanism 74 in sequence.

The bonding tool 75 includes the bare chip 6
0, and the bare chip 60 sucked by the chip suction nozzle of the chip reversing arm 67 is delivered. Also bonding tool 7
5 can rotate in accordance with the driving of the tool rotation shaft 73 based on the control of the tool control mechanism 72, and can rotate the motor 7.
While moving in the "-Z" axis direction in the figure according to the drive of No. 6,
The pressurizing operation of the bare chip 60 is performed.
Further, the bonding tool 75 has a built-in heater for heating the bare chip 60.

The tilt mechanism 74 adjusts the parallelism of the bare chip 60 sucked by the bonding tool 75 in accordance with a user operation. Further, a camera 77 is attached to the tool control mechanism 72 so as to capture an image of the bonding destination of the bare chip 60 sucked by the bonding tool 75.

Further, an XY table 80 is provided on the base 56.
Is placed. On the XY table 80, a printed circuit board 81 is placed at a predetermined position by a guide (not shown) of the XY table 80, and motors 82 and 83 are provided.
Can be moved in the XY directions in FIG. As a result, the bare chip 60 sucked by the bonding tool 75 is mounted at a predetermined position on the printed circuit board 81. The XY table 80 has a camera 8
4 is attached, and an image of the bare chip 60 sucked by the bonding tool 75 is taken.

Here, the specific structure of the tilt mechanism 74 will be described with reference to FIGS. 4 and 5. FIG. In the swing mechanism 74, a lower surface member 100A is joined to one end of a cylindrical tool case 100, and a rod-like rod 102 is attached to the lower surface member 100A via a spherical spherical bearing 101. It is swingably supported along the center axis of the tool case 100.

On the other hand, in the vicinity of the other end of the tool case 100, blocks 103 and 104 formed in a roof shape in a radial direction with respect to the above-mentioned central axis.
Are arranged at symmetrical positions around the rod 102 while contacting the rod 102. Further, micrometers 105 and 10 are provided in each block 103 and 104.
6 are attached respectively.

Further, each of the micrometers 105 and 106
The blocks 107 and 108 (not shown) formed in a roof shape are arranged at symmetrical positions around the rod 102 while abutting on the rod 102 in a direction orthogonal to a straight line passing through. . Further, each block 107
And 108 are provided with micrometers 109 and 110, respectively.

As described above, the rod 102 is connected to the blocks 103, 104, and 10 attached to the tips of the micrometers 105, 106, 109, and 110.
It is sandwiched from four directions by 7 and 108 and is fixed so that it cannot rotate.

Each of the micrometers 105 and 106 and 109 and 110 is provided with knobs 105A and 106A and 109A and 110A, and blocks 103 and 10A.
4 and shaft 1 attached to 107 and 108
05B and 106B, and 109B and 110B, respectively. Thereby, each micrometer 105
And 106 and 109 and 110, the user operates the knobs 105A and 106A and 109A and 1
By turning 10A, the shaft portions 105B and 106B and 10
9B and 110B are the micrometer 105 and 1
06 and 109 and 110 are respectively moved linearly along the central axis. Thus, each micrometer 105 and 106 and 109 and 110
, The shaft portions 105B and 106B and 109B
And 110B are prevented from rotating, and the user can use the knobs 105A and 106A and 10A.
It has a screw feed mechanism that moves linearly in response to turning 9A and 110A.

Further, the spherical bearing 1 is removed from the tool case 100.
01 at the tip of the rod 102 projecting through
The bonding tool 75 described above is attached.
In this case, the distance X from the mounting position of the bonding tool 75 to the connecting position of the spherical bearing 101 and the rod 102 is equal to blocks 103 and 104 and 107 and 10.
8 comes into contact with the rod 102 from the spherical bearing 10
It is set to be shorter than the distance Y to the connecting position of the rod 1 and the rod 102.

Referring to FIG. 6, the movement of each part of the swing mechanism 74 when adjusting the parallelism of the bonding tool 75 to the printed circuit board 81 (FIG. 1) will be described.
The rod 102 is connected to each of the blocks 103 and 104 and 1
It is sandwiched from four directions by 07 and 108 and is fixed to the central axis of the tool case 100. In this state, when the user turns the knobs 105A and 106A of the micrometers 105 and 106 in predetermined different directions, the shaft 105B of the micrometer 105 extends in the direction indicated by the arrow m in FIG. 106B contracts in the direction of arrow m in the figure.

Therefore, the shaft 10 of the micrometer 105
5B moves in the direction of arrow m in FIG.
The block 104 attached to B moves in the direction of arrow m in the figure. As a result, the rod 102 is
And 104 contact the blocks 103 and 104 in conjunction with the movement of the rods 102 and 104 in the direction of the arrow m in FIG.
And 102L gradually incline so as to draw an arc. On the other hand, in the linear direction passing through the micrometers 109 and 110, the rod 102
And slides the blocks 107 and 108 in accordance with the inclination in the direction m in the figure.

As described above, the user can use the micrometer 10
By turning the knobs 105A and 106A of the rods 5 and 106, the inclination of the rod 102 becomes
Since it changes in the straight line direction passing through 06, it can be adjusted so that the bonding tool 75 attached to the rod 102 is parallel to the printed circuit board 81 (FIG. 1).

On the other hand, when the user
When turning 09 and 110, the inclination of the rod 102 changes in the direction of a straight line passing through the micrometers 109 and 110 (ie, the direction orthogonal to the straight line passing through the micrometers 105 and 106).
2 can be adjusted so that the bonding tool 75 attached thereto is parallel to the printed circuit board 81 (FIG. 1).

Since the rod 102 is swingably mounted on the spherical bearing 101 as a fulcrum, the micrometers 105, 106 and 10
The printed circuit board 8 of the bonding tool 75 attached to the rod 102 in conjunction with the expansion and contraction operation of 9 and 110
1 (FIG. 1) can be adjusted.

Incidentally, the range in which the parallelism of the bonding tool 75 is actually adjusted is within “± 1” degrees. Therefore, the sliding amount of the rod 102 sliding on each of the blocks 103 and 104 and 107 and 108 is very small, and the rod 102 can swing without being affected by the frictional resistance.

In the tilting mechanism 74, a pressure-sensitive paper 120 for converting pressure into a color and displaying the converted color is used to check the parallelism of the bonding tool 75 with the printed circuit board 81 (FIG. 1). The pressure-sensitive paper 120 is
The printed circuit board 81 is laid on the printed circuit board 81 so as to be inserted between the bonding tool 75 and the printed circuit board 81, and the density of the color changes in accordance with the magnitude of the applied pressure. A color is displayed, and a light color is displayed when the pressure is small. Therefore, the user can change the color of the pressure-sensitive paper 120 by using the bonding tool 75.
Of the printed circuit board 81 can be known.

In the pressure-sensitive paper 120, as shown in FIG. 7A, when the color of the region sandwiched between the ends 120A and 120B is dark, it is determined that the pressure applied near this region is high. Represents. Therefore, the user moves the micrometers 105 and 106 in the “−X” direction in the drawing, so that the portion of the bonding tool 75 corresponding to the region sandwiched between the ends 120A and 120B of the pressure-sensitive paper 120 becomes The inclination of the bonding tool 75 is adjusted so as to move away from the printed board 81.

In the pressure-sensitive paper 120, as shown in FIG. 7B, when the color near the end 120D is dark,
This indicates that the pressure applied to this region is high. Therefore, the user can use the micrometers 105 and 106
Is moved in the “+ X” direction in the figure and the micrometers 109 and 110 are moved in the “−Y” direction, so that the portion of the bonding tool 75 corresponding to the area near the end 120D of the pressure-sensitive paper 120 is The inclination of the bonding tool 75 is adjusted so as to move away from the printed board 81.

Then, as shown in FIG. 7 (C), the user changes from the state shown in FIGS. 7 (A) and 7 (B) until the pressure-sensitive paper 120 displays a uniform color, that is, the applied pressure is The inclination of the bonding tool 75 is adjusted until it becomes uniform.

FIG. 8 shows a circuit configuration of the flip chip bonder 50. The flip chip bonder 50 includes a flip chip bonder main body 51, a control unit 52 for controlling the flip chip bonder main body 51, an operation unit 53 as operation means, cameras 77 and 84, and cameras 77 and 8
And a monitor 54 for displaying an image taken by the camera 4.

The operation unit 53 includes an input device, a display device, and the like. The operation unit 53 includes operation mode designation information S1 indicating whether the flip chip bonder main body 51 is to be operated manually or automatically according to a user's input operation, and a temperature at which the bare chip 60 is bonded to the printed circuit board 81. , Pressure and time, and thermo-compression condition information S2 indicating the shape and the mounting position of the bare chip 60 on the printed circuit board 81.
To send to.

The control unit 52 includes a power supply, control equipment, a motor driver, a temperature control device, an image processing device, and the like. The operation mode designation information S input from the operation unit 53 is provided.
1. Predetermined data processing is performed on the thermocompression condition information S2 and the model data information S3, and the resulting operation command information S4 and heating power S5 are transferred to the flip chip bonder body 51.
To send to.

The flip chip bonder body 51 includes motors 82 and 83 for driving an XY table 80, a motor 68 for driving an X table 65, a motor 58 for driving a Y table 57, and a motor 76 for rotating or vertically moving a bonding tool 75. , A swing mechanism 74, a heater for heating, and the like, and operate based on operation command information S4 and heating power S5 supplied from the controller 52.

The flip chip bonder main body 51 transfers the position information S6 of each part when operating according to the operation command information S4 and the heating power S5 and the bare chip 60 to the printed circuit board 8.
Data information S7 indicating the temperature and pressure at the time of bonding to No. 1 is generated and sent to the control unit 52. The control unit 52 generates display information S8 indicating the temperature and pressure during bonding, the power supply, and the state of the abnormality based on the position information S6 and the data information S7, and sends out the display information S8 to the operation unit 53. It is displayed on the output device of the operation unit 53.

The camera is composed of a camera 77 as a board recognition camera for recognizing the mounting position of the bare chip 60 on the printed circuit board 81 and a camera 84 as a chip recognition camera for recognizing the position of the bare chip 60. Image information S9 captured by these cameras 77 and 84 is sent to the control unit 52. Control unit 52
Performs predetermined data processing on the image information S9 to generate image processing result information S10, and outputs and displays the image processing result information on a monitor 54 having a display panel.

Here, the bonding procedure using the flip chip bonder 50 will be described with reference to the flowchart shown in FIG. First, in step SP2 entered from step SP1, the user places the printed circuit board 81 at a predetermined position on the XY table 80. In step SP <b> 3, the user operates the tilt mechanism 74 to adjust the bonding tool 75 so as to be parallel to the printed circuit board 81. In step SP4,
The user places the chip tray 5 at a predetermined position on the Y table 57.
9 is placed.

In step SP5, the chip reversing arm 67 sucks a desired one of the plurality of bare chips 60 placed on the chip tray 59 by the chip suction nozzle attached to the tip thereof. In step SP6, the chip reversing arm 67
(Figure 2). In step SP7, the chip reversing arm 67 moves the bare chip 6 from the chip suction nozzle.
0 is transferred to the bonding tool 75.

In step SP8, the camera 77
The printed circuit board 81 is imaged, and the chip mounting position of the printed circuit board 81 is recognized from the image. Step SP9
In, the camera 84 captures an image of the bare chip 60 and recognizes the position of the bare chip 60 from the image.

In step SP10, the control unit 52
Are the rotation angle of the tool rotation shaft 73 and the XY table 80 based on the image information supplied from the cameras 77 and 84.
Is calculated, and the tool control mechanism 72 and the motors 82 and 83 are driven in accordance with the calculation result, so that the rotation angle of the tool rotation shaft 73 and the XY table 80 are calculated.
Correct the position of.

In step SP11, the control unit 52
Lowers the bonding tool 75 by driving the motor 76 to move the bare chip 60 to the printed circuit board 81.
To be mounted. In step SP12, the control unit 52
Presses the bare chip 60 by the tool control mechanism 72. In step SP13, the control unit 52 heats the bare chip 60 by the heater for heating incorporated in the bonding tool 75. Next, step SP
The process proceeds to 14 and ends.

In the above structure, the tilting mechanism 74 has a tool case 100 symmetrical with respect to the center axis.
The rod 102 is swingably supported on the central axis of the tool case 100 with the spherical bearing 101 as a fulcrum. Further, a bonding tool 75 for attracting the bare chip 60 is attached to the tip of a rod 102 projecting from the tool case 100 via the spherical bearing 101.
Is attached.

Further, the spherical bearing 101 is attached to the rod 102.
At a distance longer than the distance from the connection position with the bonding tool 75 to the position where the bonding tool 75 is attached, radially with respect to the central axis, via the blocks 103 and 104, the micrometers 105 and 1 respectively.
Reference numerals 06 are arranged at symmetrical positions around the rod 102. Furthermore, these micrometer 10
Micrometers 109 and 110 are arranged at positions symmetrical about the rod 102 in the direction orthogonal to the straight line passing through the rods 5 and 106 via the blocks 107 and 108, respectively.

In this state, when the user turns the knobs 105A and 106A and 109A and 110A of the micrometers 105 and 106 and 109 and 110, the shafts 105B and 106B and 109B and 1
When 10B expands and contracts, the micrometers 105 and 106 and 109 and 110 expand and contract. The inclination of the rod 102 changes in accordance with the expansion and contraction of the micrometers 105 and 106 and 109 and 110, and the bonding tool 75 attached to the rod 102 is adjusted so as to be parallel to the printed circuit board 81.

As described above, the rod 1 is mounted on the lower surface member 100A of the tool case 100 with the spherical bearing 101 as a pivot point.
02 is mounted on the center axis of the tool case 100 so as to be swingable, so that the structure and shape thereof can be simplified as compared with the conventional tilting mechanism 1 (FIG. 10), so that the entire apparatus Can be reduced in size and weight.

Further, by making the distance from the point of action of the micrometers 105 and 106 and 109 and 110 to the rod 102 to the spherical bearing 101 longer than the distance from the spherical bearing 101 to the bonding tool 75, the bonding tool 75 becomes A minute amount of adjustment can be performed with high precision so as to be parallel to the printed circuit board 81.

Since the tilting mechanism 74 has a shape symmetrical with respect to the central axis, the bonding tool 75 is formed.
The heating of the bare chip 60 is performed by the heater for heating incorporated in the core 102, and even if heat is transmitted to the rod 102 with this, the central axis does not deform due to thermal expansion only in the central axis direction. Even when heat is transmitted to the spherical bearing 101, the central axis is not thermally deformed only by thermal expansion in the central axis direction as in the case of the rod 102, and therefore, the parallelism of the bonding tool 75 can be maintained. .

The pressure applied when bonding the bare chip 60 is transmitted to the bonding tool 75 via the tool case 100, the spherical bearing 101 and the rod 102 in this order. The tool case 100, the spherical bearing 101, and the rod 102 are all symmetrical with respect to the center axis of the tilt mechanism 74, and the bonding tool 75 is located on the center axis of the tilt mechanism 74. Is only deformed with the central axis symmetrical, so that the bonding tool 75
Can be maintained.

Further, in the swing mechanism 74, since the micrometers 105 and 106 and 109 and 110 for adjusting the parallelism are not provided on the path to which the pressure is transmitted from the tool control mechanism 72, the micrometers 105 and 106 and the There is no influence of the pressure on 109 and 110, and the fine adjustment of the parallelism can be performed with higher precision as compared with the conventional tilting mechanism 1 (FIG. 10), and the workability can be improved.

According to the above configuration, the bonding tool 75 is attached to the distal end of the rod 102, and the spherical bearing 101 can swing freely at a position separated by a predetermined distance from the position where the bonding tool 75 is attached as a pivot point. The micrometers 105 and 106 are arranged radially with respect to the rod 102 at a position away from the pivot point by a distance longer than the distance between the bonding tool 75 and the spherical bearing 101 with the rod 102 as the center. The micrometers 109 and 110 are arranged at symmetrical positions, respectively, and the micrometers 109 and 110 are placed in a direction perpendicular to a straight line passing through the micrometers 105 and 106.
By arranging them at symmetrical positions around the center 02, the parallelism of the bonding tool 75 with respect to the printed circuit board 81 can be finely adjusted, and the parallelism can be adjusted by heating and pressing operations performed when bonding the bare chip 60. Can be prevented from changing,
Thus, the positioning of the bare chip 60 can be performed with higher precision than before, and the reliability when the bare chip 60 is connected to the printed circuit board 81 can be improved.

In the above-described embodiment, the case where the rod 102 is swingably supported on the lower surface member 100A of the tool case 100 via the spherical bearing 101 has been described, but the present invention is not limited to this, and the present invention is not limited thereto. Even if the aligning type ball bearing or the rod 102 and the tool case 100 are integrated and a deformable material is applied to the connecting portion between the rod 102 and the tool case 100, the same effect as that described above can be obtained. .

In the above-described embodiment, the case where the micrometers 105 and 106 and 109 and 110 are applied as means for adjusting the parallelism of the bonding tool 75 has been described. However, the present invention is not limited to this. For example, even when a combination of a piezoelectric element, a precision screw, a motor and a ball screw is applied, the same effect as in the above case can be obtained.

In the above-described embodiment, the micrometers 105 and 106 are arranged radially with respect to the rod 102 at symmetrical positions around the rod 102, respectively.
The case where the micrometers 109 and 110 are arranged at symmetrical positions around the rod 102 in the direction orthogonal to the straight line passing through the line 6 has been described. However, the present invention is not limited to this. The rod 102 may be arranged in units of 120 degrees around the center 102 and the rod 102 may be regulated from three directions. Also in this case, the parallelism of the bonding tool 75 can be adjusted by moving each of the three micrometers.

Further, in the above-described embodiment, the case where the tilt mechanism 74 is symmetrical with respect to the center axis has been described. However, the present invention is not limited to this, and the heat applied to the tilt mechanism may be reduced. If the pressure is designed to be transmitted symmetrically with respect to a center axis passing through the center of the bonding tool 75 and along the moving direction of the bonding tool 75, the shape need not always be symmetric. That is, it may be formed so that various other stresses such as a pressing stress and a heating stress are generated symmetrically with respect to the center axis of the tilting mechanism.

[0066]

As described above, according to the present invention, the rod-shaped shaft member is formed so that stress is generated symmetrically with respect to the center axis passing through the center of the suction portion and along the moving direction of the suction portion. A suction portion is provided at the distal end portion, and is supported swingably with a position distant from the distal end portion of the shaft member by a predetermined distance as a fulcrum by supporting means formed so that stress is generated symmetrically with respect to the central axis, Adjusting means for adjusting the degree of parallelism of the suction portion to the substrate by changing the inclination of the shaft member at a position apart from the supporting means by a distance longer than the distance between the tip and the supporting means in a direction opposite to the tip. With this arrangement, the parallelism of the suction portion to the substrate can be finely adjusted, and the parallelism can be prevented from being changed by bonding chip components. With obtaining performs positioning flop component with high accuracy, it can improve the reliability in connecting the chip component to the substrate.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing an embodiment of a flip chip bonder according to the present invention.

FIG. 2 is a schematic diagram illustrating a configuration of a flip chip bonder.

FIG. 3 is a schematic diagram illustrating a configuration of a flip chip bonder.

FIG. 4 is a schematic diagram illustrating a configuration of a tilt mechanism unit.

FIG. 5 is a schematic diagram illustrating a configuration of a tilt mechanism unit.

FIG. 6 is a schematic diagram illustrating an operation of a tilt mechanism unit.

FIG. 7 is a schematic diagram illustrating parallelism adjustment using pressure-sensitive paper.

FIG. 8 is a block diagram showing a circuit configuration of a flip chip bonder.

FIG. 9 is a flowchart showing a bonding procedure using a flip chip bonder.

FIG. 10 is a schematic diagram illustrating a configuration of a conventional swing mechanism unit.

FIG. 11 is a schematic diagram illustrating a configuration of a conventional swing mechanism unit.

[Explanation of symbols]

50 Flip chip bonder, 51 Flip chip bonder body, 60 Bare chip, 72 Tool control mechanism, 73 Tool rotation axis, 74 Tilt mechanism, 75 Bonding tool, 81 …… Printed circuit board, 100 …… Tool case, 101 …… Spherical bearing,
102 ... rod, 103, 104, 107, 108 ...
... Block, 105, 106, 109, 110...

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Manabu Manabu 6-7-35 Kita-Shinagawa, Shinagawa-ku, Tokyo Sony Inside (72) Inventor Kazumasa Dasiwa 6-35-35 Kita-Shinagawa, Shinagawa-ku, Tokyo Sony Corporation F-term (reference) 2F062 AA03 AA80 AA81 BB14 BC28 CC22 CC26 EE09 EE15 EE22 EE65 FF14 GG09 GG45 GG46 GG71 LL19 LL20 2F069 AA03 AA83 BB15 CC06 DD25 DD27 GG04 GG07 GG22 GG24GG24

Claims (3)

[Claims] 1. A parallelism adjusting device provided in a bonding device for mounting and thermocompression bonding a chip component at a predetermined position on a substrate, and adjusting a parallelism of the suction portion for suctioning the chip component to the substrate. A rod-shaped shaft member that is provided at a tip portion and is formed so that stress is generated symmetrically with respect to a center axis passing through the center of the suction portion and along the moving direction of the suction portion; and the tip portion of the shaft member. Is provided so as to be swingable about a position distant from the chip component by a predetermined distance, and is moved by a predetermined driving means in the direction of crimping of the chip component, so that stress is generated symmetrically with respect to the central axis. The inclination of the shaft member is set at a position separated from the support means by a distance longer than the distance between the tip and the support in the opposite direction to the tip. By reduction parallelism adjusting apparatus characterized by comprising an adjustment means for adjusting the parallelism with respect to the substrate of the suction unit. 2. The parallelism adjusting device according to claim 1, wherein said shaft member and said support means are formed so as to generate heating stress symmetrically with respect to said central axis. 3. The parallelism adjusting device according to claim 1, wherein said shaft member and said support means are formed such that a pressing stress is generated symmetrically with respect to said central axis.