JP5937876B2 - めっき繊維製造装置及び方法 - Google Patents

めっき繊維製造装置及び方法 Download PDF

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Publication number
JP5937876B2
JP5937876B2 JP2012095067A JP2012095067A JP5937876B2 JP 5937876 B2 JP5937876 B2 JP 5937876B2 JP 2012095067 A JP2012095067 A JP 2012095067A JP 2012095067 A JP2012095067 A JP 2012095067A JP 5937876 B2 JP5937876 B2 JP 5937876B2
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Prior art keywords
plating
fiber
fiber bundle
conductor resistance
plated
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Japanese (ja)
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JP2013221234A (ja
Inventor
延之 菅沼
延之 菅沼
宏樹 近藤
宏樹 近藤
聡 吉永
聡 吉永
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Yazaki Corp
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Yazaki Corp
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Priority to JP2012095067A priority Critical patent/JP5937876B2/ja
Priority to CN201310135315.2A priority patent/CN103374736B/zh
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JP2012095067A 2012-04-18 2012-04-18 めっき繊維製造装置及び方法 Active JP5937876B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012095067A JP5937876B2 (ja) 2012-04-18 2012-04-18 めっき繊維製造装置及び方法
CN201310135315.2A CN103374736B (zh) 2012-04-18 2013-04-18 镀层纤维制造装置和用于制造镀层纤维的方法

Applications Claiming Priority (1)

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JP2012095067A JP5937876B2 (ja) 2012-04-18 2012-04-18 めっき繊維製造装置及び方法

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JP2013221234A JP2013221234A (ja) 2013-10-28
JP5937876B2 true JP5937876B2 (ja) 2016-06-22

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JP (1) JP5937876B2 (zh)
CN (1) CN103374736B (zh)

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS583999A (ja) * 1981-06-30 1983-01-10 Sumitomo Metal Ind Ltd 電気合金メツキ方法
JPS59215498A (ja) * 1983-05-20 1984-12-05 Hitachi Cable Ltd 繊維束のメツキ方法
DE3429207C2 (de) * 1984-08-08 1986-06-19 Gustav 7290 Freudenstadt Memminger Fadenliefervorrichtung für fadenverbrauchende Textilmaschinen
JPS63249774A (ja) * 1987-04-06 1988-10-17 東レ株式会社 繊維束のメッキ方法
DE19958202C2 (de) * 1999-12-02 2003-08-14 Infineon Technologies Ag Verfahren zur Herstellung einer Metallschicht mit einer vorgegebenen Dicke
JP3954902B2 (ja) * 2001-10-02 2007-08-08 名古屋メッキ工業株式会社 繊維束の連続めっき方法とその装置
JP4135130B2 (ja) * 2002-02-28 2008-08-20 サンケン電気株式会社 長手物体の巻き取り装置
US6892667B2 (en) * 2002-05-29 2005-05-17 Nagoya Mekki Kogyo Kabushiki Kaisha Continuous plating method of filament bundle and apparatus therefor
JP3860111B2 (ja) * 2002-12-19 2006-12-20 大日本スクリーン製造株式会社 メッキ装置およびメッキ方法
US20040149584A1 (en) * 2002-12-27 2004-08-05 Mizuki Nagai Plating method
JP4312465B2 (ja) * 2003-01-23 2009-08-12 株式会社荏原製作所 めっき方法およびめっき装置
US7255302B2 (en) * 2004-03-10 2007-08-14 Mitsubishi Rayon Co., Ltd. Guide apparatus for continuous fiber bundle, winding machine for continuous fiber bundle equipped with the guide apparatus, method for making bobbin by the winding machine, and carbon fiber bobbin made by the method
ITMI20051325A1 (it) * 2005-07-12 2007-01-13 Btsr Int Spa Metodo e dispositivo per assicurare l'alimentazione di un filo a tensione costante a doppio anello di regolazione ad una macchina tessile
CN100596256C (zh) * 2005-07-12 2010-03-24 3M创新有限公司 将材料图样连续沉积在基底上的设备和方法
US7611584B2 (en) * 2005-12-13 2009-11-03 Lg Electronics Inc. Electroless metal film-plating system
JP4841996B2 (ja) * 2006-03-31 2011-12-21 富士フイルム株式会社 洗浄装置、めっき被膜付きフィルムの製造装置、洗浄方法及びめっき被膜付きフィルムの製造方法
WO2009075885A2 (en) * 2007-12-12 2009-06-18 Lam Research Corporation Method and apparatus for plating solution analysis and control

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Publication number Publication date
JP2013221234A (ja) 2013-10-28
CN103374736A (zh) 2013-10-30
CN103374736B (zh) 2016-07-06

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