JP5937300B2 - フィラー材料を有する透明導電性コーティング - Google Patents
フィラー材料を有する透明導電性コーティング Download PDFInfo
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- JP5937300B2 JP5937300B2 JP2010539895A JP2010539895A JP5937300B2 JP 5937300 B2 JP5937300 B2 JP 5937300B2 JP 2010539895 A JP2010539895 A JP 2010539895A JP 2010539895 A JP2010539895 A JP 2010539895A JP 5937300 B2 JP5937300 B2 JP 5937300B2
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- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
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Description
本発明の実施態様としては、以下が挙げられる:
〈1〉
少なくとも部分的に結合したナノ粒子で形成されている導電性配線のネットワーク状パターンを含み、且つ前記導電性配線が光に略透明な不規則形状のセルを画定している物品であって、少なくとも前記セルの一部が少なくとも部分的に透明なフィラー材料で充填されている物品。
〈2〉
前記フィラー材料が、導電性である、〈1〉の物品。
〈3〉
前記フィラー材料の抵抗が、102〜108ohm/sqの範囲内である、〈2〉の物品。
〈4〉
前記フィラー材料が、金属酸化物を含む、〈2〉の物品。
〈5〉
前記金属酸化物が、インジウム−スズ酸化物又はアンチモン−スズ酸化物である、〈4〉の物品。
〈6〉
前記フィラー材料が導電性ポリマーを含む、〈2〉の物品。
〈7〉
前記導電性ポリマーが、PEDOT、PEDOT:PSS、ポリアニリン、ポリチオフェン、ポリアセチレン、ポリピロール、又はこれらの誘導体若しくは混合物である、〈6〉の物品。
〈8〉
前記フィラー材料が、カーボンナノチューブ、又は金属ナノ粒子若しくはナノワイヤーの低密度マトリクス若しくは配列を含む、〈2〉の物品。
〈9〉
前記フィラー材料が、非導電性又は半導体性である、〈1〉の物品。
〈10〉
前記フィラー材料が、高誘電率材料である、〈1〉の物品。
〈11〉
前記フィラー材料が、反射防止材料を含む、〈9〉の物品。
〈12〉
前記反射防止材料が、ガラスフリット、ガラス球、窒化シリコン、一酸化シリコン、二酸化チタン、又は酸化亜鉛を含む、〈11〉の物品。
〈13〉
前記フィラー材料が接着剤である、〈1〉の物品。
〈14〉
前記接着剤が、エポキシ又はUV硬化アクリレートを含む、〈12〉の物品。
〈15〉
前記フィラー材料が、摩擦耐性、引掻き耐性、耐水性又はこれらの任意の組み合わせである、〈1〉の物品。
〈16〉
前記物品の一つの表面を被覆する少なくとも一つの基材層をさらに有する、〈1〉の物品。
〈17〉
前記物品が、フレキシブルである、〈16〉の物品。
〈18〉
前記フィラー材料が、完全に前記セルを充填し、そして前記セルの上方に広がっている、〈1〉の物品。
〈19〉
前記フィラー材料が、前記セルの上部以下の水準まで充填している、〈1〉の物品。
〈20〉
〈1〉の物品、蛍光体層、誘電体層、及び対電極を含む、エレクトロルミネセントデバイス。
〈21〉
導電性ナノ粒子を含有する連続体相及びフィラー材料を含有する不連続体相を有するエマルションを含む液体コーティング組成物であって、前記エマルションは、基材上にコーティングしたときに、透明導電性コーティングを形成し、前記透明導電性コーティングが、少なくとも部分的に結合したナノ粒子で形成されている配線のネットワーク状パターンを含み、且つ前記配線が、光に略透明な不規則形状のセルを画定しており、且つ前記セルの少なくとも一部が、前記フィラー材料により充填されている、液体コーティング組成物。
〈22〉
前記連続相が、水に非混和性の溶媒を含み、且つ前記不連続相が、水又は水に混和性の溶媒を含む、〈21〉の組成物。
〈23〉
前記ナノ粒子が、銀、銅、カーボン、グラファイト、又はこれらの混合物若しくはアロイを含む、〈22〉の組成物。
〈24〉
前記フィラー材料が、導電性である、〈22〉の組成物。
〈25〉
前記フィラー材料が、導電性ポリマーを含む、〈24〉の組成物。
〈26〉
前記導電性ポリマーが、PEDOT、PEDOT:PSS、ポリアニリン、ポリチオフェン、ポリアセチレン、ポリピロール、又はこれらの誘導体若しくは混合物である、〈25〉の組成物。
〈27〉
〈20〉の液体コーティング組成物を、基材の表面に適用するステップ、及び前記コーティング組成物を乾燥するステップを含む、〈1〉の物品の製造方法。
〈28〉
さらに焼結ステップを含む、〈27〉の方法。
〈29〉
前記基材から前記物品を除去するステップをさらに含む、〈28〉の方法。
〈30〉
第二の基材に前記物品を適用するステップをさらに含む、〈29〉の方法。
〈31〉
次のステップを含む、〈1〉の物品の製造方法:
a.導電性ナノ粒子を含有する連続相を含む液体エマルションを、基材の表面に適用するステップ;
b.前記エマルションを乾燥し、そして透明導電性コーティングを形成するステップであって、前記透明導電性コーティングが少なくとも部分的に結合したナノ粒子で形成されている配線のネットワーク状パターンを含み、前記配線が光に略透明な不規則形状のセルを画定しており、且つ少なくとも一部の前記セルが前記フィラー材料で充填されている、ステップ;及び
c.透明フィラー材料を適用して、前記コーティングの少なくともいくつかを少なくとも部分的に充填するステップ。
〈32〉
前記フィラー材料が、接着剤である、〈31〉の方法。
〈33〉
第二の基材を、前記第一の基材の反対側で、接着剤と接触させて、前記物品に接着させるステップをさらに含む、〈32〉の方法。
〈34〉
前記物品から前記第一の基材を除去するステップをさらに含む、〈33〉の方法。
Claims (2)
- 次のステップを含む、物品の製造方法:
a.導電性ナノ粒子を含有する連続相を含む液体エマルションを、第一の基材の表面に適用するステップ;
b.前記エマルションを乾燥し、そして透明導電性コーティングを形成するステップであって、前記透明導電性コーティングが少なくとも部分的に結合したナノ粒子で形成されている配線のネットワーク状パターンを含み、前記配線が光に透明な不規則形状のセルを画定している、ステップ;
c.透明接着剤を適用して、前記コーティングの少なくともいくつかのセルを少なくとも部分的に充填するステップ;及び
d.第二の基材を、前記第一の基材と向かい合わせて前記透明接着剤と接触させて、前記物品に接着させるステップ。 - 次のステップをさらに含む、請求項1に記載の方法:
e.前記物品から前記第一の基材を除去するステップ。
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US1548307P | 2007-12-20 | 2007-12-20 | |
US61/015,483 | 2007-12-20 | ||
PCT/US2008/087771 WO2009086161A1 (en) | 2007-12-20 | 2008-12-19 | Transparent conductive coating with filler material |
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JP2010539895A Expired - Fee Related JP5937300B2 (ja) | 2007-12-20 | 2008-12-19 | フィラー材料を有する透明導電性コーティング |
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US20100028684A1 (en) * | 2008-07-31 | 2010-02-04 | Jose Mariscal | Conductive multilayer stack |
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US8324089B2 (en) | 2009-07-23 | 2012-12-04 | Honeywell International Inc. | Compositions for forming doped regions in semiconductor substrates, methods for fabricating such compositions, and methods for forming doped regions using such compositions |
US8507797B2 (en) | 2009-08-07 | 2013-08-13 | Guardian Industries Corp. | Large area deposition and doping of graphene, and products including the same |
US10167572B2 (en) | 2009-08-07 | 2019-01-01 | Guardian Glass, LLC | Large area deposition of graphene via hetero-epitaxial growth, and products including the same |
US10164135B2 (en) * | 2009-08-07 | 2018-12-25 | Guardian Glass, LLC | Electronic device including graphene-based layer(s), and/or method or making the same |
JP5554529B2 (ja) * | 2009-08-31 | 2014-07-23 | キヤノン電子株式会社 | 光電変換デバイス及び太陽電池 |
KR101601272B1 (ko) * | 2009-09-03 | 2016-03-08 | 엘지이노텍 주식회사 | 낮은 휨 특성을 나타내는 태양전지 후면전극 형성용 조성물 |
TWI416545B (zh) * | 2009-09-25 | 2013-11-21 | Innolux Corp | 導電板的製作方法及其製備系統 |
JP5727766B2 (ja) * | 2009-12-10 | 2015-06-03 | 理想科学工業株式会社 | 導電性エマルジョンインク及びそれを用いた導電性薄膜の形成方法 |
TWI573846B (zh) * | 2010-03-09 | 2017-03-11 | 西瑪奈米技術以色列有限公司 | 形成具有燒結添加物之透明導電塗層的方法 |
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CN101945710A (zh) | 2011-01-12 |
KR101586619B1 (ko) | 2016-01-21 |
US8795462B2 (en) | 2014-08-05 |
JP2014225459A (ja) | 2014-12-04 |
EP2232571A2 (en) | 2010-09-29 |
US20140306263A1 (en) | 2014-10-16 |
KR20100098448A (ko) | 2010-09-06 |
TWI462119B (zh) | 2014-11-21 |
WO2009085224A2 (en) | 2009-07-09 |
JP2011508424A (ja) | 2011-03-10 |
TW200935452A (en) | 2009-08-16 |
EP2240286A4 (en) | 2014-05-21 |
TWI438906B (zh) | 2014-05-21 |
US8633474B2 (en) | 2014-01-21 |
KR101586506B1 (ko) | 2016-01-18 |
TW200939494A (en) | 2009-09-16 |
JP5302332B2 (ja) | 2013-10-02 |
WO2009085224A3 (en) | 2009-09-17 |
CN101952973A (zh) | 2011-01-19 |
EP2240286A1 (en) | 2010-10-20 |
WO2009086161A1 (en) | 2009-07-09 |
CN101945710B (zh) | 2014-03-12 |
KR20160010646A (ko) | 2016-01-27 |
KR20150103309A (ko) | 2015-09-09 |
US20110273085A1 (en) | 2011-11-10 |
US20110175065A1 (en) | 2011-07-21 |
KR20100114040A (ko) | 2010-10-22 |
KR101234881B1 (ko) | 2013-02-20 |
JP2011515003A (ja) | 2011-05-12 |
CN101952973B (zh) | 2012-09-26 |
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