JP5932599B2 - プラズマエッチング方法 - Google Patents

プラズマエッチング方法 Download PDF

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Publication number
JP5932599B2
JP5932599B2 JP2012229411A JP2012229411A JP5932599B2 JP 5932599 B2 JP5932599 B2 JP 5932599B2 JP 2012229411 A JP2012229411 A JP 2012229411A JP 2012229411 A JP2012229411 A JP 2012229411A JP 5932599 B2 JP5932599 B2 JP 5932599B2
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JP
Japan
Prior art keywords
gas
film
silicon nitride
etching
nitride film
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Active
Application number
JP2012229411A
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English (en)
Japanese (ja)
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JP2013118359A5 (enExample
JP2013118359A (ja
Inventor
智行 渡辺
智行 渡辺
未知数 森本
未知数 森本
薬師寺　守
守 薬師寺
小野　哲郎
哲郎 小野
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Technologies Corp filed Critical Hitachi High Technologies Corp
Priority to JP2012229411A priority Critical patent/JP5932599B2/ja
Priority to TW105122740A priority patent/TWI600083B/zh
Priority to TW101139495A priority patent/TW201335991A/zh
Priority to KR1020120121063A priority patent/KR101405175B1/ko
Priority to US13/664,940 priority patent/US8741166B2/en
Priority to CN201310015232.XA priority patent/CN103779203B/zh
Publication of JP2013118359A publication Critical patent/JP2013118359A/ja
Priority to US14/248,844 priority patent/US8889024B2/en
Publication of JP2013118359A5 publication Critical patent/JP2013118359A5/ja
Application granted granted Critical
Publication of JP5932599B2 publication Critical patent/JP5932599B2/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H01L21/31116—Etching inorganic layers by chemical means by dry-etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32131—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by physical means only
    • H01L21/32132—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by physical means only of silicon-containing layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
JP2012229411A 2011-10-31 2012-10-17 プラズマエッチング方法 Active JP5932599B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2012229411A JP5932599B2 (ja) 2011-10-31 2012-10-17 プラズマエッチング方法
TW105122740A TWI600083B (zh) 2011-10-31 2012-10-25 Plasma etching method
TW101139495A TW201335991A (zh) 2011-10-31 2012-10-25 電漿蝕刻方法
KR1020120121063A KR101405175B1 (ko) 2011-10-31 2012-10-30 플라즈마 에칭 방법
US13/664,940 US8741166B2 (en) 2011-10-31 2012-10-31 Plasma etching method
CN201310015232.XA CN103779203B (zh) 2012-10-17 2013-01-16 等离子蚀刻方法
US14/248,844 US8889024B2 (en) 2011-10-31 2014-04-09 Plasma etching method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011238166 2011-10-31
JP2011238166 2011-10-31
JP2012229411A JP5932599B2 (ja) 2011-10-31 2012-10-17 プラズマエッチング方法

Publications (3)

Publication Number Publication Date
JP2013118359A JP2013118359A (ja) 2013-06-13
JP2013118359A5 JP2013118359A5 (enExample) 2015-03-19
JP5932599B2 true JP5932599B2 (ja) 2016-06-08

Family

ID=48610539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012229411A Active JP5932599B2 (ja) 2011-10-31 2012-10-17 プラズマエッチング方法

Country Status (4)

Country Link
US (2) US8741166B2 (enExample)
JP (1) JP5932599B2 (enExample)
KR (1) KR101405175B1 (enExample)
TW (2) TW201335991A (enExample)

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JP6289996B2 (ja) * 2014-05-14 2018-03-07 東京エレクトロン株式会社 被エッチング層をエッチングする方法
US10658222B2 (en) 2015-01-16 2020-05-19 Lam Research Corporation Moveable edge coupling ring for edge process control during semiconductor wafer processing
US9911620B2 (en) * 2015-02-23 2018-03-06 Lam Research Corporation Method for achieving ultra-high selectivity while etching silicon nitride
US10957561B2 (en) 2015-07-30 2021-03-23 Lam Research Corporation Gas delivery system
US9837286B2 (en) 2015-09-04 2017-12-05 Lam Research Corporation Systems and methods for selectively etching tungsten in a downstream reactor
US10192751B2 (en) 2015-10-15 2019-01-29 Lam Research Corporation Systems and methods for ultrahigh selective nitride etch
JP6557588B2 (ja) * 2015-12-04 2019-08-07 株式会社日立ハイテクノロジーズ ドライエッチング方法
US10825659B2 (en) 2016-01-07 2020-11-03 Lam Research Corporation Substrate processing chamber including multiple gas injection points and dual injector
US10147588B2 (en) 2016-02-12 2018-12-04 Lam Research Corporation System and method for increasing electron density levels in a plasma of a substrate processing system
US10651015B2 (en) 2016-02-12 2020-05-12 Lam Research Corporation Variable depth edge ring for etch uniformity control
US10699878B2 (en) 2016-02-12 2020-06-30 Lam Research Corporation Chamber member of a plasma source and pedestal with radially outward positioned lift pins for translation of a substrate c-ring
US10438833B2 (en) 2016-02-16 2019-10-08 Lam Research Corporation Wafer lift ring system for wafer transfer
US9673058B1 (en) 2016-03-14 2017-06-06 Lam Research Corporation Method for etching features in dielectric layers
US10410832B2 (en) 2016-08-19 2019-09-10 Lam Research Corporation Control of on-wafer CD uniformity with movable edge ring and gas injection adjustment
JP6796519B2 (ja) * 2017-03-10 2020-12-09 東京エレクトロン株式会社 エッチング方法
FR3065576B1 (fr) * 2017-04-25 2020-01-24 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede de gravure d'une couche a base de sin
US10847374B2 (en) 2017-10-31 2020-11-24 Lam Research Corporation Method for etching features in a stack
CN118380375A (zh) 2017-11-21 2024-07-23 朗姆研究公司 底部边缘环和中部边缘环
US10361092B1 (en) 2018-02-23 2019-07-23 Lam Research Corporation Etching features using metal passivation
US10283370B1 (en) * 2018-03-01 2019-05-07 Applied Materials, Inc. Silicon addition for silicon nitride etching selectivity
JP6811202B2 (ja) * 2018-04-17 2021-01-13 東京エレクトロン株式会社 エッチングする方法及びプラズマ処理装置
US10515821B1 (en) 2018-06-26 2019-12-24 Lam Research Corporation Method of achieving high selectivity for high aspect ratio dielectric etch
US10741407B2 (en) 2018-10-19 2020-08-11 Lam Research Corporation Reduction of sidewall notching for high aspect ratio 3D NAND etch
CN113544823B (zh) * 2020-02-10 2024-04-12 株式会社日立高新技术 等离子处理方法
KR20250099767A (ko) * 2020-02-28 2025-07-02 램 리써치 코포레이션 고 종횡비 3D NAND 에칭을 위한 측벽 노칭 (notching) 감소
JP7466686B2 (ja) 2020-03-23 2024-04-12 ラム リサーチ コーポレーション 基板処理システムにおける中間リング腐食補償
CN113471049B (zh) 2021-06-30 2022-07-26 北京屹唐半导体科技股份有限公司 用于处理工件的方法及等离子体刻蚀机、半导体器件

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US4793897A (en) * 1987-03-20 1988-12-27 Applied Materials, Inc. Selective thin film etch process
EP0424299A3 (en) * 1989-10-20 1991-08-28 International Business Machines Corporation Selective silicon nitride plasma etching
JP3210359B2 (ja) * 1991-05-29 2001-09-17 株式会社東芝 ドライエッチング方法
JP3172340B2 (ja) * 1993-08-12 2001-06-04 東京エレクトロン株式会社 プラズマ処理装置
JP3681533B2 (ja) 1997-02-25 2005-08-10 富士通株式会社 窒化シリコン層のエッチング方法及び半導体装置の製造方法
US5786276A (en) * 1997-03-31 1998-07-28 Applied Materials, Inc. Selective plasma etching of silicon nitride in presence of silicon or silicon oxides using mixture of CH3F or CH2F2 and CF4 and O2
JP3439455B2 (ja) * 2000-12-18 2003-08-25 Ｎｅｃエレクトロニクス株式会社 異方性ドライエッチング方法
US6800210B2 (en) * 2001-05-22 2004-10-05 Reflectivity, Inc. Method for making a micromechanical device by removing a sacrificial layer with multiple sequential etchants
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Also Published As

Publication number Publication date
US20130157470A1 (en) 2013-06-20
US8889024B2 (en) 2014-11-18
TW201639029A (zh) 2016-11-01
US8741166B2 (en) 2014-06-03
KR20130047663A (ko) 2013-05-08
US20140220785A1 (en) 2014-08-07
TW201335991A (zh) 2013-09-01
JP2013118359A (ja) 2013-06-13
TWI560770B (enExample) 2016-12-01
TWI600083B (zh) 2017-09-21
KR101405175B1 (ko) 2014-06-10

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