JP5905718B2 - 搬送治具、搬送方法、および搬送治具材料 - Google Patents
搬送治具、搬送方法、および搬送治具材料 Download PDFInfo
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- JP5905718B2 JP5905718B2 JP2011289257A JP2011289257A JP5905718B2 JP 5905718 B2 JP5905718 B2 JP 5905718B2 JP 2011289257 A JP2011289257 A JP 2011289257A JP 2011289257 A JP2011289257 A JP 2011289257A JP 5905718 B2 JP5905718 B2 JP 5905718B2
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011289257A JP5905718B2 (ja) | 2011-12-28 | 2011-12-28 | 搬送治具、搬送方法、および搬送治具材料 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2011289257A JP5905718B2 (ja) | 2011-12-28 | 2011-12-28 | 搬送治具、搬送方法、および搬送治具材料 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013138152A JP2013138152A (ja) | 2013-07-11 |
JP2013138152A5 JP2013138152A5 (enrdf_load_stackoverflow) | 2015-03-12 |
JP5905718B2 true JP5905718B2 (ja) | 2016-04-20 |
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JP2011289257A Expired - Fee Related JP5905718B2 (ja) | 2011-12-28 | 2011-12-28 | 搬送治具、搬送方法、および搬送治具材料 |
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JP (1) | JP5905718B2 (enrdf_load_stackoverflow) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6696128B2 (ja) * | 2015-08-25 | 2020-05-20 | 大日本印刷株式会社 | 部品実装薄膜配線基材の製造方法 |
JP6616194B2 (ja) | 2016-01-15 | 2019-12-04 | 日東電工株式会社 | 載置部材 |
JP6549995B2 (ja) | 2016-01-15 | 2019-07-24 | 日東電工株式会社 | 載置部材 |
JP6742098B2 (ja) | 2016-01-15 | 2020-08-19 | 日東電工株式会社 | 載置部材 |
JP2017175126A (ja) * | 2016-03-18 | 2017-09-28 | 日東電工株式会社 | 搬送固定治具 |
JP6879692B2 (ja) | 2016-08-12 | 2021-06-02 | 日東電工株式会社 | 粘着性構造体 |
JP7051300B2 (ja) | 2016-08-12 | 2022-04-11 | 日東電工株式会社 | カーボンナノチューブ集合体 |
WO2018030182A1 (ja) | 2016-08-12 | 2018-02-15 | 日東電工株式会社 | カーボンナノチューブ集合体 |
JP6975545B2 (ja) | 2016-10-03 | 2021-12-01 | 日東電工株式会社 | カーボンナノチューブ集合体 |
JP6796984B2 (ja) | 2016-10-03 | 2020-12-09 | 日東電工株式会社 | カーボンナノチューブ集合体 |
JP7144149B2 (ja) | 2018-02-06 | 2022-09-29 | 日東電工株式会社 | カーボンナノチューブ集合体 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3081122B2 (ja) * | 1994-07-18 | 2000-08-28 | シャープ株式会社 | 基板搬送用治具及びそれを用いた液晶表示素子の製造方法 |
JP2000261193A (ja) * | 1999-03-11 | 2000-09-22 | Misuzu Kogyo:Kk | 搬送板へのfpc基板固着方法 |
JP4511159B2 (ja) * | 2003-11-26 | 2010-07-28 | シバタ工業株式会社 | 粘着体 |
JP2005183424A (ja) * | 2003-12-16 | 2005-07-07 | Shin Etsu Polymer Co Ltd | 薄型基板固定治具 |
JP4522890B2 (ja) * | 2005-03-03 | 2010-08-11 | 株式会社 大昌電子 | プリント配線基板用シートユニットを用いた基板取付方法 |
JP4459111B2 (ja) * | 2005-05-24 | 2010-04-28 | 信越ポリマー株式会社 | 電子部品保持具の製造方法 |
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2011
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