JP5892109B2 - 超音波洗浄装置及び洗浄方法 - Google Patents

超音波洗浄装置及び洗浄方法 Download PDF

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Publication number
JP5892109B2
JP5892109B2 JP2013102431A JP2013102431A JP5892109B2 JP 5892109 B2 JP5892109 B2 JP 5892109B2 JP 2013102431 A JP2013102431 A JP 2013102431A JP 2013102431 A JP2013102431 A JP 2013102431A JP 5892109 B2 JP5892109 B2 JP 5892109B2
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JP
Japan
Prior art keywords
cleaning
tank
ultrasonic
wafer
cleaned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013102431A
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English (en)
Japanese (ja)
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JP2014222738A (ja
JP2014222738A5 (https=
Inventor
均 椛澤
均 椛澤
阿部　達夫
達夫 阿部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2013102431A priority Critical patent/JP5892109B2/ja
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Priority to KR1020157031754A priority patent/KR102081378B1/ko
Priority to US14/783,356 priority patent/US20160067749A1/en
Priority to PCT/JP2014/002032 priority patent/WO2014184999A1/ja
Priority to CN201480023016.2A priority patent/CN105164792B/zh
Priority to DE112014002047.8T priority patent/DE112014002047T5/de
Priority to SG11201508731RA priority patent/SG11201508731RA/en
Priority to TW103113720A priority patent/TWI555586B/zh
Publication of JP2014222738A publication Critical patent/JP2014222738A/ja
Publication of JP2014222738A5 publication Critical patent/JP2014222738A5/ja
Application granted granted Critical
Publication of JP5892109B2 publication Critical patent/JP5892109B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
JP2013102431A 2013-05-14 2013-05-14 超音波洗浄装置及び洗浄方法 Active JP5892109B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2013102431A JP5892109B2 (ja) 2013-05-14 2013-05-14 超音波洗浄装置及び洗浄方法
US14/783,356 US20160067749A1 (en) 2013-05-14 2014-04-09 Ultrasonic cleaning apparatus and method for cleaning
PCT/JP2014/002032 WO2014184999A1 (ja) 2013-05-14 2014-04-09 超音波洗浄装置及び洗浄方法
CN201480023016.2A CN105164792B (zh) 2013-05-14 2014-04-09 超声波清洗装置及清洗方法
KR1020157031754A KR102081378B1 (ko) 2013-05-14 2014-04-09 초음파 세정장치 및 세정방법
DE112014002047.8T DE112014002047T5 (de) 2013-05-14 2014-04-09 Ultraschallreinigungsgerät und Reinigungsverfahren
SG11201508731RA SG11201508731RA (en) 2013-05-14 2014-04-09 Ultrasonic cleaning apparatus and method for cleaning
TW103113720A TWI555586B (zh) 2013-05-14 2014-04-15 Ultrasonic cleaning device and cleaning method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013102431A JP5892109B2 (ja) 2013-05-14 2013-05-14 超音波洗浄装置及び洗浄方法

Publications (3)

Publication Number Publication Date
JP2014222738A JP2014222738A (ja) 2014-11-27
JP2014222738A5 JP2014222738A5 (https=) 2015-12-10
JP5892109B2 true JP5892109B2 (ja) 2016-03-23

Family

ID=51897993

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013102431A Active JP5892109B2 (ja) 2013-05-14 2013-05-14 超音波洗浄装置及び洗浄方法

Country Status (8)

Country Link
US (1) US20160067749A1 (https=)
JP (1) JP5892109B2 (https=)
KR (1) KR102081378B1 (https=)
CN (1) CN105164792B (https=)
DE (1) DE112014002047T5 (https=)
SG (1) SG11201508731RA (https=)
TW (1) TWI555586B (https=)
WO (1) WO2014184999A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9687885B2 (en) * 2015-07-17 2017-06-27 Taiwan Semiconductor Manufacturing Co., Ltd. Multi-cycle wafer cleaning method
CN109631365B (zh) * 2018-12-17 2020-04-17 沧州天瑞星光热技术有限公司 一种太阳能真空集热管玻璃外管的清洗方法
CN110756513A (zh) * 2019-09-19 2020-02-07 上海提牛机电设备有限公司 一种以声波作为动能的晶圆清洗装置
JP7308182B2 (ja) * 2020-12-21 2023-07-13 株式会社Ｓｃｒｅｅｎホールディングス ノズル洗浄装置および塗布装置
CN112974396B (zh) * 2021-01-22 2022-07-22 北京北方华创微电子装备有限公司 半导体清洗设备及晶片清洗方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6418229A (en) * 1987-07-14 1989-01-23 Oki Electric Ind Co Ltd Super-ultrasonic cleaning device
JPH079900B2 (ja) * 1990-01-29 1995-02-01 株式会社国際電気エルテック 超音波洗浄装置
JP2002093765A (ja) * 2000-09-20 2002-03-29 Kaijo Corp 基板洗浄方法および基板洗浄装置
JP4752117B2 (ja) * 2001-02-08 2011-08-17 日本テキサス・インスツルメンツ株式会社 半導体ウェハ上の粒子を除去する方法
JP2007044662A (ja) 2005-08-12 2007-02-22 Kaijo Corp 超音波洗浄装置
JP4493675B2 (ja) * 2007-03-14 2010-06-30 株式会社カイジョー 超音波洗浄装置

Also Published As

Publication number Publication date
JP2014222738A (ja) 2014-11-27
CN105164792A (zh) 2015-12-16
CN105164792B (zh) 2017-08-04
SG11201508731RA (en) 2015-11-27
US20160067749A1 (en) 2016-03-10
KR102081378B1 (ko) 2020-02-25
TW201501824A (zh) 2015-01-16
WO2014184999A1 (ja) 2014-11-20
KR20160008535A (ko) 2016-01-22
DE112014002047T5 (de) 2016-01-14
TWI555586B (zh) 2016-11-01

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