KR101079324B1 - 초음파 세정 장치 - Google Patents
초음파 세정 장치 Download PDFInfo
- Publication number
- KR101079324B1 KR101079324B1 KR1020040115531A KR20040115531A KR101079324B1 KR 101079324 B1 KR101079324 B1 KR 101079324B1 KR 1020040115531 A KR1020040115531 A KR 1020040115531A KR 20040115531 A KR20040115531 A KR 20040115531A KR 101079324 B1 KR101079324 B1 KR 101079324B1
- Authority
- KR
- South Korea
- Prior art keywords
- cleaning
- support member
- ultrasonic
- tanks
- cleaned
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
상기 복수의 세정조 각각의 내부에 설치되어 피세정재(被洗淨材)를 지지하는 지지부재; 및
상기 세정액에 상기 피세정재의 세정을 위한 초음파 진동을 제공하는 초음파 진동기
를 포함하고,
상기 복수의 세정조 각각의 내부에 설치되는 지지부재 중 적어도 하나는 설치 위치가 서로 다르거나 단면적이 서로 다른 것을 특징으로 한다.
Claims (5)
- 내부 공간이 형성되며 상기 내부 공간에 세정액이 충전되는 복수의 세정조;상기 복수의 세정조 각각의 내부에 설치되어 피세정재(被洗淨材)를 지지하는 지지부재; 및상기 세정액에 상기 피세정재의 세정을 위한 초음파 진동을 제공하는 초음파 진동기를 포함하고,상기 복수의 세정조 각각의 내부에 설치되는 지지부재 중 적어도 하나는 설치 위치가 서로 다르거나 단면적이 서로 다른 초음파 세정 장치.
- 제 1 항에 있어서,상기 지지부재는, 상기 피세정재의 하부 양측 각각을 지지하는 제1 지지부재 및 제2 지지부재와, 상기 제1 지지부재와 상기 제2 지지부재 사이에서 상기 피세정재의 하부 중앙부 부근을 지지하는 제3 지지부재를 포함하는 초음파 세정 장치.
- 제 2 항에 있어서,상기 제3 지지부재는, 상기 복수개의 세정조중 제1 세정조에서는 상기 피세정재의 중심을 지나는 수직 가상선을 기준으로 일측으로 설치되고 상기 복수개의 세정조중에서 제2 세정조에서는 다른 일측으로 설치되는 초음파 세정 장치.
- 제 2 항에 있어서,상기 복수개의 세정조의 제 1 세정조와 제 2 세정조에서 상기 제1 지지부재, 제2 지지부재 및 제3 지지부재 중 적어도 어느 하나의 설치 위치가 서로 다른 초음파 세정 장치.
- 제 2 항에 있어서,상기 복수개의 세정조의 제 1 세정조와 제 2 세정조에서 상기 제1 지지부재 및 제2 지지부재 중 적어도 어느 하나의 단면적이 서로 다르게 형성되는 초음파 세정 장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040115531A KR101079324B1 (ko) | 2004-12-29 | 2004-12-29 | 초음파 세정 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040115531A KR101079324B1 (ko) | 2004-12-29 | 2004-12-29 | 초음파 세정 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060076907A KR20060076907A (ko) | 2006-07-05 |
KR101079324B1 true KR101079324B1 (ko) | 2011-11-04 |
Family
ID=37169047
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020040115531A KR101079324B1 (ko) | 2004-12-29 | 2004-12-29 | 초음파 세정 장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR101079324B1 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102138383B1 (ko) * | 2014-02-14 | 2020-07-27 | 에스케이실트론 주식회사 | 웨이퍼 세정장치 |
CN116093009B (zh) * | 2022-12-16 | 2024-03-19 | 苏州赛森电子科技有限公司 | 一种清洗机构及硅片去污机 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002059095A (ja) | 2000-08-18 | 2002-02-26 | Dainippon Screen Mfg Co Ltd | 基板洗浄装置 |
JP2003059895A (ja) | 2001-06-08 | 2003-02-28 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
-
2004
- 2004-12-29 KR KR1020040115531A patent/KR101079324B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002059095A (ja) | 2000-08-18 | 2002-02-26 | Dainippon Screen Mfg Co Ltd | 基板洗浄装置 |
JP2003059895A (ja) | 2001-06-08 | 2003-02-28 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20060076907A (ko) | 2006-07-05 |
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