KR102081378B1 - 초음파 세정장치 및 세정방법 - Google Patents
초음파 세정장치 및 세정방법 Download PDFInfo
- Publication number
- KR102081378B1 KR102081378B1 KR1020157031754A KR20157031754A KR102081378B1 KR 102081378 B1 KR102081378 B1 KR 102081378B1 KR 1020157031754 A KR1020157031754 A KR 1020157031754A KR 20157031754 A KR20157031754 A KR 20157031754A KR 102081378 B1 KR102081378 B1 KR 102081378B1
- Authority
- KR
- South Korea
- Prior art keywords
- cleaning
- tank
- washing
- tanks
- ultrasonic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H01L21/02052—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
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- H01L21/463—
-
- H01L21/67057—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
- H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2013-102431 | 2013-05-14 | ||
| JP2013102431A JP5892109B2 (ja) | 2013-05-14 | 2013-05-14 | 超音波洗浄装置及び洗浄方法 |
| PCT/JP2014/002032 WO2014184999A1 (ja) | 2013-05-14 | 2014-04-09 | 超音波洗浄装置及び洗浄方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20160008535A KR20160008535A (ko) | 2016-01-22 |
| KR102081378B1 true KR102081378B1 (ko) | 2020-02-25 |
Family
ID=51897993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020157031754A Active KR102081378B1 (ko) | 2013-05-14 | 2014-04-09 | 초음파 세정장치 및 세정방법 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20160067749A1 (https=) |
| JP (1) | JP5892109B2 (https=) |
| KR (1) | KR102081378B1 (https=) |
| CN (1) | CN105164792B (https=) |
| DE (1) | DE112014002047T5 (https=) |
| SG (1) | SG11201508731RA (https=) |
| TW (1) | TWI555586B (https=) |
| WO (1) | WO2014184999A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9687885B2 (en) * | 2015-07-17 | 2017-06-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | Multi-cycle wafer cleaning method |
| CN109631365B (zh) * | 2018-12-17 | 2020-04-17 | 沧州天瑞星光热技术有限公司 | 一种太阳能真空集热管玻璃外管的清洗方法 |
| CN110756513A (zh) * | 2019-09-19 | 2020-02-07 | 上海提牛机电设备有限公司 | 一种以声波作为动能的晶圆清洗装置 |
| JP7308182B2 (ja) * | 2020-12-21 | 2023-07-13 | 株式会社Screenホールディングス | ノズル洗浄装置および塗布装置 |
| CN112974396B (zh) * | 2021-01-22 | 2022-07-22 | 北京北方华创微电子装备有限公司 | 半导体清洗设备及晶片清洗方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002093765A (ja) * | 2000-09-20 | 2002-03-29 | Kaijo Corp | 基板洗浄方法および基板洗浄装置 |
| JP2008227300A (ja) * | 2007-03-14 | 2008-09-25 | Kaijo Corp | 超音波洗浄装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6418229A (en) * | 1987-07-14 | 1989-01-23 | Oki Electric Ind Co Ltd | Super-ultrasonic cleaning device |
| JPH079900B2 (ja) * | 1990-01-29 | 1995-02-01 | 株式会社国際電気エルテック | 超音波洗浄装置 |
| JP4752117B2 (ja) * | 2001-02-08 | 2011-08-17 | 日本テキサス・インスツルメンツ株式会社 | 半導体ウェハ上の粒子を除去する方法 |
| JP2007044662A (ja) | 2005-08-12 | 2007-02-22 | Kaijo Corp | 超音波洗浄装置 |
-
2013
- 2013-05-14 JP JP2013102431A patent/JP5892109B2/ja active Active
-
2014
- 2014-04-09 KR KR1020157031754A patent/KR102081378B1/ko active Active
- 2014-04-09 US US14/783,356 patent/US20160067749A1/en not_active Abandoned
- 2014-04-09 WO PCT/JP2014/002032 patent/WO2014184999A1/ja not_active Ceased
- 2014-04-09 CN CN201480023016.2A patent/CN105164792B/zh not_active Expired - Fee Related
- 2014-04-09 DE DE112014002047.8T patent/DE112014002047T5/de not_active Withdrawn
- 2014-04-09 SG SG11201508731RA patent/SG11201508731RA/en unknown
- 2014-04-15 TW TW103113720A patent/TWI555586B/zh not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002093765A (ja) * | 2000-09-20 | 2002-03-29 | Kaijo Corp | 基板洗浄方法および基板洗浄装置 |
| JP2008227300A (ja) * | 2007-03-14 | 2008-09-25 | Kaijo Corp | 超音波洗浄装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014222738A (ja) | 2014-11-27 |
| JP5892109B2 (ja) | 2016-03-23 |
| CN105164792A (zh) | 2015-12-16 |
| CN105164792B (zh) | 2017-08-04 |
| SG11201508731RA (en) | 2015-11-27 |
| US20160067749A1 (en) | 2016-03-10 |
| TW201501824A (zh) | 2015-01-16 |
| WO2014184999A1 (ja) | 2014-11-20 |
| KR20160008535A (ko) | 2016-01-22 |
| DE112014002047T5 (de) | 2016-01-14 |
| TWI555586B (zh) | 2016-11-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| AMND | Amendment | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
St.27 status event code: N-2-6-B10-B15-exm-PE0601 |
|
| X091 | Application refused [patent] | ||
| AMND | Amendment | ||
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PX0901 | Re-examination |
St.27 status event code: A-2-3-E10-E12-rex-PX0901 |
|
| PX0701 | Decision of registration after re-examination |
St.27 status event code: A-3-4-F10-F13-rex-PX0701 |
|
| X701 | Decision to grant (after re-examination) | ||
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U12-oth-PR1002 Fee payment year number: 1 |
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| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
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| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
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| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |