TWI555586B - Ultrasonic cleaning device and cleaning method - Google Patents

Ultrasonic cleaning device and cleaning method Download PDF

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Publication number
TWI555586B
TWI555586B TW103113720A TW103113720A TWI555586B TW I555586 B TWI555586 B TW I555586B TW 103113720 A TW103113720 A TW 103113720A TW 103113720 A TW103113720 A TW 103113720A TW I555586 B TWI555586 B TW I555586B
Authority
TW
Taiwan
Prior art keywords
cleaning
ultrasonic
tank
wafer
tanks
Prior art date
Application number
TW103113720A
Other languages
English (en)
Chinese (zh)
Other versions
TW201501824A (zh
Inventor
椛澤均
阿部達夫
Original Assignee
信越半導體股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 信越半導體股份有限公司 filed Critical 信越半導體股份有限公司
Publication of TW201501824A publication Critical patent/TW201501824A/zh
Application granted granted Critical
Publication of TWI555586B publication Critical patent/TWI555586B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
TW103113720A 2013-05-14 2014-04-15 Ultrasonic cleaning device and cleaning method TWI555586B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013102431A JP5892109B2 (ja) 2013-05-14 2013-05-14 超音波洗浄装置及び洗浄方法

Publications (2)

Publication Number Publication Date
TW201501824A TW201501824A (zh) 2015-01-16
TWI555586B true TWI555586B (zh) 2016-11-01

Family

ID=51897993

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103113720A TWI555586B (zh) 2013-05-14 2014-04-15 Ultrasonic cleaning device and cleaning method

Country Status (8)

Country Link
US (1) US20160067749A1 (https=)
JP (1) JP5892109B2 (https=)
KR (1) KR102081378B1 (https=)
CN (1) CN105164792B (https=)
DE (1) DE112014002047T5 (https=)
SG (1) SG11201508731RA (https=)
TW (1) TWI555586B (https=)
WO (1) WO2014184999A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9687885B2 (en) * 2015-07-17 2017-06-27 Taiwan Semiconductor Manufacturing Co., Ltd. Multi-cycle wafer cleaning method
CN109631365B (zh) * 2018-12-17 2020-04-17 沧州天瑞星光热技术有限公司 一种太阳能真空集热管玻璃外管的清洗方法
CN110756513A (zh) * 2019-09-19 2020-02-07 上海提牛机电设备有限公司 一种以声波作为动能的晶圆清洗装置
JP7308182B2 (ja) * 2020-12-21 2023-07-13 株式会社Ｓｃｒｅｅｎホールディングス ノズル洗浄装置および塗布装置
CN112974396B (zh) * 2021-01-22 2022-07-22 北京北方华创微电子装备有限公司 半导体清洗设备及晶片清洗方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002093765A (ja) * 2000-09-20 2002-03-29 Kaijo Corp 基板洗浄方法および基板洗浄装置
JP2008227300A (ja) * 2007-03-14 2008-09-25 Kaijo Corp 超音波洗浄装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6418229A (en) * 1987-07-14 1989-01-23 Oki Electric Ind Co Ltd Super-ultrasonic cleaning device
JPH079900B2 (ja) * 1990-01-29 1995-02-01 株式会社国際電気エルテック 超音波洗浄装置
JP4752117B2 (ja) * 2001-02-08 2011-08-17 日本テキサス・インスツルメンツ株式会社 半導体ウェハ上の粒子を除去する方法
JP2007044662A (ja) 2005-08-12 2007-02-22 Kaijo Corp 超音波洗浄装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002093765A (ja) * 2000-09-20 2002-03-29 Kaijo Corp 基板洗浄方法および基板洗浄装置
JP2008227300A (ja) * 2007-03-14 2008-09-25 Kaijo Corp 超音波洗浄装置

Also Published As

Publication number Publication date
JP2014222738A (ja) 2014-11-27
JP5892109B2 (ja) 2016-03-23
CN105164792A (zh) 2015-12-16
CN105164792B (zh) 2017-08-04
SG11201508731RA (en) 2015-11-27
US20160067749A1 (en) 2016-03-10
KR102081378B1 (ko) 2020-02-25
TW201501824A (zh) 2015-01-16
WO2014184999A1 (ja) 2014-11-20
KR20160008535A (ko) 2016-01-22
DE112014002047T5 (de) 2016-01-14

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