Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B08—CLEANING
  • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
  • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
  • B08B3/04—Cleaning involving contact with liquid
  • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
  • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P70/00—Cleaning of wafers, substrates or parts of devices
  • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
  • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
  • H10P72/04—Apparatus for manufacture or treatment
  • H10P72/0402—Apparatus for fluid treatment
  • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
  • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
  • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Applications Claiming Priority (2)

Publications (1)

Family

ID=51897993

Family Applications (1)

Country Status (8)

Families Citing this family (5)

Family Cites Families (6)

• 2013
  • 2013-05-14 JP JP2013102431A patent/JP5892109B2/ja active Active
• 2014
  • 2014-04-09 KR KR1020157031754A patent/KR102081378B1/ko active Active
  • 2014-04-09 US US14/783,356 patent/US20160067749A1/en not_active Abandoned
  • 2014-04-09 WO PCT/JP2014/002032 patent/WO2014184999A1/ja not_active Ceased
  • 2014-04-09 CN CN201480023016.2A patent/CN105164792B/zh not_active Expired - Fee Related
  • 2014-04-09 DE DE112014002047.8T patent/DE112014002047T5/de not_active Withdrawn
  • 2014-04-09 SG SG11201508731RA patent/SG11201508731RA/en unknown
  • 2014-04-15 TW TW103113720A patent/TWI555586B/zh not_active IP Right Cessation

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