SG10201509581SA - Ultrasonic cleaning method and ultrasonic cleaning apparatus - Google Patents

Ultrasonic cleaning method and ultrasonic cleaning apparatus

Info

Publication number
SG10201509581SA
SG10201509581SA SG10201509581SA SG10201509581SA SG10201509581SA SG 10201509581S A SG10201509581S A SG 10201509581SA SG 10201509581S A SG10201509581S A SG 10201509581SA SG 10201509581S A SG10201509581S A SG 10201509581SA SG 10201509581S A SG10201509581S A SG 10201509581SA
Authority
SG
Singapore
Prior art keywords
ultrasonic cleaning
cleaning apparatus
cleaning method
ultrasonic
cleaning
Prior art date
Application number
SG10201509581SA
Inventor
Haibara Teruo
Kubo Etsuko
Mori Yoshihiro
Uchibe Masashi
Original Assignee
Siltronic Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic Ag filed Critical Siltronic Ag
Publication of SG10201509581SA publication Critical patent/SG10201509581SA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
SG10201509581SA 2012-05-24 2013-05-10 Ultrasonic cleaning method and ultrasonic cleaning apparatus SG10201509581SA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012118634A JP5872382B2 (en) 2012-05-24 2012-05-24 Ultrasonic cleaning method

Publications (1)

Publication Number Publication Date
SG10201509581SA true SG10201509581SA (en) 2015-12-30

Family

ID=48428375

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201509581SA SG10201509581SA (en) 2012-05-24 2013-05-10 Ultrasonic cleaning method and ultrasonic cleaning apparatus

Country Status (7)

Country Link
US (1) US9773688B2 (en)
EP (1) EP2666553B1 (en)
JP (1) JP5872382B2 (en)
KR (2) KR20130132270A (en)
CN (1) CN103418574B (en)
SG (1) SG10201509581SA (en)
TW (1) TWI548469B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5872382B2 (en) * 2012-05-24 2016-03-01 ジルトロニック アクチエンゲゼルシャフトＳｉｌｔｒｏｎｉｃ ＡＧ Ultrasonic cleaning method
FR3006209B1 (en) * 2013-05-31 2016-05-06 Michel Bourdat DEVICE AND METHOD FOR CLEANING PLATE-SHAPED OBJECTS
US10994311B2 (en) 2013-05-31 2021-05-04 Michel Bourdat Specific device for cleaning electronic components and/or circuits
CN106311665A (en) * 2016-11-18 2017-01-11 吕刚 Silicon single crystal rod cleaning raw material preparation device for battery piece production
JP6673527B2 (en) 2017-03-16 2020-03-25 日本製鉄株式会社 Ultrasonic cleaning device and ultrasonic cleaning method
CN108950630B (en) * 2018-09-20 2023-09-12 江苏金曼科技有限责任公司 Ultrasonic cleaning device for electroplated part
JP7131622B2 (en) * 2018-09-26 2022-09-06 日本製鉄株式会社 METHOD AND APPARATUS FOR CLEANING METAL PIPE
KR102379163B1 (en) * 2020-01-31 2022-03-25 에스케이실트론 주식회사 First cleaning apparatus, cleaning equipment and method including the same

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JP5526118B2 (en) * 2011-12-26 2014-06-18 ジルトロニック アクチエンゲゼルシャフト Ultrasonic cleaning method
JP5453488B2 (en) * 2012-05-24 2014-03-26 ジルトロニック アクチエンゲゼルシャフト Ultrasonic cleaning method and ultrasonic cleaning apparatus
JP5453487B2 (en) * 2012-05-24 2014-03-26 ジルトロニック アクチエンゲゼルシャフト Ultrasonic cleaning method and ultrasonic cleaning apparatus
JP5872382B2 (en) * 2012-05-24 2016-03-01 ジルトロニック アクチエンゲゼルシャフトＳｉｌｔｒｏｎｉｃ ＡＧ Ultrasonic cleaning method
JP5894858B2 (en) * 2012-05-24 2016-03-30 ジルトロニック アクチエンゲゼルシャフトＳｉｌｔｒｏｎｉｃ ＡＧ Ultrasonic cleaning method

Also Published As

Publication number Publication date
EP2666553A1 (en) 2013-11-27
TWI548469B (en) 2016-09-11
JP2013247184A (en) 2013-12-09
KR20130132270A (en) 2013-12-04
US20130312785A1 (en) 2013-11-28
TW201402237A (en) 2014-01-16
CN103418574B (en) 2016-12-07
EP2666553B1 (en) 2015-12-30
US9773688B2 (en) 2017-09-26
KR101990175B1 (en) 2019-06-17
CN103418574A (en) 2013-12-04
KR20150075070A (en) 2015-07-02
JP5872382B2 (en) 2016-03-01

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