JP5876767B2 - めっき装置及びめっき液管理方法 - Google Patents

めっき装置及びめっき液管理方法 Download PDF

Info

Publication number
JP5876767B2
JP5876767B2 JP2012111115A JP2012111115A JP5876767B2 JP 5876767 B2 JP5876767 B2 JP 5876767B2 JP 2012111115 A JP2012111115 A JP 2012111115A JP 2012111115 A JP2012111115 A JP 2012111115A JP 5876767 B2 JP5876767 B2 JP 5876767B2
Authority
JP
Japan
Prior art keywords
plating solution
plating
dialysis
tank
free acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012111115A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013237894A5 (enExample
JP2013237894A (ja
Inventor
裕二 荒木
裕二 荒木
下山　正
正 下山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2012111115A priority Critical patent/JP5876767B2/ja
Priority to TW102115693A priority patent/TW201350625A/zh
Priority to KR1020130052387A priority patent/KR20130127921A/ko
Priority to EP13020015.7A priority patent/EP2664692A3/en
Priority to US13/893,940 priority patent/US20130306483A1/en
Priority to CN2013101802397A priority patent/CN103422140A/zh
Publication of JP2013237894A publication Critical patent/JP2013237894A/ja
Publication of JP2013237894A5 publication Critical patent/JP2013237894A5/ja
Application granted granted Critical
Publication of JP5876767B2 publication Critical patent/JP5876767B2/ja
Priority to KR1020160100330A priority patent/KR20160098144A/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/22—Regeneration of process solutions by ion-exchange
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
JP2012111115A 2012-05-15 2012-05-15 めっき装置及びめっき液管理方法 Active JP5876767B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2012111115A JP5876767B2 (ja) 2012-05-15 2012-05-15 めっき装置及びめっき液管理方法
TW102115693A TW201350625A (zh) 2012-05-15 2013-05-02 鍍敷裝置及鍍敷液管理方法
KR1020130052387A KR20130127921A (ko) 2012-05-15 2013-05-09 도금 장치 및 도금액 관리 방법
US13/893,940 US20130306483A1 (en) 2012-05-15 2013-05-14 Plating apparatus and plating solution management method
EP13020015.7A EP2664692A3 (en) 2012-05-15 2013-05-14 Plating apparatus and plating solution management method
CN2013101802397A CN103422140A (zh) 2012-05-15 2013-05-15 电镀装置以及电镀液管理方法
KR1020160100330A KR20160098144A (ko) 2012-05-15 2016-08-05 도금 장치 및 도금액 관리 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012111115A JP5876767B2 (ja) 2012-05-15 2012-05-15 めっき装置及びめっき液管理方法

Publications (3)

Publication Number Publication Date
JP2013237894A JP2013237894A (ja) 2013-11-28
JP2013237894A5 JP2013237894A5 (enExample) 2014-11-13
JP5876767B2 true JP5876767B2 (ja) 2016-03-02

Family

ID=48463682

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012111115A Active JP5876767B2 (ja) 2012-05-15 2012-05-15 めっき装置及びめっき液管理方法

Country Status (6)

Country Link
US (1) US20130306483A1 (enExample)
EP (1) EP2664692A3 (enExample)
JP (1) JP5876767B2 (enExample)
KR (2) KR20130127921A (enExample)
CN (1) CN103422140A (enExample)
TW (1) TW201350625A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6022922B2 (ja) * 2012-12-13 2016-11-09 株式会社荏原製作所 Ｓｎ合金めっき装置及び方法
US20150247251A1 (en) * 2014-02-28 2015-09-03 Applied Materials, Inc. Methods for electrochemical deposition of multi-component solder using cation permeable barrier
KR101631484B1 (ko) 2014-12-19 2016-06-17 주식회사 포스코 니켈도금용액 관리 장치
CN105177646B (zh) * 2015-08-27 2017-12-08 江苏智光创业投资有限公司 一种用于生产无氰镀铜溶液的装置
KR102002342B1 (ko) * 2018-06-28 2019-07-23 김대범 도금액 교반 및 공급 장치
JP7293765B2 (ja) * 2018-07-24 2023-06-20 富士フイルムビジネスイノベーション株式会社 めっき装置
CN110161306A (zh) * 2019-05-31 2019-08-23 苏州迅鹏仪器仪表有限公司 多回路安培小时总计量仪表和电镀控制系统及方法
CN110318090B (zh) * 2019-08-08 2021-08-31 湖南金康电路板有限公司 一种印刷电路板电镀装置及电镀方法
CN111663172A (zh) * 2020-05-28 2020-09-15 甬矽电子(宁波)股份有限公司 电镀化学品监控方法、系统和装置
KR102192890B1 (ko) * 2020-07-10 2020-12-18 김춘옥 유전체 세라믹 필터 디핑 방법
JP7484865B2 (ja) * 2021-10-14 2024-05-16 トヨタ自動車株式会社 金属皮膜の成膜装置および金属皮膜の成膜方法

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3244620A (en) * 1964-11-02 1966-04-05 Dow Chemical Co Separation of acid from polymers by dialysis with anion-exchange membranes
DE2729387A1 (de) * 1977-06-27 1979-01-18 Schering Ag Verfahren zur kontinuierlichen aufbereitung eines galvanischen nickelbades sowie vorrichtung zur durchfuehrung des verfahrens
FI71573C (fi) * 1979-06-15 1987-01-19 Akzo Nv Foerfarande och anordning foer minskning av jaesta dryckers alkoholhalt genom dialys.
JPS5940239B2 (ja) * 1980-07-26 1984-09-28 住友金属工業株式会社 電気メツキ浴のｐＨ調整方法
GB2111080A (en) * 1981-12-08 1983-06-29 Ppg Industries Inc Electrodeposition bath treatment
JPS5928584A (ja) 1982-08-10 1984-02-15 Asahi Glass Co Ltd 電解槽又は透析槽への液の供給方法
JPS5967387A (ja) * 1982-10-08 1984-04-17 Hiyougoken すず、鉛及びすず―鉛合金メッキ浴
US4816407A (en) * 1985-10-11 1989-03-28 Sepracor Inc. Production of low-ethanol beverages by membrane extraction
JPH01312099A (ja) 1988-06-10 1989-12-15 Asahi Glass Co Ltd 電気メッキ浴の管理方法
DE4106080A1 (de) * 1991-02-27 1991-06-20 Volker Dipl Ing Teuchert Verfahren zur automatischen regelung der konzentration eines stoffes in der aus einem zur reduzierung der konzentration dieses stoffes eingesetzten dialysators austretenden fluessigkeit
JP2559935B2 (ja) * 1991-12-20 1996-12-04 日本リーロナール株式会社 不溶性陽極を用いた錫又は錫ー鉛合金電気めっきの方法及び装置
JP2888001B2 (ja) * 1992-01-09 1999-05-10 日本電気株式会社 金属メッキ装置
JP3066675B2 (ja) * 1992-04-20 2000-07-17 富士写真フイルム株式会社 印刷版用アルミニウム板の表面処理方法
JP3437600B2 (ja) * 1993-03-15 2003-08-18 株式会社荏原製作所 はんだめっき液自動分析方法及び装置
JP3213113B2 (ja) * 1993-03-15 2001-10-02 株式会社荏原製作所 はんだめっき液自動管理装置
US5312539A (en) * 1993-06-15 1994-05-17 Learonal Inc. Electrolytic tin plating method
DE4344387C2 (de) * 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens
JP3241227B2 (ja) * 1995-02-14 2001-12-25 株式会社東芝 メッキ液自動管理装置
JPH08271497A (ja) * 1995-03-29 1996-10-18 C Uyemura & Co Ltd 電気銅めっき浴中の電解生成物濃度の測定方法
JPH0975681A (ja) 1995-09-13 1997-03-25 Japan Nuclear Fuel Co Ltd<Jnf> 拡散透析装置及び方法
US6562220B2 (en) * 1999-03-19 2003-05-13 Technic, Inc. Metal alloy sulfate electroplating baths
JP2002241991A (ja) * 2001-02-14 2002-08-28 Canon Inc 酸化亜鉛膜の成膜方法及び成膜装置
JP4698904B2 (ja) 2001-09-20 2011-06-08 株式会社大和化成研究所 錫又は錫系合金めっき浴、該めっき浴の建浴用又は維持・補給用の錫塩及び酸又は錯化剤溶液並びに該めっき浴を用いて製作した電気・電子部品
US7012333B2 (en) * 2002-12-26 2006-03-14 Ebara Corporation Lead free bump and method of forming the same
JP4441725B2 (ja) * 2003-11-04 2010-03-31 石原薬品株式会社 電気スズ合金メッキ方法
KR20060043958A (ko) * 2004-11-11 2006-05-16 주식회사 팬택 이동통신단말기를 이용한 설문조사 방법
WO2006126518A1 (ja) * 2005-05-25 2006-11-30 Think Laboratory Co., Ltd. グラビアシリンダ用銅めっき方法及び装置
JP4812365B2 (ja) * 2005-08-19 2011-11-09 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 錫電気めっき液および錫電気めっき方法
JP4957906B2 (ja) * 2007-07-27 2012-06-20 上村工業株式会社 連続電気銅めっき方法
EP2194165A1 (en) * 2008-10-21 2010-06-09 Rohm and Haas Electronic Materials LLC Method for replenishing tin and its alloying metals in electrolyte solutions
JP5458604B2 (ja) * 2009-03-04 2014-04-02 三菱マテリアル株式会社 Ｓｎ合金めっき装置及びそのＳｎ成分補給方法

Also Published As

Publication number Publication date
TW201350625A (zh) 2013-12-16
TWI560325B (enExample) 2016-12-01
KR20130127921A (ko) 2013-11-25
EP2664692A2 (en) 2013-11-20
JP2013237894A (ja) 2013-11-28
US20130306483A1 (en) 2013-11-21
CN103422140A (zh) 2013-12-04
KR20160098144A (ko) 2016-08-18
EP2664692A3 (en) 2017-02-15

Similar Documents

Publication Publication Date Title
JP5876767B2 (ja) めっき装置及びめっき液管理方法
JP6022922B2 (ja) Ｓｎ合金めっき装置及び方法
JP6268271B2 (ja) めっき方法およびめっき装置
TWI586846B (zh) 具有遠距陰極電解質流體管理之電化學沉積設備
WO2007082112A2 (en) Tin and tin alloy electroplating method with controlled internal stress and grain size of the resulting deposit
US9816197B2 (en) Sn alloy plating apparatus and Sn alloy plating method
CN106350858A (zh) 惰性阳极电镀处理器和补充器
TWI567252B (zh) Sn alloy electrolytic plating method
CN101889107B (zh) 使用电镀技术镀覆金属合金的系统和方法
JP6139379B2 (ja) Ｓｎ合金めっき装置及びＳｎ合金めっき方法
CN220952151U (zh) 电镀系统
JP7683473B2 (ja) 金属皮膜の成膜装置
JP6706095B2 (ja) 無電解めっき装置および無電解めっき方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140929

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140929

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20150430

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150602

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160105

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160122

R150 Certificate of patent or registration of utility model

Ref document number: 5876767

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250