EP2664692A3 - Plating apparatus and plating solution management method - Google Patents

Plating apparatus and plating solution management method Download PDF

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Publication number
EP2664692A3
EP2664692A3 EP13020015.7A EP13020015A EP2664692A3 EP 2664692 A3 EP2664692 A3 EP 2664692A3 EP 13020015 A EP13020015 A EP 13020015A EP 2664692 A3 EP2664692 A3 EP 2664692A3
Authority
EP
European Patent Office
Prior art keywords
plating solution
plating
free acid
dialysis
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13020015.7A
Other languages
German (de)
French (fr)
Other versions
EP2664692A2 (en
Inventor
Yuji Araki
Masashi Shimoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of EP2664692A2 publication Critical patent/EP2664692A2/en
Publication of EP2664692A3 publication Critical patent/EP2664692A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/22—Regeneration of process solutions by ion-exchange
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)

Abstract

A plating apparatus plates a substrate with Sn alloy to form an Sn alloy film on a surface of the substrate. The apparatus includes: a plating bath for retaining a plating solution therein, the substrate being immersed in the plating solution in a position opposite to an insoluble anode; a plating solution dialysis line for extracting the plating solution from the plating bath and returning the plating solution to the plating bath; a dialysis cell provided in the plating solution dialysis line and configured to remove a free acid from the plating solution by dialysis using an anion exchange membrane; a free acid concentration analyzer; and a controller for controlling a flow rate of the plating solution flowing through the plating solution dialysis line based on the concentration of the free acid measured by the free acid concentration analyzer.
EP13020015.7A 2012-05-15 2013-05-14 Plating apparatus and plating solution management method Withdrawn EP2664692A3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012111115A JP5876767B2 (en) 2012-05-15 2012-05-15 Plating apparatus and plating solution management method

Publications (2)

Publication Number Publication Date
EP2664692A2 EP2664692A2 (en) 2013-11-20
EP2664692A3 true EP2664692A3 (en) 2017-02-15

Family

ID=48463682

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13020015.7A Withdrawn EP2664692A3 (en) 2012-05-15 2013-05-14 Plating apparatus and plating solution management method

Country Status (6)

Country Link
US (1) US20130306483A1 (en)
EP (1) EP2664692A3 (en)
JP (1) JP5876767B2 (en)
KR (2) KR20130127921A (en)
CN (1) CN103422140A (en)
TW (1) TW201350625A (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6022922B2 (en) * 2012-12-13 2016-11-09 株式会社荏原製作所 Sn alloy plating apparatus and method
US20150247251A1 (en) * 2014-02-28 2015-09-03 Applied Materials, Inc. Methods for electrochemical deposition of multi-component solder using cation permeable barrier
KR101631484B1 (en) 2014-12-19 2016-06-17 주식회사 포스코 Apparatus for controlling nikel plating solution
CN105177646B (en) * 2015-08-27 2017-12-08 江苏智光创业投资有限公司 A kind of device for being used to produce cyanide-free copper electroplating solution
KR102002342B1 (en) * 2018-06-28 2019-07-23 김대범 Device for agitating and supplying of plating solution
JP7293765B2 (en) * 2018-07-24 2023-06-20 富士フイルムビジネスイノベーション株式会社 Plating equipment
CN110161306A (en) * 2019-05-31 2019-08-23 苏州迅鹏仪器仪表有限公司 Multiloop ampere-hour total amount instrument and electroplating control system and method
CN110318090B (en) * 2019-08-08 2021-08-31 湖南金康电路板有限公司 Electroplating device and electroplating method for printed circuit board
CN111663172A (en) * 2020-05-28 2020-09-15 甬矽电子(宁波)股份有限公司 Electroplating chemical monitoring method, system and device
KR102192890B1 (en) * 2020-07-10 2020-12-18 김춘옥 Dielectric ceramic filter dipping methodi

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5729600A (en) * 1980-07-26 1982-02-17 Sumitomo Metal Ind Ltd Method for adjusting ph value of electroplating bath
GB2111080A (en) * 1981-12-08 1983-06-29 Ppg Industries Inc Electrodeposition bath treatment
US5312539A (en) * 1993-06-15 1994-05-17 Learonal Inc. Electrolytic tin plating method
JP2002241991A (en) * 2001-02-14 2002-08-28 Canon Inc Method and apparatus for depositing zinc oxide film
JP2005139474A (en) * 2003-11-04 2005-06-02 Ishihara Chem Co Ltd Tin alloy electroplating method

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US3244620A (en) * 1964-11-02 1966-04-05 Dow Chemical Co Separation of acid from polymers by dialysis with anion-exchange membranes
DE2729387A1 (en) * 1977-06-27 1979-01-18 Schering Ag PROCESS FOR CONTINUOUS PREPARATION OF A GALVANIC NICKEL BATH AND DEVICE FOR CARRYING OUT THE PROCESS
FI71573C (en) * 1979-06-15 1987-01-19 Akzo Nv Method and apparatus for reducing fermented beverage alcohol content by dialysis.
JPS5928584A (en) 1982-08-10 1984-02-15 Asahi Glass Co Ltd Method for supplying liquid to electrolytic tank or dialytic tank
JPS5967387A (en) * 1982-10-08 1984-04-17 Hiyougoken Tin, lead and tin-lead alloy plating bath
US4816407A (en) * 1985-10-11 1989-03-28 Sepracor Inc. Production of low-ethanol beverages by membrane extraction
JPH01312099A (en) 1988-06-10 1989-12-15 Asahi Glass Co Ltd Method for controlling electroplating bath
DE4106080A1 (en) * 1991-02-27 1991-06-20 Volker Dipl Ing Teuchert Automatically controlling substance concn. in liq. leaving dialyser - by automatically varying differential pressure between the liquid and the dialysate
JP2559935B2 (en) * 1991-12-20 1996-12-04 日本リーロナール株式会社 Method and apparatus for tin or tin-lead alloy electroplating using insoluble anode
JP2888001B2 (en) * 1992-01-09 1999-05-10 日本電気株式会社 Metal plating equipment
JP3066675B2 (en) * 1992-04-20 2000-07-17 富士写真フイルム株式会社 Surface treatment method for aluminum plate for printing plate
JP3213113B2 (en) * 1993-03-15 2001-10-02 株式会社荏原製作所 Automatic solder plating solution management system
JP3437600B2 (en) * 1993-03-15 2003-08-18 株式会社荏原製作所 Method and apparatus for automatic analysis of solder plating solution
DE4344387C2 (en) * 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Process for the electrolytic deposition of copper and arrangement for carrying out the process
JP3241227B2 (en) * 1995-02-14 2001-12-25 株式会社東芝 Plating solution automatic management device
JPH08271497A (en) * 1995-03-29 1996-10-18 C Uyemura & Co Ltd Method for measuring concentration of electrolytic product in electric copper plating bath
JPH0975681A (en) 1995-09-13 1997-03-25 Japan Nuclear Fuel Co Ltd<Jnf> Diffusion dialysis apparatus and method
US6562220B2 (en) * 1999-03-19 2003-05-13 Technic, Inc. Metal alloy sulfate electroplating baths
JP4698904B2 (en) 2001-09-20 2011-06-08 株式会社大和化成研究所 Tin or tin-based alloy plating bath, tin salt and acid or complexing agent solution for building bath, maintenance or replenishment of the plating bath, and electric / electronic parts manufactured using the plating bath
US7012333B2 (en) * 2002-12-26 2006-03-14 Ebara Corporation Lead free bump and method of forming the same
KR20060043958A (en) * 2004-11-11 2006-05-16 주식회사 팬택 Method for survey using mobile phone
US20090095633A1 (en) * 2005-05-25 2009-04-16 Think Laboratory Co., Ltd. Copper plating method and apparatus for a gravure cylinder
JP4812365B2 (en) * 2005-08-19 2011-11-09 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． Tin electroplating solution and tin electroplating method
JP4957906B2 (en) * 2007-07-27 2012-06-20 上村工業株式会社 Continuous electrolytic copper plating method
EP2194165A1 (en) * 2008-10-21 2010-06-09 Rohm and Haas Electronic Materials LLC Method for replenishing tin and its alloying metals in electrolyte solutions
JP5458604B2 (en) * 2009-03-04 2014-04-02 三菱マテリアル株式会社 Sn alloy plating apparatus and its Sn component replenishment method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5729600A (en) * 1980-07-26 1982-02-17 Sumitomo Metal Ind Ltd Method for adjusting ph value of electroplating bath
GB2111080A (en) * 1981-12-08 1983-06-29 Ppg Industries Inc Electrodeposition bath treatment
US5312539A (en) * 1993-06-15 1994-05-17 Learonal Inc. Electrolytic tin plating method
JP2002241991A (en) * 2001-02-14 2002-08-28 Canon Inc Method and apparatus for depositing zinc oxide film
JP2005139474A (en) * 2003-11-04 2005-06-02 Ishihara Chem Co Ltd Tin alloy electroplating method

Also Published As

Publication number Publication date
KR20130127921A (en) 2013-11-25
EP2664692A2 (en) 2013-11-20
CN103422140A (en) 2013-12-04
JP5876767B2 (en) 2016-03-02
US20130306483A1 (en) 2013-11-21
TWI560325B (en) 2016-12-01
TW201350625A (en) 2013-12-16
JP2013237894A (en) 2013-11-28
KR20160098144A (en) 2016-08-18

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