JP5864954B2 - 基材 - Google Patents

基材 Download PDF

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Publication number
JP5864954B2
JP5864954B2 JP2011185134A JP2011185134A JP5864954B2 JP 5864954 B2 JP5864954 B2 JP 5864954B2 JP 2011185134 A JP2011185134 A JP 2011185134A JP 2011185134 A JP2011185134 A JP 2011185134A JP 5864954 B2 JP5864954 B2 JP 5864954B2
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JP
Japan
Prior art keywords
layer
wiring
base material
layers
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011185134A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013046036A5 (enExample
JP2013046036A (ja
Inventor
堀内　道夫
道夫 堀内
徳武　安衛
安衛 徳武
勇一 松田
勇一 松田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2011185134A priority Critical patent/JP5864954B2/ja
Priority to US13/588,013 priority patent/US20130048350A1/en
Publication of JP2013046036A publication Critical patent/JP2013046036A/ja
Publication of JP2013046036A5 publication Critical patent/JP2013046036A5/ja
Application granted granted Critical
Publication of JP5864954B2 publication Critical patent/JP5864954B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2011185134A 2011-08-26 2011-08-26 基材 Expired - Fee Related JP5864954B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011185134A JP5864954B2 (ja) 2011-08-26 2011-08-26 基材
US13/588,013 US20130048350A1 (en) 2011-08-26 2012-08-17 Base member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011185134A JP5864954B2 (ja) 2011-08-26 2011-08-26 基材

Publications (3)

Publication Number Publication Date
JP2013046036A JP2013046036A (ja) 2013-03-04
JP2013046036A5 JP2013046036A5 (enExample) 2014-08-14
JP5864954B2 true JP5864954B2 (ja) 2016-02-17

Family

ID=47741998

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011185134A Expired - Fee Related JP5864954B2 (ja) 2011-08-26 2011-08-26 基材

Country Status (2)

Country Link
US (1) US20130048350A1 (enExample)
JP (1) JP5864954B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140151095A1 (en) * 2012-12-05 2014-06-05 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method for manufacturing the same
WO2017154167A1 (ja) * 2016-03-10 2017-09-14 三井金属鉱業株式会社 多層積層板及びこれを用いた多層プリント配線板の製造方法
JP7213469B2 (ja) * 2017-03-31 2023-01-27 パナソニックＩｐマネジメント株式会社 半導体装置及びその製造方法
TWI883065B (zh) * 2019-11-05 2025-05-11 南韓商普因特工程有限公司 多層配線基板及包括其的探針卡
KR102885840B1 (ko) * 2020-03-30 2025-11-13 (주)포인트엔지니어링 양극산화막 구조체

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4712161A (en) * 1985-03-25 1987-12-08 Olin Corporation Hybrid and multi-layer circuitry
JPH10173410A (ja) * 1996-12-12 1998-06-26 Sharp Corp ストリップ線路を用いた伝送回路
JPH11214450A (ja) * 1997-11-18 1999-08-06 Matsushita Electric Ind Co Ltd 電子部品実装体とそれを用いた電子機器と電子部品実装体の製造方法
JP3603663B2 (ja) * 1999-04-28 2004-12-22 株式会社デンソー 厚膜回路基板とその製造方法
JP3530149B2 (ja) * 2001-05-21 2004-05-24 新光電気工業株式会社 配線基板の製造方法及び半導体装置
JP3964822B2 (ja) * 2003-05-07 2007-08-22 日東電工株式会社 回路付サスペンション基板の製造方法
TWI255466B (en) * 2004-10-08 2006-05-21 Ind Tech Res Inst Polymer-matrix conductive film and method for fabricating the same
JP5068060B2 (ja) * 2006-10-30 2012-11-07 新光電気工業株式会社 半導体パッケージおよびその製造方法
JPWO2008069055A1 (ja) * 2006-11-28 2010-03-18 京セラ株式会社 配線基板およびそれを用いた半導体素子の実装構造体
TWI343109B (en) * 2007-03-23 2011-06-01 Unimicron Technology Corp Flip-chip substrate using aluminum oxide as its core sunbstrate
JP5145110B2 (ja) * 2007-12-10 2013-02-13 富士フイルム株式会社 異方導電性接合パッケージの製造方法
JP5385682B2 (ja) * 2009-05-19 2014-01-08 新光電気工業株式会社 電子部品の実装構造
JP2011151185A (ja) * 2010-01-21 2011-08-04 Shinko Electric Ind Co Ltd 配線基板及び半導体装置

Also Published As

Publication number Publication date
JP2013046036A (ja) 2013-03-04
US20130048350A1 (en) 2013-02-28

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