JP5861868B2 - 電子回路および電子回路の製造方法 - Google Patents

電子回路および電子回路の製造方法 Download PDF

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Publication number
JP5861868B2
JP5861868B2 JP2011241943A JP2011241943A JP5861868B2 JP 5861868 B2 JP5861868 B2 JP 5861868B2 JP 2011241943 A JP2011241943 A JP 2011241943A JP 2011241943 A JP2011241943 A JP 2011241943A JP 5861868 B2 JP5861868 B2 JP 5861868B2
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electronic circuit
ended
conductors
dielectric
signal
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Expired - Fee Related
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JP2011241943A
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Japanese (ja)
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JP2013098888A (ja
JP2013098888A5 (enExample
Inventor
智有 板垣
智有 板垣
研一 川崎
研一 川崎
健太郎 安仲
健太郎 安仲
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Sony Corp
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Sony Corp
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Priority to JP2011241943A priority Critical patent/JP5861868B2/ja
Priority to US13/660,111 priority patent/US9596750B2/en
Priority to CN201210413331.9A priority patent/CN103094653B/zh
Publication of JP2013098888A publication Critical patent/JP2013098888A/ja
Publication of JP2013098888A5 publication Critical patent/JP2013098888A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6611—Wire connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6638—Differential pair signal lines
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    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
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    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1903—Structure including wave guides
    • H01L2924/19033—Structure including wave guides being a coplanar line type
    • H—ELECTRICITY
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1903—Structure including wave guides
    • H01L2924/19038—Structure including wave guides being a hybrid line type
    • H01L2924/19039—Structure including wave guides being a hybrid line type impedance transition between different types of wave guides
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    • H01L2924/30—Technical effects
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    • H01L2924/30107—Inductance
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Near-Field Transmission Systems (AREA)
JP2011241943A 2011-11-04 2011-11-04 電子回路および電子回路の製造方法 Expired - Fee Related JP5861868B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011241943A JP5861868B2 (ja) 2011-11-04 2011-11-04 電子回路および電子回路の製造方法
US13/660,111 US9596750B2 (en) 2011-11-04 2012-10-25 Electronic circuit, method of manufacturing electronic circuit, and mounting member
CN201210413331.9A CN103094653B (zh) 2011-11-04 2012-10-25 电子电路、电子电路的制造方法和安装部件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011241943A JP5861868B2 (ja) 2011-11-04 2011-11-04 電子回路および電子回路の製造方法

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JP2013098888A JP2013098888A (ja) 2013-05-20
JP2013098888A5 JP2013098888A5 (enExample) 2014-12-04
JP5861868B2 true JP5861868B2 (ja) 2016-02-16

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US (1) US9596750B2 (enExample)
JP (1) JP5861868B2 (enExample)
CN (1) CN103094653B (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012155142A1 (en) 2011-05-12 2012-11-15 Olive Medical Corporation Pixel array area optimization using stacking scheme for hybrid image sensor with minimal vertical interconnects
BR112015001369A2 (pt) 2012-07-26 2017-07-04 Olive Medical Corp sistema de câmera com sensor de imagem cmos monolítico de área mínima
CN107278029A (zh) 2012-12-21 2017-10-20 华为终端有限公司 电子装置和栅格阵列模块
WO2014145248A1 (en) 2013-03-15 2014-09-18 Olive Medical Corporation Minimize image sensor i/o and conductor counts in endoscope applications
CN105246394B (zh) * 2013-03-15 2018-01-12 德普伊新特斯产品公司 无输入时钟和数据传输时钟的图像传感器同步
US9955568B2 (en) * 2014-01-24 2018-04-24 Dell Products, Lp Structure to dampen barrel resonance of unused portion of printed circuit board via
CN105990633A (zh) * 2015-01-29 2016-10-05 安弗施无线射频系统（上海）有限公司 传输线、传输装置以及移相设备
JP2017121032A (ja) * 2015-06-30 2017-07-06 住友電気工業株式会社 高周波装置
CN105636341A (zh) * 2016-01-01 2016-06-01 广州兴森快捷电路科技有限公司 一种具有空腔结构的pcb板及其制作方法
CN105808491A (zh) * 2016-03-03 2016-07-27 北京小米移动软件有限公司 带状差分线、智能设备及改善智能设备usb眼图的方法
CN108811314B (zh) * 2016-08-17 2020-10-13 赣州轩义科技有限公司 一种基于高厚径比深孔电镀技术高频高速电子线路板
WO2018220823A1 (ja) * 2017-06-02 2018-12-06 三菱電機株式会社 プリント回路基板
JP6465451B1 (ja) 2018-03-30 2019-02-06 三菱電機株式会社 電子回路
CN109888473B (zh) * 2019-01-30 2020-11-24 东南大学 一种与芯片键合的宽带贴片天线
JP7286389B2 (ja) * 2019-04-15 2023-06-05 キヤノン株式会社 無線通信装置、無線通信システムおよび通信方法
US11270972B2 (en) * 2019-06-12 2022-03-08 Nxp B.V. Package with conductive underfill ground plane
US11367697B2 (en) * 2020-05-15 2022-06-21 Qualcomm Incorporated High-density flip chip package for wireless transceivers
US12477654B2 (en) * 2022-04-01 2025-11-18 Macom Technology Solutions Holdings, Inc. RF power pallet with management daughter board

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0522004A (ja) * 1991-07-10 1993-01-29 Nippon Telegr & Teleph Corp <Ntt> 伝送路配線
US5534830A (en) * 1995-01-03 1996-07-09 R F Prime Corporation Thick film balanced line structure, and microwave baluns, resonators, mixers, splitters, and filters constructed therefrom
DK174111B1 (da) * 1998-01-26 2002-06-24 Giga As Elektrisk forbindelseselement samt fremgangsmåde til fremstilling af et sådant
EP1098555B1 (en) * 1999-11-02 2008-07-23 Canon Kabushiki Kaisha Printed-wiring board
JP3839381B2 (ja) 2002-09-12 2006-11-01 日本電信電話株式会社 平衡非平衡変換器
JP3872413B2 (ja) * 2002-11-05 2007-01-24 三菱電機株式会社 半導体装置
JP2004304134A (ja) * 2003-04-01 2004-10-28 Toshiba Corp 配線基板及びその製造方法
JP2005051496A (ja) * 2003-07-28 2005-02-24 Kanji Otsuka 信号伝送システム及び信号伝送線路
JP4511294B2 (ja) * 2004-09-22 2010-07-28 京セラ株式会社 配線基板
DE102006007381A1 (de) * 2006-02-15 2007-08-23 Infineon Technologies Ag Halbleiterbauelement für einen Ultraweitband-Standard in der Ultrahochfrequenz-Kommunikation und Verfahren zur Herstellung desselben
JP4616861B2 (ja) * 2007-05-25 2011-01-19 富士ゼロックス株式会社 信号伝送回路及び信号伝送システム
KR100771529B1 (ko) * 2007-05-30 2007-10-30 이엠와이즈 통신(주) 초광대역 발룬 및 그 응용 모듈
JP5526659B2 (ja) * 2008-09-25 2014-06-18 ソニー株式会社 ミリ波誘電体内伝送装置
JP5146267B2 (ja) * 2008-11-05 2013-02-20 ソニー株式会社 配線基板、プリント配線板の製造方法
US8179333B2 (en) * 2009-05-08 2012-05-15 Anokiwave, Inc. Antennas using chip-package interconnections for millimeter-wave wireless communication
US8283991B1 (en) * 2011-06-10 2012-10-09 Raytheon Company Wideband, differential signal balun for rejecting common mode electromagnetic fields

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US20130114218A1 (en) 2013-05-09
JP2013098888A (ja) 2013-05-20
US9596750B2 (en) 2017-03-14
CN103094653B (zh) 2017-09-22
CN103094653A (zh) 2013-05-08

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