JP5850271B2 - 信号処理装置 - Google Patents
信号処理装置 Download PDFInfo
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- JP5850271B2 JP5850271B2 JP2013557481A JP2013557481A JP5850271B2 JP 5850271 B2 JP5850271 B2 JP 5850271B2 JP 2013557481 A JP2013557481 A JP 2013557481A JP 2013557481 A JP2013557481 A JP 2013557481A JP 5850271 B2 JP5850271 B2 JP 5850271B2
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
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- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
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- H01L2223/66—High-frequency adaptations
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- H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
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- H01L2924/0001—Technical content checked by a classifier
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
Description
複数の信号処理回路を備え、
前記信号処理回路は、
所定の周波数帯域の信号の入力インターフェースとして機能する入力回路、及び、前記所定の周波数帯域の信号の出力インターフェースとして機能する出力回路のうちの一方、又は、両方で構成される入出力回路を有し、
他の信号処理回路との間で、前記所定の周波数帯域の信号の伝送を行い、
1の信号処理回路の前記出力回路と、他の1の信号処理回路の前記出力回路とは、同一構成の回路を有し、
1の信号処理回路の前記入力回路と、他の1の信号処理回路の前記入力回路とは、他の同一構成の回路を有し、
1の信号処理回路の前記入出力回路と、他の1の信号処理回路の入出力回路とは、特性が異なる複数の伝送媒体のうちのいずれを介しても、前記所定の周波数帯域の信号の伝送が可能である
信号処理装置。
[2]
前記所定の周波数帯域の信号は、ミリ波帯の信号である
[1]に記載の信号処理装置。
[3]
前記同一構成の回路は、ベースバンドの信号を前記ミリ波帯の信号に変換する変換回路であり、
前記他の同一構成の回路は、前記ミリ波帯の信号を前記ベースバンドの信号に逆変換する逆変換回路である
[2]に記載の信号処理装置。
[4]
前記特性が異なる複数の伝送媒体は、種類が異なる複数の伝送媒体である
[1]ないし[3]のいずれかに記載の信号処理装置。
[5]
前記種類が異なる複数の伝送媒体は、自由空間、誘電体導波路、及び、メタリック線のうちの2つ以上である
[4]に記載の信号処理装置。
[6]
前記複数の信号処理回路のうちの、少なくとも、一対の信号処理回路どうしが、所定の特性の伝送媒体を介して、前記所定の周波数帯域の信号の伝送を行い、少なくとも、他の一対の信号処理回路どうしが、前記所定の特性と異なる特性の伝送媒体を介して、前記所定の周波数帯域の信号の伝送を行う
[1]ないし[5]のいずれかに記載の信号処理装置。
[7]
前記信号処理回路は、複数の前記入出力回路を有する
[1]ないし[6]のいずれかに記載の信号処理装置。
[8]
前記所定の周波数帯域の信号の伝送を行う一対の信号処理回路が、別の基板に設けられている
[1]ないし[7]のいずれかに記載の信号処理装置。
Claims (7)
- 複数の信号処理回路を備え、
前記信号処理回路は、
ミリ波帯の信号の入力インターフェースとして機能する入力回路、及び、前記ミリ波帯の信号の出力インターフェースとして機能する出力回路のうちの一方、又は、両方で構成される入出力回路を有し、
他の信号処理回路との間で、前記ミリ波帯の信号の伝送を行い、
1の信号処理回路の前記出力回路と、他の1の信号処理回路の前記出力回路とは、同一構成の回路を有し、
1の信号処理回路の前記入力回路と、他の1の信号処理回路の前記入力回路とは、他の同一構成の回路を有し、
1の信号処理回路の前記入出力回路と、他の1の信号処理回路の入出力回路とは、特性が異なる複数の伝送媒体のうちのいずれを介しても、前記ミリ波帯の信号の伝送が可能であり、
前記複数の信号処理回路のうちの、少なくとも、一対の信号処理回路どうしの前記伝送媒体として、平行に配置された2本の帯状の導体で構成されるコプレーナストリップ線路のうちの一方の前記導体が、前記一対の信号処理回路のうちの一方の前記出力回路および他方の前記入力回路と接続され、他方の前記導体が、グランドに接続され、
前記コプレーナストリップ線路上には誘電体が配置される
信号処理装置。 - 前記同一構成の回路は、ベースバンドの信号を前記ミリ波帯の信号に変換する変換回路であり、
前記他の同一構成の回路は、前記ミリ波帯の信号を前記ベースバンドの信号に逆変換する逆変換回路である
請求項1に記載の信号処理装置。 - 前記特性が異なる複数の伝送媒体は、種類が異なる複数の伝送媒体である
請求項1または請求項2に記載の信号処理装置。 - 前記種類が異なる複数の伝送媒体は、自由空間、誘電体導波路、及び、メタリック線のうちの2つ以上である
請求項3に記載の信号処理装置。 - 前記複数の信号処理回路のうちの、少なくとも、他の一対の信号処理回路どうしが、前記コプレーナストリップ線路の特性と異なる特性の伝送媒体を介して、前記ミリ波帯の信号の伝送を行う
請求項1ないし請求項4のいずれかに記載の信号処理装置。 - 前記信号処理回路は、複数の前記入出力回路を有する
請求項1ないし請求項5のいずれかに記載の信号処理装置。 - 前記ミリ波帯の信号の伝送を行う一対の信号処理回路が、別の基板に設けられている
請求項1ないし請求項6のいずれかに記載の信号処理装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/368,838 US9054078B2 (en) | 2012-02-08 | 2012-02-08 | Signal processing device |
US13/368838 | 2012-02-08 | ||
PCT/JP2013/052176 WO2013118631A1 (ja) | 2012-02-08 | 2013-01-31 | 信号処理装置 |
Publications (2)
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JPWO2013118631A1 JPWO2013118631A1 (ja) | 2015-05-11 |
JP5850271B2 true JP5850271B2 (ja) | 2016-02-03 |
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US (1) | US9054078B2 (ja) |
EP (1) | EP2814189A1 (ja) |
JP (1) | JP5850271B2 (ja) |
CN (1) | CN104205679B (ja) |
BR (1) | BR112014019132A8 (ja) |
RU (1) | RU2014131907A (ja) |
TW (1) | TWI538400B (ja) |
WO (1) | WO2013118631A1 (ja) |
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JP2013038646A (ja) * | 2011-08-09 | 2013-02-21 | Sony Corp | 信号伝送装置、受信回路、及び、電子機器 |
FR3022696A1 (fr) * | 2014-06-24 | 2015-12-25 | St Microelectronics Sa | Connecteur pour guide d'ondes plastique |
DE102015119690A1 (de) * | 2015-11-13 | 2017-05-18 | Endress + Hauser Gmbh + Co. Kg | Radarbasierter Füllstandsensor |
WO2017122555A1 (ja) * | 2016-01-15 | 2017-07-20 | ソニー株式会社 | 送信機、送信方法、受信機、及び、受信方法 |
WO2018057026A1 (en) * | 2016-09-26 | 2018-03-29 | Nair Vijay K | Die with embedded communication cavity |
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JPH10285181A (ja) | 1997-04-09 | 1998-10-23 | Yozan:Kk | 電子機器内部の通信方式 |
JP4618956B2 (ja) | 2001-12-10 | 2011-01-26 | ソニー株式会社 | 信号処理装置、信号処理方法、信号処理システム、プログラム及び媒体 |
JP2003348022A (ja) * | 2002-05-29 | 2003-12-05 | Toshiba Corp | 光送信装置 |
JP2004093606A (ja) * | 2002-08-29 | 2004-03-25 | Opnext Japan Inc | 光モジュール及び光伝送装置 |
US8768411B2 (en) * | 2005-09-30 | 2014-07-01 | Intel Corporation | Systems and methods for RF communication between processors |
CA2650496C (en) * | 2006-04-26 | 2016-06-28 | Ems Technologies, Inc. | Planar mixed-signal circuit board |
JP2010103982A (ja) * | 2008-09-25 | 2010-05-06 | Sony Corp | ミリ波伝送装置、ミリ波伝送方法、ミリ波伝送システム |
JP5446552B2 (ja) * | 2009-07-30 | 2014-03-19 | ソニー株式会社 | 無線通信装置、回転構造体、電子機器 |
JP5316305B2 (ja) * | 2009-08-13 | 2013-10-16 | ソニー株式会社 | 無線伝送システム、無線伝送方法 |
JP5663970B2 (ja) | 2010-06-07 | 2015-02-04 | ソニー株式会社 | 信号伝送システム、通信装置、及び、電子機器 |
WO2011025027A1 (ja) | 2009-08-31 | 2011-03-03 | ソニー株式会社 | 信号伝送装置、電子機器、及び、信号伝送方法 |
JP5672684B2 (ja) * | 2009-09-29 | 2015-02-18 | ソニー株式会社 | 無線伝送システム、無線通信装置、無線伝送方法 |
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2012
- 2012-02-08 US US13/368,838 patent/US9054078B2/en active Active
- 2012-12-28 TW TW101150789A patent/TWI538400B/zh not_active IP Right Cessation
-
2013
- 2013-01-31 EP EP13746390.7A patent/EP2814189A1/en not_active Withdrawn
- 2013-01-31 BR BR112014019132A patent/BR112014019132A8/pt not_active IP Right Cessation
- 2013-01-31 JP JP2013557481A patent/JP5850271B2/ja active Active
- 2013-01-31 RU RU2014131907A patent/RU2014131907A/ru not_active Application Discontinuation
- 2013-01-31 WO PCT/JP2013/052176 patent/WO2013118631A1/ja active Application Filing
- 2013-01-31 CN CN201380007746.9A patent/CN104205679B/zh active Active
Also Published As
Publication number | Publication date |
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JPWO2013118631A1 (ja) | 2015-05-11 |
US9054078B2 (en) | 2015-06-09 |
TW201334413A (zh) | 2013-08-16 |
CN104205679A (zh) | 2014-12-10 |
RU2014131907A (ru) | 2016-02-20 |
CN104205679B (zh) | 2017-07-14 |
BR112014019132A2 (ja) | 2017-06-20 |
WO2013118631A1 (ja) | 2013-08-15 |
TWI538400B (zh) | 2016-06-11 |
EP2814189A1 (en) | 2014-12-17 |
US20130205049A1 (en) | 2013-08-08 |
BR112014019132A8 (pt) | 2017-07-11 |
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