BR112014019132A8 - Dispositivo de processamento de sinal - Google Patents
Dispositivo de processamento de sinalInfo
- Publication number
- BR112014019132A8 BR112014019132A8 BR112014019132A BR112014019132A BR112014019132A8 BR 112014019132 A8 BR112014019132 A8 BR 112014019132A8 BR 112014019132 A BR112014019132 A BR 112014019132A BR 112014019132 A BR112014019132 A BR 112014019132A BR 112014019132 A8 BR112014019132 A8 BR 112014019132A8
- Authority
- BR
- Brazil
- Prior art keywords
- input
- semiconductor chip
- signal processing
- frequency band
- predetermined frequency
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Transceivers (AREA)
- Semiconductor Integrated Circuits (AREA)
- Radar Systems Or Details Thereof (AREA)
Abstract
DISPOSITIVO DE PROCESSAMENTO DE SINAL A tecnologia presente relaciona-se a um dispositivo de processamento de sinal que permite redução de um custo de fabricação. Este parelho eletrônico tem um chip de semicondutor como uma pluralidade de circuitos de processamento de sinal. O chip de semicondutor tem um circuito de entrada/saída (I/0) que está configurado com um circuito de entrada que funciona como uma interface de entrada de um sinal de uma banda de frequência predeterminada e/ou um circuito de saída que funciona como uma interface de saída de um sinal da banda de frequência predeterminada a fim de executar transmissão do sinal da banda de frequência predeterminada entre outro chip de semicondutor. O circuito de entrada/saída do um chip de semicondutor e o circuito de entrada/saída do outro chip de semicondutor são capazes de transmissão do sinal da banda de frequência predeterminada por qualquer um de uma pluralidade de tais meios de transmissão para quais características diferem como fio metálico, um guia de onda dielétrico, espaço livre, etc. A tecnologia presente, por exemplo, pode ser aplicada a um aparelho eletrônico configurado por uma pluralidade de chips de semicondutor.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/368,838 US9054078B2 (en) | 2012-02-08 | 2012-02-08 | Signal processing device |
PCT/JP2013/052176 WO2013118631A1 (ja) | 2012-02-08 | 2013-01-31 | 信号処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
BR112014019132A2 BR112014019132A2 (pt) | 2017-06-20 |
BR112014019132A8 true BR112014019132A8 (pt) | 2017-07-11 |
Family
ID=48903928
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112014019132A BR112014019132A8 (pt) | 2012-02-08 | 2013-01-31 | Dispositivo de processamento de sinal |
Country Status (8)
Country | Link |
---|---|
US (1) | US9054078B2 (pt) |
EP (1) | EP2814189A1 (pt) |
JP (1) | JP5850271B2 (pt) |
CN (1) | CN104205679B (pt) |
BR (1) | BR112014019132A8 (pt) |
RU (1) | RU2014131907A (pt) |
TW (1) | TWI538400B (pt) |
WO (1) | WO2013118631A1 (pt) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013038646A (ja) * | 2011-08-09 | 2013-02-21 | Sony Corp | 信号伝送装置、受信回路、及び、電子機器 |
FR3022696A1 (fr) * | 2014-06-24 | 2015-12-25 | St Microelectronics Sa | Connecteur pour guide d'ondes plastique |
DE102015119690A1 (de) * | 2015-11-13 | 2017-05-18 | Endress + Hauser Gmbh + Co. Kg | Radarbasierter Füllstandsensor |
CN108476034A (zh) * | 2016-01-15 | 2018-08-31 | 索尼公司 | 发送器、发送方法、接收器和接收方法 |
US11128029B2 (en) | 2016-09-26 | 2021-09-21 | Intel Corporation | Die with embedded communication cavity |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10285181A (ja) | 1997-04-09 | 1998-10-23 | Yozan:Kk | 電子機器内部の通信方式 |
JP4618956B2 (ja) | 2001-12-10 | 2011-01-26 | ソニー株式会社 | 信号処理装置、信号処理方法、信号処理システム、プログラム及び媒体 |
JP2003348022A (ja) * | 2002-05-29 | 2003-12-05 | Toshiba Corp | 光送信装置 |
JP2004093606A (ja) * | 2002-08-29 | 2004-03-25 | Opnext Japan Inc | 光モジュール及び光伝送装置 |
US8768411B2 (en) * | 2005-09-30 | 2014-07-01 | Intel Corporation | Systems and methods for RF communication between processors |
CA2650496C (en) * | 2006-04-26 | 2016-06-28 | Ems Technologies, Inc. | Planar mixed-signal circuit board |
JP2010103982A (ja) * | 2008-09-25 | 2010-05-06 | Sony Corp | ミリ波伝送装置、ミリ波伝送方法、ミリ波伝送システム |
JP5446552B2 (ja) * | 2009-07-30 | 2014-03-19 | ソニー株式会社 | 無線通信装置、回転構造体、電子機器 |
JP5316305B2 (ja) * | 2009-08-13 | 2013-10-16 | ソニー株式会社 | 無線伝送システム、無線伝送方法 |
US8718544B2 (en) | 2009-08-31 | 2014-05-06 | Sony Corporation | Signal transmission device, electronic device, and signal transmission method |
JP5672684B2 (ja) * | 2009-09-29 | 2015-02-18 | ソニー株式会社 | 無線伝送システム、無線通信装置、無線伝送方法 |
JP5663970B2 (ja) | 2010-06-07 | 2015-02-04 | ソニー株式会社 | 信号伝送システム、通信装置、及び、電子機器 |
-
2012
- 2012-02-08 US US13/368,838 patent/US9054078B2/en active Active
- 2012-12-28 TW TW101150789A patent/TWI538400B/zh not_active IP Right Cessation
-
2013
- 2013-01-31 BR BR112014019132A patent/BR112014019132A8/pt not_active IP Right Cessation
- 2013-01-31 RU RU2014131907A patent/RU2014131907A/ru not_active Application Discontinuation
- 2013-01-31 JP JP2013557481A patent/JP5850271B2/ja active Active
- 2013-01-31 CN CN201380007746.9A patent/CN104205679B/zh active Active
- 2013-01-31 WO PCT/JP2013/052176 patent/WO2013118631A1/ja active Application Filing
- 2013-01-31 EP EP13746390.7A patent/EP2814189A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
US20130205049A1 (en) | 2013-08-08 |
RU2014131907A (ru) | 2016-02-20 |
TW201334413A (zh) | 2013-08-16 |
CN104205679A (zh) | 2014-12-10 |
BR112014019132A2 (pt) | 2017-06-20 |
US9054078B2 (en) | 2015-06-09 |
CN104205679B (zh) | 2017-07-14 |
TWI538400B (zh) | 2016-06-11 |
EP2814189A1 (en) | 2014-12-17 |
JPWO2013118631A1 (ja) | 2015-05-11 |
JP5850271B2 (ja) | 2016-02-03 |
WO2013118631A1 (ja) | 2013-08-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] | ||
B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |