JP2013098888A5 - - Google Patents

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Publication number
JP2013098888A5
JP2013098888A5 JP2011241943A JP2011241943A JP2013098888A5 JP 2013098888 A5 JP2013098888 A5 JP 2013098888A5 JP 2011241943 A JP2011241943 A JP 2011241943A JP 2011241943 A JP2011241943 A JP 2011241943A JP 2013098888 A5 JP2013098888 A5 JP 2013098888A5
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JP
Japan
Prior art keywords
dielectric
conductors
differential transmission
ended
electronic circuit
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JP2011241943A
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English (en)
Japanese (ja)
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JP2013098888A (ja
JP5861868B2 (ja
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Priority to JP2011241943A priority Critical patent/JP5861868B2/ja
Priority claimed from JP2011241943A external-priority patent/JP5861868B2/ja
Priority to US13/660,111 priority patent/US9596750B2/en
Priority to CN201210413331.9A priority patent/CN103094653B/zh
Publication of JP2013098888A publication Critical patent/JP2013098888A/ja
Publication of JP2013098888A5 publication Critical patent/JP2013098888A5/ja
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Publication of JP5861868B2 publication Critical patent/JP5861868B2/ja
Expired - Fee Related legal-status Critical Current
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JP2011241943A 2011-11-04 2011-11-04 電子回路および電子回路の製造方法 Expired - Fee Related JP5861868B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011241943A JP5861868B2 (ja) 2011-11-04 2011-11-04 電子回路および電子回路の製造方法
US13/660,111 US9596750B2 (en) 2011-11-04 2012-10-25 Electronic circuit, method of manufacturing electronic circuit, and mounting member
CN201210413331.9A CN103094653B (zh) 2011-11-04 2012-10-25 电子电路、电子电路的制造方法和安装部件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011241943A JP5861868B2 (ja) 2011-11-04 2011-11-04 電子回路および電子回路の製造方法

Publications (3)

Publication Number Publication Date
JP2013098888A JP2013098888A (ja) 2013-05-20
JP2013098888A5 true JP2013098888A5 (enExample) 2014-12-04
JP5861868B2 JP5861868B2 (ja) 2016-02-16

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Family Applications (1)

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JP2011241943A Expired - Fee Related JP5861868B2 (ja) 2011-11-04 2011-11-04 電子回路および電子回路の製造方法

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US (1) US9596750B2 (enExample)
JP (1) JP5861868B2 (enExample)
CN (1) CN103094653B (enExample)

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Publication number Priority date Publication date Assignee Title
WO2012155142A1 (en) 2011-05-12 2012-11-15 Olive Medical Corporation Pixel array area optimization using stacking scheme for hybrid image sensor with minimal vertical interconnects
BR112015001369A2 (pt) 2012-07-26 2017-07-04 Olive Medical Corp sistema de câmera com sensor de imagem cmos monolítico de área mínima
CN107278029A (zh) 2012-12-21 2017-10-20 华为终端有限公司 电子装置和栅格阵列模块
WO2014145248A1 (en) 2013-03-15 2014-09-18 Olive Medical Corporation Minimize image sensor i/o and conductor counts in endoscope applications
CN105246394B (zh) * 2013-03-15 2018-01-12 德普伊新特斯产品公司 无输入时钟和数据传输时钟的图像传感器同步
US9955568B2 (en) * 2014-01-24 2018-04-24 Dell Products, Lp Structure to dampen barrel resonance of unused portion of printed circuit board via
CN105990633A (zh) * 2015-01-29 2016-10-05 安弗施无线射频系统（上海）有限公司 传输线、传输装置以及移相设备
JP2017121032A (ja) * 2015-06-30 2017-07-06 住友電気工業株式会社 高周波装置
CN105636341A (zh) * 2016-01-01 2016-06-01 广州兴森快捷电路科技有限公司 一种具有空腔结构的pcb板及其制作方法
CN105808491A (zh) * 2016-03-03 2016-07-27 北京小米移动软件有限公司 带状差分线、智能设备及改善智能设备usb眼图的方法
CN108811314B (zh) * 2016-08-17 2020-10-13 赣州轩义科技有限公司 一种基于高厚径比深孔电镀技术高频高速电子线路板
WO2018220823A1 (ja) * 2017-06-02 2018-12-06 三菱電機株式会社 プリント回路基板
JP6465451B1 (ja) 2018-03-30 2019-02-06 三菱電機株式会社 電子回路
CN109888473B (zh) * 2019-01-30 2020-11-24 东南大学 一种与芯片键合的宽带贴片天线
JP7286389B2 (ja) * 2019-04-15 2023-06-05 キヤノン株式会社 無線通信装置、無線通信システムおよび通信方法
US11270972B2 (en) * 2019-06-12 2022-03-08 Nxp B.V. Package with conductive underfill ground plane
US11367697B2 (en) * 2020-05-15 2022-06-21 Qualcomm Incorporated High-density flip chip package for wireless transceivers
US12477654B2 (en) * 2022-04-01 2025-11-18 Macom Technology Solutions Holdings, Inc. RF power pallet with management daughter board

Family Cites Families (16)

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JPH0522004A (ja) * 1991-07-10 1993-01-29 Nippon Telegr & Teleph Corp <Ntt> 伝送路配線
US5534830A (en) * 1995-01-03 1996-07-09 R F Prime Corporation Thick film balanced line structure, and microwave baluns, resonators, mixers, splitters, and filters constructed therefrom
DK174111B1 (da) * 1998-01-26 2002-06-24 Giga As Elektrisk forbindelseselement samt fremgangsmåde til fremstilling af et sådant
EP1098555B1 (en) * 1999-11-02 2008-07-23 Canon Kabushiki Kaisha Printed-wiring board
JP3839381B2 (ja) 2002-09-12 2006-11-01 日本電信電話株式会社 平衡非平衡変換器
JP3872413B2 (ja) * 2002-11-05 2007-01-24 三菱電機株式会社 半導体装置
JP2004304134A (ja) * 2003-04-01 2004-10-28 Toshiba Corp 配線基板及びその製造方法
JP2005051496A (ja) * 2003-07-28 2005-02-24 Kanji Otsuka 信号伝送システム及び信号伝送線路
JP4511294B2 (ja) * 2004-09-22 2010-07-28 京セラ株式会社 配線基板
DE102006007381A1 (de) * 2006-02-15 2007-08-23 Infineon Technologies Ag Halbleiterbauelement für einen Ultraweitband-Standard in der Ultrahochfrequenz-Kommunikation und Verfahren zur Herstellung desselben
JP4616861B2 (ja) * 2007-05-25 2011-01-19 富士ゼロックス株式会社 信号伝送回路及び信号伝送システム
KR100771529B1 (ko) * 2007-05-30 2007-10-30 이엠와이즈 통신(주) 초광대역 발룬 및 그 응용 모듈
JP5526659B2 (ja) * 2008-09-25 2014-06-18 ソニー株式会社 ミリ波誘電体内伝送装置
JP5146267B2 (ja) * 2008-11-05 2013-02-20 ソニー株式会社 配線基板、プリント配線板の製造方法
US8179333B2 (en) * 2009-05-08 2012-05-15 Anokiwave, Inc. Antennas using chip-package interconnections for millimeter-wave wireless communication
US8283991B1 (en) * 2011-06-10 2012-10-09 Raytheon Company Wideband, differential signal balun for rejecting common mode electromagnetic fields

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