JP5857740B2 - 鉛フリーハンダ水溶性フラックス除去用洗浄剤、除去方法及び洗浄方法 - Google Patents
鉛フリーハンダ水溶性フラックス除去用洗浄剤、除去方法及び洗浄方法 Download PDFInfo
- Publication number
- JP5857740B2 JP5857740B2 JP2011529867A JP2011529867A JP5857740B2 JP 5857740 B2 JP5857740 B2 JP 5857740B2 JP 2011529867 A JP2011529867 A JP 2011529867A JP 2011529867 A JP2011529867 A JP 2011529867A JP 5857740 B2 JP5857740 B2 JP 5857740B2
- Authority
- JP
- Japan
- Prior art keywords
- water
- lead
- free solder
- soluble flux
- cleaning agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/263—Ethers
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5022—Organic solvents containing oxygen
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/24—Cleaning or pickling metallic material with solutions or molten salts with neutral solutions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
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Description
で表されるアミン化合物(B)、及び/又は、アミノ基非含有キレート剤(C)を含む、上記項1又は2記載の鉛フリーハンダ水溶性フラックス除去用洗浄剤。
で表される化合物である、上記項1〜3のいずれかに記載の鉛フリーハンダ水溶性フラックス除去用洗浄剤。
R5−O−(CH2−CH2−O)d−H
(式中、R5は炭素数8〜20のアルキル基を、dは0〜20の整数を表す。)で表される化合物、脂肪酸アミドのエチレンオキサイド付加物、ソルビタン脂肪酸エステル、ショ糖脂肪酸エステル、脂肪酸アルカノールアミド、これらの対応するポリオキシプロピレン系界面活性剤等が挙げられる。これらは1種を単独で、または2種以上を組み合わせて用いることができる。
表1に示す各成分を混合し(重量部基準)、実施例および比較例用の洗浄剤を調製した。
BDG:ジエチレングリコールモノブチルエーテル
BTG:トリエチレングリコールモノブチルエーテル
DMFDG:ジプロピレングリコールジメチルエーテル
MBD:N−ブチルジエタノールアミン
CA:クエン酸
MA:リンゴ酸
PA:ピロリン酸
市販の水溶性フラックス(1)(製品名「Sparkle Flux WF−6070」、千住金属工業株式会社製)、水溶性フラックス(2)(製品名「ALPHA WS−3018」、クックソンエレクトロニクス株式会社製)についてそれぞれCuテストピース(0.3×40×40mm)上に0.1g塗布し、270℃のホットプレート上で大気雰囲気下にて30秒間加熱した。これにより得られた水溶性フラックス残渣を水溶性フラックス洗浄性の評価用サンプルとして使用した。
ハンダバンプ(バンプ径;120μm、バンプ高さ;30μm、ピッチ;180μm)を正方状に60×60個を具備したソルダーレジスト試験基板(1.0×40×40mm)上のバンプに上記水溶性フラックス(1)又は(2)を塗布し、その上にバンプ頂点部と接するように透明のガラスチップ(0.5×16×16mm)を接合した。このサンプルをリフロー炉を用いて、ピーク温度260℃で20秒間加熱した。これにより得られたフラックス残渣を隙間洗浄性の評価用サンプルとして使用した。
水溶性フラックス洗浄性の評価用サンプルを、40℃に加温した攪拌状態の実施例および比較例用の洗浄剤に投入し、水溶性フラックス残渣を除去するのに要した時間を計測した。水溶性フラックス残渣除去の可否は、目視検査により水溶性フラックス残渣が消失しているか否かによって判断した。
2:要した時間 80s以上100s未満
3:要した時間 100s以上200s未満
4:要した時間 200s以上400s未満
5:要した時間 400s以上600s未満
6:要した時間 600s以上
隙間洗浄性の評価用サンプルに対して所定の洗浄条件にて洗浄試験を行い、フラックス残渣の除去性能について評価した。その際、フラックス残渣の残存状態は透明のガラスチップを介して、目視にて判断した。
洗浄方式:直通式洗浄装置(登録商標「ダイレクトパス」、荒川化学工業(株)製、特許第2621800号等)
洗浄工程:洗浄液;実施例又は比較例の洗浄液、液温;70℃、時間;9min、流速;0.66m/s
リンス工程:リンス液;脱イオン水、液温;40℃、時間;1min、流速;0.66m/s
乾燥:方式;熱風乾燥方式、温度;80℃、時間;15min
○:フラックス残渣の除去が可能であった。
×:フラックス残渣の除去が不十分であった。
試験1及び試験2の結果を表2に示す。
WF−6070:水溶性フラックス(1)(製品名「Sparkle Flux WF−6070」、千住金属工業株式会社製)
WS−3018:水溶性フラックス(2)(製品名「ALPHA WS−3018」、クックソンエレクトロニクス株式会社製)
Claims (11)
- 水100重量部に対して、グリコールエーテル化合物(A)を5〜45重量部、及びアミン化合物(B)を0.1〜10重量部含み、かつベンジルアルコールを含まない鉛フリーハンダ水溶性フラックス除去用洗浄剤であって、
前記アミン化合物(B)が、N−メチルジエタノールアミン、N−エチルジエタノールアミン、N−ブチルジエタノールアミンおよびN−プロピルジエタノールアミンからなる群より選ばれる少なくとも1種である、鉛フリーハンダ水溶性フラックス除去用洗浄剤。 - 更に、アミノ基非含有キレート剤(C)を、水100重量部に対して0.04〜4重量部含む、請求項1に記載の鉛フリーハンダ水溶性フラックス除去用洗浄剤。
- 前記グリコールエーテル化合物(A)が、下記一般式(2):
で表される化合物である、請求項1又は2に記載の鉛フリーハンダ水溶性フラックス除去用洗浄剤。 - 前記グリコールエーテル化合物(A)は、水に対し、液温20℃及び100kPa下において、完全溶解するものである、請求項1〜3のいずれかに記載の鉛フリーハンダ水溶性フラックス除去用洗浄剤。
- 前記グリコールエーテル化合物(A)が、ジエチレングリコールモノメチルエーテル、トリエチレングリコールモノメチルエーテル、ジエチレングリコールモノブチルエーテル、トリエチレングリコールモノブチルエーテル、及びジプロピレングリコールモノメチルエーテルからなる群より選ばれる少なくとも1種である、請求項1〜4のいずれかに記載の鉛フリーハンダ水溶性フラックス除去用洗浄剤。
- 前記アミノ基非含有キレート剤(C)が、脂肪族ヒドロキシカルボン酸系キレート剤及び/又は(ポリ)リン酸系キレート剤である、請求項2〜5のいずれかに記載の鉛フリーハンダ水溶性フラックス除去用洗浄剤。
- 前記脂肪族ヒドロキシカルボン酸系キレート剤が、クエン酸、イソクエン酸及びリンゴ酸からなる群より選ばれる少なくとも1種である、請求項6記載の鉛フリーハンダ水溶性フラックス除去用洗浄剤。
- 前記(ポリ)リン酸系キレート剤が、オルトリン酸、ピロリン酸及びトリリン酸からなる群より選ばれる少なくとも1種である、請求項6記載の鉛フリーハンダ水溶性フラックス除去用洗浄剤。
- 前記グリコールエーテル化合物(A)、前記アミン化合物(B)、及び前記アミノ基非含有キレート剤(C)を含む、請求項2〜8のいずれかに記載の鉛フリーハンダ水溶性フラックス除去用洗浄剤。
- 請求項1〜9のいずれかに記載の鉛フリーハンダ水溶性フラックス除去用洗浄剤を鉛フリーハンダ水溶性フラックスに接触させる、鉛フリーハンダ水溶性フラックスの除去方法。
- 鉛フリーハンダ水溶性フラックスが付着した被洗浄物を、請求項1〜9のいずれかに記載の鉛フリーハンダ水溶性フラックス除去用洗浄剤と接触させて、該被洗浄物から鉛フリーハンダ水溶性フラックスを除去する洗浄工程、及び鉛フリーハンダ水溶性フラックスを除去した被洗浄物を水で粗すすぎし、該被洗浄物に付着した洗浄剤成分を剥離する水すすぎ工程を含む、鉛フリーハンダ水溶性フラックスが付着した被洗浄物の洗浄方法。
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KR101729612B1 (ko) | 2017-05-11 |
US8877697B2 (en) | 2014-11-04 |
TW201127951A (en) | 2011-08-16 |
KR20120073198A (ko) | 2012-07-04 |
TWI476279B (zh) | 2015-03-11 |
WO2011027673A1 (ja) | 2011-03-10 |
JPWO2011027673A1 (ja) | 2013-02-04 |
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US20120090646A1 (en) | 2012-04-19 |
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