JP5851017B2 - 複数の発光素子を実装するための基板 - Google Patents
複数の発光素子を実装するための基板 Download PDFInfo
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- JP5851017B2 JP5851017B2 JP2014500497A JP2014500497A JP5851017B2 JP 5851017 B2 JP5851017 B2 JP 5851017B2 JP 2014500497 A JP2014500497 A JP 2014500497A JP 2014500497 A JP2014500497 A JP 2014500497A JP 5851017 B2 JP5851017 B2 JP 5851017B2
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- 239000000758 substrate Substances 0.000 claims description 162
- 230000003287 optical effect Effects 0.000 claims description 68
- 239000004020 conductor Substances 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 230000008901 benefit Effects 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005286 illumination Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- MTCPZNVSDFCBBE-UHFFFAOYSA-N 1,3,5-trichloro-2-(2,6-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(Cl)=C1C1=C(Cl)C=CC=C1Cl MTCPZNVSDFCBBE-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/007—Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
Claims (11)
- 第1の導体パッドと、前記第1の導体パッドに接続された第1の発光素子とが設けられた第1のセグメントと、
第2の導体パッドと、前記第2の導体パッドに接続された第2の発光素子とが設けられた第2のセグメントと、
を有する基板を含む光出力デバイスであって、
前記基板には、前記基板の平面において、前記基板に機械的力を加えることによって、前記基板の前記第1のセグメントと前記基板の第2のセグメントとの間に相対移動が実現されるように、前記基板の端から前記基板内のポイントまで延在する少なくとも1つの貫通孔が設けられ、
前記光出力デバイスは、前記第1の発光素子から受光することを目的とする第1の光学素子と、前記第2の発光素子から受光することを目的とする第2の光学素子とが設けられた光学系を更に含み、前記第1及び第2の発光素子のそれぞれは、前記基板に機械的力を加えることによって、その対応する光学素子に位置合わせされる、光出力デバイス。 - 前記基板には、複数の貫通孔が設けられ、前記貫通孔のそれぞれは、前記基板の端から前記基板内のポイントまで延在する、請求項1に記載の光出力デバイス。
- 前記複数の貫通孔のサブセットは、前記基板の第1の端から延在する一方で、残りの貫通孔は、前記第1の端とは反対側の前記基板の第2の端から延在する、請求項2に記載の光出力デバイス。
- 前記貫通孔はL字型である、請求項1乃至3の何れか一項に記載の光出力デバイス。
- 前記基板内に位置付けられた前記貫通孔の端は、丸みを帯びた形状である、請求項1乃至4の何れか一項に記載の光出力デバイス。
- 前記基板は、プリント回路基板(PCB)といった前記第1及び第2の導体パッドへの電気的接続を提供する配線が設けられた非導電性基板である、請求項1乃至5の何れか一項に記載の光出力デバイス。
- 前記基板及び前記光学系は、アライメント時に合せられる対応する基準素子のセットを含む、請求項1乃至6の何れか一項に記載の光出力デバイス。
- 前記基板上の前記基準素子のセットは、基準孔のセットであり、前記光学系上の前記基準素子のセットは、前記基準孔に合せられる対応する突起のセットである、請求項7に記載の光出力デバイス。
- 前記突起はテーパ形にされる、請求項8に記載の光出力デバイス。
- 光出力デバイスを製造する方法であって、
第1の発光素子の接続のための第1の導体パッドが設けられた第1のセグメントと第2の発光素子の接続のための第2の導体パッドが設けられた第2のセグメントとを含む基板を提供するステップと、
前記基板の平面において、前記基板に機械的力を加えることによって、前記基板の前記第1のセグメントと前記基板の前記第2のセグメントとの間に相対移動が実現されるように、前記基板の端から前記基板内のポイントまで延在する少なくとも1つの貫通孔を形成するステップと、
前記基板上の前記第1の導体パッドに第1の発光素子を、前記基板上の前記第2の導体パッドに第2の発光素子を実装するステップと、
前記第1の発光素子から受光することを目的とする第1の光学素子と、前記第2の発光素子から受光することを目的とする第2の光学素子とが設けられた光学系を提供するステップと、
前記光学系を前記第1及び第2の発光素子上に配置するステップと、
前記基板に機械的力を加えることによって、前記第1及び第2の発光素子のそれぞれをその対応する光学素子に位置合わせするステップと、
を含む、方法。 - 前記基板に基準素子のセットを設けるステップを更に含む、請求項10に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP11159132.7 | 2011-03-22 | ||
EP11159132 | 2011-03-22 | ||
PCT/IB2012/051148 WO2012127355A1 (en) | 2011-03-22 | 2012-03-12 | Substrate for mounting a plurality of light emitting elements |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2014512093A JP2014512093A (ja) | 2014-05-19 |
JP2014512093A5 JP2014512093A5 (ja) | 2015-04-30 |
JP5851017B2 true JP5851017B2 (ja) | 2016-02-03 |
Family
ID=45876831
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014500497A Active JP5851017B2 (ja) | 2011-03-22 | 2012-03-12 | 複数の発光素子を実装するための基板 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9337404B2 (ja) |
EP (1) | EP2689642B1 (ja) |
JP (1) | JP5851017B2 (ja) |
CN (1) | CN103460813B (ja) |
RU (1) | RU2615149C2 (ja) |
WO (1) | WO2012127355A1 (ja) |
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US20080239716A1 (en) * | 2007-03-30 | 2008-10-02 | Yuan Lin | Light strip |
RU2011105026A (ru) | 2008-07-11 | 2012-08-20 | Конинклейке Филипс Электроникс Н.В. (Nl) | Устройство вывода света и способ сборки |
JP4447644B2 (ja) * | 2008-07-15 | 2010-04-07 | シーシーエス株式会社 | 光照射装置 |
US8629353B2 (en) * | 2009-03-05 | 2014-01-14 | The Board Of Trustees Of The Leland Stanford Junior University | Apparatus and method using patterned array with separated islands |
-
2012
- 2012-03-12 CN CN201280014288.7A patent/CN103460813B/zh not_active Expired - Fee Related
- 2012-03-12 EP EP12710361.2A patent/EP2689642B1/en not_active Not-in-force
- 2012-03-12 US US14/004,762 patent/US9337404B2/en active Active
- 2012-03-12 JP JP2014500497A patent/JP5851017B2/ja active Active
- 2012-03-12 WO PCT/IB2012/051148 patent/WO2012127355A1/en active Application Filing
- 2012-03-12 RU RU2013146958A patent/RU2615149C2/ru active
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US9337404B2 (en) | 2016-05-10 |
US20140001498A1 (en) | 2014-01-02 |
CN103460813B (zh) | 2017-07-11 |
WO2012127355A1 (en) | 2012-09-27 |
EP2689642B1 (en) | 2018-02-28 |
JP2014512093A (ja) | 2014-05-19 |
EP2689642A1 (en) | 2014-01-29 |
RU2013146958A (ru) | 2015-04-27 |
RU2615149C2 (ru) | 2017-04-04 |
CN103460813A (zh) | 2013-12-18 |
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