CN103460813B - 用于安装多个发光元件的基板 - Google Patents
用于安装多个发光元件的基板 Download PDFInfo
- Publication number
- CN103460813B CN103460813B CN201280014288.7A CN201280014288A CN103460813B CN 103460813 B CN103460813 B CN 103460813B CN 201280014288 A CN201280014288 A CN 201280014288A CN 103460813 B CN103460813 B CN 103460813B
- Authority
- CN
- China
- Prior art keywords
- substrate
- light
- emitting component
- output device
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 174
- 230000003287 optical effect Effects 0.000 claims abstract description 70
- 238000000034 method Methods 0.000 claims abstract description 14
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 208000010392 Bone Fractures Diseases 0.000 description 3
- 206010017076 Fracture Diseases 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 238000003801 milling Methods 0.000 description 2
- MTCPZNVSDFCBBE-UHFFFAOYSA-N 1,3,5-trichloro-2-(2,6-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(Cl)=C1C1=C(Cl)C=CC=C1Cl MTCPZNVSDFCBBE-UHFFFAOYSA-N 0.000 description 1
- 239000004425 Makrolon Substances 0.000 description 1
- 230000001149 cognitive effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/007—Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP11159132.7 | 2011-03-22 | ||
EP11159132 | 2011-03-22 | ||
PCT/IB2012/051148 WO2012127355A1 (en) | 2011-03-22 | 2012-03-12 | Substrate for mounting a plurality of light emitting elements |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103460813A CN103460813A (zh) | 2013-12-18 |
CN103460813B true CN103460813B (zh) | 2017-07-11 |
Family
ID=45876831
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280014288.7A Expired - Fee Related CN103460813B (zh) | 2011-03-22 | 2012-03-12 | 用于安装多个发光元件的基板 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9337404B2 (zh) |
EP (1) | EP2689642B1 (zh) |
JP (1) | JP5851017B2 (zh) |
CN (1) | CN103460813B (zh) |
RU (1) | RU2615149C2 (zh) |
WO (1) | WO2012127355A1 (zh) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103791441A (zh) * | 2012-10-30 | 2014-05-14 | 欧司朗股份有限公司 | 透镜模块和包括该透镜模块的发光装置 |
JP6079159B2 (ja) | 2012-11-16 | 2017-02-15 | 日亜化学工業株式会社 | 発光装置 |
DE102012220977A1 (de) * | 2012-11-16 | 2014-05-22 | Osram Gmbh | Reflektoranordnung |
AT513910B1 (de) * | 2013-02-07 | 2014-12-15 | Zizala Lichtsysteme Gmbh | Verfahren zum Herstellen einer Leuchteinheit sowie Leuchteinheit |
AT513747B1 (de) * | 2013-02-28 | 2014-07-15 | Mikroelektronik Ges Mit Beschränkter Haftung Ab | Bestückungsverfahren für Schaltungsträger und Schaltungsträger |
WO2014155347A1 (en) * | 2013-03-29 | 2014-10-02 | Koninklijke Philips N.V. | Printed circuit board for a light emitting diode module |
DE102013103600A1 (de) * | 2013-04-10 | 2014-10-30 | Osram Opto Semiconductors Gmbh | Modul mit wenigstens zwei Halbleiterchips |
EP2808912B1 (en) * | 2013-05-27 | 2021-06-30 | Rockwell Automation Switzerland GmbH | Method for assembling a circuit carrier with a housing component, and an optical unit |
DE102014101783B4 (de) * | 2014-02-13 | 2021-08-19 | HELLA GmbH & Co. KGaA | Verfahren zum Aufbau eines LED- Lichtmoduls |
US9674412B2 (en) * | 2014-08-01 | 2017-06-06 | Flir Commercial Systems, Inc. | Multi-sensor camera with apertured circuit-carrying substrate |
JP6507942B2 (ja) * | 2014-08-29 | 2019-05-08 | 日亜化学工業株式会社 | 半導体発光装置用の保持部材、光源装置及びその製造方法 |
DE102015206324B4 (de) * | 2015-04-09 | 2019-06-06 | H4X E.U. | Anordnung mit einem auf einem Trägerblech angeordneten flächigen Leuchtmittelträger, Verfahren zum Herstellen eines eine vorbestimmte Biegung aufweisenden flächigen Leuchtmittelträgers sowie Beleuchtungsvorrichtung |
CN205048218U (zh) | 2015-06-08 | 2016-02-24 | 亮锐控股有限公司 | 照明带和照明装置 |
WO2017157753A1 (en) * | 2016-03-15 | 2017-09-21 | Philips Lighting Holding B.V. | An elongated lead frame and a method of manufacturing an elongated lead frame |
EP3294046B1 (en) * | 2016-09-09 | 2023-08-02 | TE Connectivity Germany GmbH | Solid state lighting module and method of fabricating same |
JP6769795B2 (ja) * | 2016-09-12 | 2020-10-14 | 矢崎総業株式会社 | 電子回路基板 |
WO2018070987A1 (en) * | 2016-10-10 | 2018-04-19 | Hewlett-Packard Development Company, L.P. | Boards with pliable regions |
US10194495B2 (en) * | 2016-12-21 | 2019-01-29 | Lumileds Llc | Method for addressing misalignment of LEDs on a printed circuit board |
US10765009B2 (en) | 2016-12-21 | 2020-09-01 | Lumileds Llc | Method for addressing misalignment of LEDs on a printed circuit board |
US10495278B2 (en) * | 2017-03-30 | 2019-12-03 | Valeo North America, Inc. | Vehicle lighting device with adjustable alignment frame for an optical element and method for assembling a lighting device with an adjustable frame for an optical element |
EP3383146B8 (en) * | 2017-03-31 | 2023-08-30 | Inventronics GmbH | Lighting device with ip protection and multidirectional bending capability, and method for manufacturing the same |
EP3454312B1 (de) * | 2017-09-11 | 2019-08-07 | Siemens Schweiz AG | Optischer rauchmelder mit einem aufschwenkbaren leiterplattenabschnitt mit einem darauf angeordneten lichtsender und/oder lichtempfänger |
US10880995B2 (en) * | 2017-12-15 | 2020-12-29 | 2449049 Ontario Inc. | Printed circuit board with stress relief zones for component and solder joint protection |
AT520857A1 (de) * | 2018-02-08 | 2019-08-15 | Friedrich Eibensteiner Dr | Verfahren zum Platzieren und Löten von Elementen auf Bauteilträger |
JPWO2019224901A1 (ja) * | 2018-05-22 | 2020-05-28 | 株式会社メイコーテクノ | フレキシブル部を有するリジッドプリント配線基板 |
GB2585350A (en) * | 2019-05-03 | 2021-01-13 | Universal Science Uk Ltd | Modular printed circuit board |
DE102019214050A1 (de) * | 2019-09-16 | 2021-03-18 | Carl Zeiss Smt Gmbh | Steckeranordnung, system und lithographieanlage |
EP4194758A1 (en) * | 2021-12-10 | 2023-06-14 | E.G.O. Elektro-Gerätebau GmbH | Operating device for an electrical domestic appliance and electrical domestic appliance |
Citations (3)
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NL9000279A (nl) * | 1990-02-05 | 1991-09-02 | Ericsson Telecommunicatie Bv | Buigzame gedrukte bedradingskaart met een substraat van stijf materiaal. |
US5811874A (en) * | 1996-07-18 | 1998-09-22 | Samsung Electronics Co., Ltd. | Semiconductor chip package device having a rounded or chamfered metal layer guard ring |
CN1917741A (zh) * | 2005-08-18 | 2007-02-21 | Tdk株式会社 | 柔性基板、安装结构、显示单元和便携式电子设备 |
Family Cites Families (18)
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EP0117606A1 (en) * | 1983-01-28 | 1984-09-05 | Xerox Corporation | Collector for a LED array |
US4767172A (en) * | 1983-01-28 | 1988-08-30 | Xerox Corporation | Collector for an LED array |
EP1187227A3 (de) | 1989-05-31 | 2002-08-28 | Osram Opto Semiconductors GmbH & Co. OHG | Oberflächenmontierbares Opto-Bauelement und Verfahren zum Herstellen desselben |
JPH0595074U (ja) * | 1992-05-29 | 1993-12-24 | 株式会社村田製作所 | 回路基板 |
IL111219A0 (en) * | 1993-10-18 | 1994-12-29 | Hughes Aircraft Co | Microelement assembly |
FI109075B (fi) * | 1998-10-05 | 2002-05-15 | Nokia Corp | Akustisen muuntimen alustan kiinnitysmenetelmä |
JP2000123978A (ja) * | 1998-10-20 | 2000-04-28 | Chisso Corp | 有機el素子およびその製造方法 |
ITMI20012579A1 (it) * | 2001-12-06 | 2003-06-06 | Fraen Corp Srl | Modulo illuminante ad elevata dissipazione di calore |
US6846094B2 (en) * | 2002-08-26 | 2005-01-25 | Altman Stage Lighting, Co., Inc. | Flexible LED lighting strip |
US7142420B2 (en) * | 2004-09-20 | 2006-11-28 | Qualcomm, Incorporated | Devices and methods for controlling relative movement between layers of an electronic device |
DE102004056252A1 (de) | 2004-10-29 | 2006-05-04 | Osram Opto Semiconductors Gmbh | Beleuchtungseinrichtung, Kfz-Scheinwerfer und Verfahren zur Herstellung einer Beleuchtungseinrichtung |
JP2006162654A (ja) * | 2004-12-02 | 2006-06-22 | Olympus Corp | 光学デバイス及び照明装置 |
ES2822277T3 (es) | 2005-05-20 | 2021-04-30 | Signify Holding Bv | Módulo emisor de luz |
TWI280332B (en) | 2005-10-31 | 2007-05-01 | Guei-Fang Chen | LED lighting device |
US20080239716A1 (en) * | 2007-03-30 | 2008-10-02 | Yuan Lin | Light strip |
KR20110034668A (ko) | 2008-07-11 | 2011-04-05 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 광 출력 디바이스 및 조립 방법 |
JP4447644B2 (ja) * | 2008-07-15 | 2010-04-07 | シーシーエス株式会社 | 光照射装置 |
US8629353B2 (en) * | 2009-03-05 | 2014-01-14 | The Board Of Trustees Of The Leland Stanford Junior University | Apparatus and method using patterned array with separated islands |
-
2012
- 2012-03-12 US US14/004,762 patent/US9337404B2/en not_active Expired - Fee Related
- 2012-03-12 JP JP2014500497A patent/JP5851017B2/ja active Active
- 2012-03-12 WO PCT/IB2012/051148 patent/WO2012127355A1/en active Application Filing
- 2012-03-12 CN CN201280014288.7A patent/CN103460813B/zh not_active Expired - Fee Related
- 2012-03-12 EP EP12710361.2A patent/EP2689642B1/en not_active Not-in-force
- 2012-03-12 RU RU2013146958A patent/RU2615149C2/ru active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL9000279A (nl) * | 1990-02-05 | 1991-09-02 | Ericsson Telecommunicatie Bv | Buigzame gedrukte bedradingskaart met een substraat van stijf materiaal. |
US5811874A (en) * | 1996-07-18 | 1998-09-22 | Samsung Electronics Co., Ltd. | Semiconductor chip package device having a rounded or chamfered metal layer guard ring |
CN1917741A (zh) * | 2005-08-18 | 2007-02-21 | Tdk株式会社 | 柔性基板、安装结构、显示单元和便携式电子设备 |
Also Published As
Publication number | Publication date |
---|---|
EP2689642B1 (en) | 2018-02-28 |
CN103460813A (zh) | 2013-12-18 |
JP5851017B2 (ja) | 2016-02-03 |
RU2615149C2 (ru) | 2017-04-04 |
US9337404B2 (en) | 2016-05-10 |
WO2012127355A1 (en) | 2012-09-27 |
RU2013146958A (ru) | 2015-04-27 |
JP2014512093A (ja) | 2014-05-19 |
EP2689642A1 (en) | 2014-01-29 |
US20140001498A1 (en) | 2014-01-02 |
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C06 | Publication | ||
PB01 | Publication | ||
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