GB2585350A - Modular printed circuit board - Google Patents
Modular printed circuit board Download PDFInfo
- Publication number
- GB2585350A GB2585350A GB1906295.9A GB201906295A GB2585350A GB 2585350 A GB2585350 A GB 2585350A GB 201906295 A GB201906295 A GB 201906295A GB 2585350 A GB2585350 A GB 2585350A
- Authority
- GB
- United Kingdom
- Prior art keywords
- printed circuit
- circuit board
- disposed
- electronic components
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000005452 bending Methods 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 8
- 238000004519 manufacturing process Methods 0.000 claims abstract description 7
- 238000007747 plating Methods 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 2
- 230000035882 stress Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 208000010392 Bone Fractures Diseases 0.000 description 5
- 206010017076 Fracture Diseases 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 208000013201 Stress fracture Diseases 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0292—Programmable, customizable or modifiable circuits having a modifiable lay-out, i.e. adapted for engineering changes or repair
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09127—PCB or component having an integral separable or breakable part
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
An elongate printed circuit board (PCB) 10 comprises a first surface 20, second surface (30, Figure 1b), and two lateral edges 40, 50. The PCB comprises a plurality of rigid regions 60 and a self-contained unit of electronic components 90 mounted on a surface of each rigid region. A flexible region 70, comprising a notch 80 disposed on an edge of the PCB, separates each rigid region. The notch may be U-shaped (80a, Figure 1b), V-shaped (80b, Figure 6) or arcuate (80c, Figure 7). Conductive tracks 100 may be disposed on one or both surfaces of the flexible regions, and vias (110, Figure 5) may provide a connection between opposing surfaces. The notches enable bending of the PCB, providing protection from lateral forces whilst maintaining rigidity to provide a stable mount for components. The notches may allow for division of the PCB by bending beyond the fracture point at one of the flexible regions. A method of production of such a PCB and a method of producing vias by through hole plating are also claimed.
Description
Modular Printed Circuit Board The present invention discloses a modular printed circuit board in the form of an elongate flexible printed circuit board.
Background
Printed circuit boards are a well-established component and typically comprise a rigid thermoset resin sheet, often being a resin impregnated laminate of a fibrous material to provide additional strength and rigidity. Rigid circuit board substrates such as these typically have a Young's modulus upwards of 10 GPa. Recently flexible printed circuit boards have been developed and these provide the opportunity to wrap a printed circuit board to given contours required in a particular application.
Flexible printed circuit boards typically have a Young's modulus less than 10 GPa, more typically between 0.5 to 5 GPa. Flexible printed circuit boards, as with any printed circuit board, provide areas of conductive and nonconductive materials, such as copper and plastics and to these materials are attached electronic components, either using a conductive material, such as solder to make an electrical contact with the copper or an adhesive to make a physical contact for retaining electronic component on the plastic substrate. Since the elasticity of these different components varies markedly then there is an ongoing problem with stress failure of flexible printed circuit boards. Such failure can give rise to breaks in the required electrical circuits intended to be created using the printed circuit board on the electrical components either directly or indirectly after a support, such as an adhesive, has given way. These issues are compounded when the printed circuit boards are temperature cycled as the coefficients of thermal expansion differ between the various components.
This has led to applications where high reliability, particularly with extremes in temperature and mechanical load, such as vibration being unsuited to flexible printed circuit boards. The solution is therefore to provide rigid boards with wires between the boards, the wires being soldered into place, the rigid boards can therefore be at different orientations. This is however a time-consuming, often manual, procedure which requires additional process steps and provides additional points of failure.
There is therefore a need for an improved form of flexible printed circuit board which is more reliable under mechanical stress thermal cycling and ageing.
There remains a need for a form of flexible printed circuit board with increased reliability and mechanical integrity.
Printed circuit boards which provide improved ease-of-use are also advantageous.
Summary
The present invention in its various embodiments is as set out in the appended claims.
The present invention provides an elongate printed circuit board having a first and second surface and two lateral edges, comprising: a plurality of Rigid regions; wherein on each region a self-contained unit of electronic components is disposed on a surface of the printed circuit board; and each rigid region is separated from adjacent rigid regions by one flexible region, wherein each flexible region is a section along the length of the printed circuit board where a notch is disposed on an edge of the printed circuit board creating a region of the printed circuit board, capable of flexing, under a given force more than the rigid region.
The present invention therefore has the features: that the elongate flexible printed circuit board has a first and second surface and two lateral edges. The printed circuit board comprises a plurality of rigid regions each separated from adjacent rigid regions by one flexible region. Each flexible region is a section along the length of the printed circuit board where a notch is disposed on an edge of the printed circuit board, creating a region of the printed circuit board, capable of flexing, under a given force more than the rigid region. On each rigid region, a self-contained unit of electronic components is disposed on a surface of the printed circuit board. Since the majority of flexion on the printed circuit board is confined to the flexible regions, the rigid regions provide a stable mount for the electronic components as the solder connecting components together and mounting them to the circuit board is under minimal stress. Therefore, the notches enable bending and flexing of the printed circuit board to take place whilst maintaining rigidity of the active printed circuit board assembly. Additionally, this flexibility protects the printed circuit board from lateral forces when in use or transit. In addition, by concentrating flexure of the boards at given points, those points can be designed so as not to accommodate mounted electrical components and the conductive portions of the board can be designed for providing additional strength, such as in the form of wider tracks or tracks on both sides of the board. By providing tracks on both sides of the board then in a given bending mode one side is usually in compression and the other in extension and the compression side may survive bending even if the extension side does not. In the present invention it is therefore advantageous that conductive regions of the printed circuit board in the form of tracks of conductive material are duplicated in the flexible regions, and in particular duplicated by having at least one track providing the same electrical connection on both sides of the board.
In the present invention each notch, defining a flexible region, may be disposed on the opposite edge to a notch on an adjacent flexible region. This ensures the Printed circuit board can flex uniformly in a controlled manner to create a variety of shapes. Notches disposed in this way allow for controlled flexing in both in the plane of the surfaces and in the plane of the edges. The degree of bending possible is determined by a combination of notch size, notch frequency per unit length, the printed circuit board substrate material and printed circuit board thickness. The substrate material of the printed circuit board may have a Young's modulus greater than 10 GPa. Preferably, the Young's modulus of the substrate material is between 20 and 200 GPa. This facilitates the rigid regions of the printed circuit board being sufficiently rigid so as to ensure a stable mount for electronic components mounted thereon. More preferably, the Young's modulus of the substrate material is between 20 and 30 GPa. This enables the substrate not to be so brittle as to risk unwanted fracture of the flexible regions when flexion is intended.
In in the present invention each notch may extend into the printed circuit board between 30% and 95% of the total edge to edge width of the printed circuit board. Notches less than 30% of the width of the printed circuit board are less preferred as they create flexible regions that are not flexible enough relative to the rigid regions to confine stress to the flexible regions and therefore could risk damage to the solder joints.
Notches extending in from the edge of the board are preferable over, for example aperture's in the board to define a flexible region. The use of notches provides discontinuity of the edges of the board. This allows the edges adjacent to a notch to move relative to one another, allowing for increased flexion over a portion of the board without a notch disposed. If apertures were implemented, they would serve to weaken the area of the printed circuit board they were disposed into, but, as there would be no discontinuity in the edge of the circuit board, and therefore less flexion would be achieved.
Preferably each notch extends into the printed circuit board between 30% and 50% of the total edge to edge width of the printed circuit board. As notches extending in excess of 50% of the width of the printed circuit board can render the printed circuit board fragile.
In the present invention, each notch may be further configured to allow adjacent rigid regions to be manually divided by bending the printed circuit board in any axis beyond the fracture point of the printed circuit board substrate at one of the flexible regions. This allows the user to easily separate different lengths of the printed circuit board to suit their needs. This provides modularity and improved convenience of use.
In the present invention one or more conductive tracks may be disposed on at least one surface of the flexible regions for electronically connecting the electronic components of adjoining rigid regions. Removing the need for external wire connections between rigid regions.
Preferably the one or more conductive tracks are disposed on both surfaces of the flexible regions.
This serves to maximise the surface area of the conductive tracks, increasing conductivity as a result.
In the case that conductive tracks are disposed on both surfaces, through hole plating can be implemented to create vial which provide a connection between conductive tracks on opposing surfaces of the printed circuit board. This provides an electrical connection to the opposite side of the board, allowing more than one conductor to bridge the flexible region without requiring a reduction in overall conductor surface area.
The present invention may use copper to form the conductive tracks. Copper is chosen for its conductivity and has the additional benefit of being more flexible than most PCB substrates and as such, copper conductive tracks will not be broken by flexing of the substrate at the flexible regions. This provides benefits over conductive inks and similar materials used in highly flexible printed circuit boards.
The present invention may include one or more conductive pads disposed adjacent to a notch onto one or more conductive tracks. These provide points via which separate lengths of the printed circuit board can be electronically connected using suitable connectors or wires. Hence, the modularity of the boards is enhanced as if rigid portions of a board are disconnected, points are readily available for making further electrical connections.
In the present invention the self-contained units of electronic components may be disposed on only the first surface, for ease of manufacture.
The present invention may be designed such that one or more self-contained units of electronic components is deposited onto the first surface and one or more self-contained units of electronic components is deposited onto the second surface. This serves to spread weight and stress imposed by the units to be distributed more evenly over both surfaces of the printed circuit board.
In the present invention the self-contained unit of electronic components disposed on the rigid regions may be configured such that the order of electronic components on any given rigid region is reversed in the self-contained unit of electronic components disposed on any adjacent rigid region.
This provides symmetry in the weight distribution of the components on the strip and thus the tenancy of the strip to have lateral out of plane distortion when curved is reduced The notches of the present invention may be U shaped. A U shape notch spreads the stress throughout the flexible region allowing a large degree of bending before fracture. This increases the reliability of the circuit boards in this region.
The notches of the present invention may be V shaped. In this case the V shaped notch concentrates the stress at the apex of the notch. This leads to an easier and cleaner break when separating rigid regions. When V shaped notches are used conductive tracks on the printed circuit board are preferably located away from the point of the V towards the nearest lateral edge. This reduces the likelihood that stress fractures will cause a break in the conductive track.
The notches of the present invention may be arcuate. Arcuate notches are simple to manufacture by drilling from one surface to another through an edge of the printed circuit board.
The present invention also includes, A method of production of the printed circuit board as herein described; wherein one or more notches are disposed onto one or more edges of an elongate printed circuit board substrate creating one or more flexible regions in which the printed circuit board can flex; wherein a plurality of self-contained units of electronic components are deposited onto rigid regions of printed circuit board adjacent to notches; wherein adjacent self-contained units of electronic components are electronically connected by the deposition of conductive tracks onto one or more surfaces of the notched flexible region between them. This approach allows the flexible circuit board substrate to be continuous.
This method of production is advantageous as it results in a flexible printed circuit board wherein the substrate is continuous and as such there exist no joints in the substrate that could lead to failure of the printed circuit board.
The present invention will now be illustrated using the following figures: Figure la shows an embodiment of the present invention in plan view from above; Figure lb shows the embodiment of figure la of the present invention in plan view from below; Figure 2 shows the embodiment of figure 1 of the present invention in plan views from above and below; Figure 3 shows the embodiment of figure 1 the present invention in lateral views from both edges; Figure 4 shows an embodiment of the invention in plan view from above; Figure 5 shows a close up of the embodiment of figure 1 the present invention in perspective view; Figure 6 shows a further embodiment of the present invention in plan view from below; And Figure 7 shows a yet further embodiment of the present invention in plan view from below; The present invention has the following features: 10-Elongate printed circuit board 20-First surface 30-Second surface 40-Lateral edge SO-Lateral edge 60-Rigid region 70-Flexible region 80-Notch 80a-U shaped Notch 80b-V shaped Notch 80c-Arcuate Notch 90-Self-contained unit of electronic components 100-Conductive track 110-Via 120-Conductive pad 500-Flexion localised to the flexible region 525-Controlled flexion in the plane of the surfaces 550-Controlled flexion in the plane of the edges 700-Dividing under bending beyond fracture point In the present description, like features are provided with like numerals. Referring now to the figures.
Figure la provides an elongate printed circuit board 10, the board having a first surface 20 and two lateral edges 40, 50. The first surface is suitable for mounting self-contained units of electronic components 90. The elongate printed circuit board comprises a plurality of Rigid regions 60; wherein on each region a self-contained unit of electronic components 90 is disposed on a surface 20, 30 of the printed circuit board 10. Each rigid region 60 is separated from adjacent rigid regions 60 by one flexible region 70, wherein each flexible region 70 is a section along the length of the printed circuit board 10 where a notch 80 is disposed on an edge 40, 50 of the printed circuit board 10 creating a region of the printed circuit board, capable of flexing, under a given force more than the rigid region 60. Conductive tracks 100 are disposed the first surface 20 of the flexible regions for electronically connecting the electronic components of adjoining rigid regions.
Figure lb provides an elongate printed circuit board 10, the board having a second surface 30 and two lateral edges 40, 50. The elongate printed circuit board comprises a plurality of Rigid regions 60.
Each rigid region 60 is separated from adjacent rigid regions 60 by one flexible region 70, wherein each flexible region 70 is a section along the length of the printed circuit board 10 where a U-shaped notch 80, 80a is disposed on an edge 40, 50 of the printed circuit board 10 creating a region of the printed circuit board, capable of flexing, under a given force more than the rigid region 60. Conductive tracks 100 are disposed the second surface 30 of the flexible regions for electronically connecting the electronic components of adjoining rigid regions.
Figure 2 illustrates the printed circuit board 10 flexing in the plane of the surfaces 525, with flexion localised to the flexible regions 70, 500.
Figure 3 illustrates the printed circuit board 10 flexing in the plane of the edges 550, with flexion localised to the flexible regions 70, 500.
Figure 4 illustrates rigid regions 60 of the printed circuit board 10 dividing 700 under bending of the printed circuit board 10 beyond the fracture point of the substrate at one of the flexible regions 70.
Figure 5 provides a close up of a section of the elongate printed circuit board 10 in which vias 110 implemented using through hole plating provide a connection between conductive tracks 100 disposed on opposing surfaces 20, 30. Conductive pads 120 are disposed adjacent to a notch onto the conductive tracks.
Figure 6 provides an elongate printed circuit board wherein the notches 80 are V shaped 80b. Figure 7 provides an elongate printed circuit board wherein the notches 80 are arcuate 80c.
Claims (18)
- Claims 1. An elongate printed circuit board having a first and second surface and two lateral edges, comprising: a plurality of Rigid regions; wherein on each region a self-contained unit of electronic components is disposed on a surface of the printed circuit board; and each rigid region is separated from adjacent rigid regions by one flexible region, wherein each flexible region is a section along the length of the printed circuit board where a notch is disposed on an edge of the printed circuit board creating a region of the printed circuit board, capable of flexing, under a given force more than the rigid region.
- 2. The printed circuit board of Claim 1, wherein each notch is disposed on the opposite edge to a notch on an adjacent flexible region.
- 3. The printed circuit board of Claim 2, wherein each notch extends into the printed circuit board between 30% and 95% of the total edge to edge width of the printed circuit board.
- 4. The printed circuit board of Claim 3, wherein each notch extends into the printed circuit board between 30% and 50% of the total edge to edge width of the printed circuit board.
- 5. The printed circuit board of any of claims 1 to 3, wherein one or more conductive tracks are disposed on at least one surface of the flexible regions for electronically connecting the electronic components of adjoining rigid regions.
- 6. The printed circuit board of Claim 5, wherein one or more conductive tracks are disposed on both surfaces of the flexible regions.
- 7. The printed circuit board of Claim 6, wherein one or more vias provide a connection between conductive tracks on opposing surfaces of the printed circuit board.
- 8. The printed circuit board of Claim any of claims 1 to 9, wherein each notch is further configured to allow adjacent rigid regions to be manually divided by bending the printed circuit board in any axis beyond the fracture point of the printed circuit board substrate at one of the flexible regions.
- 9. The printed circuit board of Claim 6, wherein copper is used to form the conductive tracks.
- 10. The printed circuit board of Claim 9 wherein a one or more conductive pads is disposed adjacent to a notch onto one or more conductive tracks.
- 11. The printed circuit board of any of claims 1 to 10, wherein all the self-contained units of electronic components are disposed on only the first surface.
- 12. The printed circuit board of any of Claims 1 to 10, wherein one or more self-contained units of electronic components is deposited onto the first surface and one or more self-contained units of electronic components is deposited onto the second surface.
- 13. The printed circuit board of any of Claims 1 to 12, wherein the self-contained unit of electronic components disposed on the rigid regions are configured such that the order of electronic components on any given rigid region is reversed in the self-contained unit of electronic components disposed on any adjacent rigid region.
- 14. The printed circuit board of any of claims 1 to 13, wherein one or more of the notches on the printed circuit board are U shaped.
- 15. The printed circuit board of any of claims 1 to 13, wherein one or more of the notches on the printed circuit board are V shaped.
- 16. The printed circuit board of any of claims 1 to 13, wherein one or more of the notches on the printed circuit board are arcuate.
- 17. A method of production of the printed circuit board of any of claims 1 to 13; wherein one or more notches are disposed onto one or more edges of an elongate printed circuit board substrate creating one or more flexible regions in which the printed circuit board can flex; wherein a plurality of self-contained units of electronic components are disposed onto rigid regions of printed circuit board adjacent to notches; wherein adjacent self-contained units of electronic components are electronically connected by the deposition of conductive tracks onto one or more surfaces of the notched flexible region between them.
- 18. A method of production of the vias of claim 7; Wherein through hole plating is used to create vias connecting conductive tracks on opposing surfaces of the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1906295.9A GB2585350A (en) | 2019-05-03 | 2019-05-03 | Modular printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1906295.9A GB2585350A (en) | 2019-05-03 | 2019-05-03 | Modular printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB201906295D0 GB201906295D0 (en) | 2019-06-19 |
| GB2585350A true GB2585350A (en) | 2021-01-13 |
Family
ID=67385019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1906295.9A Withdrawn GB2585350A (en) | 2019-05-03 | 2019-05-03 | Modular printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2585350A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120217520A1 (en) * | 2009-11-02 | 2012-08-30 | Seong Gon Baik | Led mount bar capable of freely forming curved surfaces thereon |
| US20140001498A1 (en) * | 2011-03-22 | 2014-01-02 | Koninklijke Philips N.V. | Substrate for mounting a plurality of light emitting elements |
| US20160150636A1 (en) * | 2013-09-06 | 2016-05-26 | Murata Manufacturing Co., Ltd. | Multilayer substrate |
| DE102015206324A1 (en) * | 2015-04-09 | 2016-10-13 | H4X E.U. | Flat illuminant carrier, method for producing a planar illuminant carrier having a predetermined bending, and illumination device |
-
2019
- 2019-05-03 GB GB1906295.9A patent/GB2585350A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120217520A1 (en) * | 2009-11-02 | 2012-08-30 | Seong Gon Baik | Led mount bar capable of freely forming curved surfaces thereon |
| US20140001498A1 (en) * | 2011-03-22 | 2014-01-02 | Koninklijke Philips N.V. | Substrate for mounting a plurality of light emitting elements |
| US20160150636A1 (en) * | 2013-09-06 | 2016-05-26 | Murata Manufacturing Co., Ltd. | Multilayer substrate |
| DE102015206324A1 (en) * | 2015-04-09 | 2016-10-13 | H4X E.U. | Flat illuminant carrier, method for producing a planar illuminant carrier having a predetermined bending, and illumination device |
Also Published As
| Publication number | Publication date |
|---|---|
| GB201906295D0 (en) | 2019-06-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |