JP5840663B2 - 放熱板 - Google Patents
放熱板 Download PDFInfo
- Publication number
- JP5840663B2 JP5840663B2 JP2013189365A JP2013189365A JP5840663B2 JP 5840663 B2 JP5840663 B2 JP 5840663B2 JP 2013189365 A JP2013189365 A JP 2013189365A JP 2013189365 A JP2013189365 A JP 2013189365A JP 5840663 B2 JP5840663 B2 JP 5840663B2
- Authority
- JP
- Japan
- Prior art keywords
- surface structure
- heat
- conductive material
- rough surface
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/04—Constructions of heat-exchange apparatus characterised by the selection of particular materials of ceramic; of concrete; of natural stone
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Resistance Heating (AREA)
Description
110a、110b 熱伝導性材料層
112a、112b 上表面
114a、114b 下表面
116b 導電性スルーホール構造
120 第1金属層
122 第1粗表面構造
130 金属基板
132 第2粗表面構造
140 金属リングフレーム
160a、160b 第2金属層
200a、200b、200d、200e、200f LEDチップ
210 誘電体層
220 ボンディングワイヤー
230 回路
240 接着層
250 銀ペースト
C 流体チャンバー
E 熱
F 作動流体
H1、H2、H3 開口
Claims (9)
- 発熱素子に対して放熱を行うのに適した放熱板であり、
互いに向かい合う上表面と下表面を有し、材料が、セラミックまたはシリコンゲルマニウムを含み、前記発熱素子が熱伝導性材料層の前記上表面に配置されている熱伝導性材料層と、
前記熱伝導性材料層の前記下表面に配置され、第1粗表面構造を有する第1金属層と、
前記第1金属層の下方に配置され、第2粗表面構造を有する金属基板と、
前記第1金属層と前記金属基板の間に配置された金属リングフレームと
を含み、
前記第1粗表面構造が、凹凸表面構造であり、
前記第1粗表面構造の最大高度粗さが、数マイクロメートルから数センチメートルの間であり、
前記第1粗表面構造、前記金属リングフレームおよび前記第2粗表面構造が、偏平構造の流体チャンバーを定義し、前記流体チャンバー内に作動流体が流入し、前記流体チャンバーは低真空状態であり、
前記第2粗表面構造が、凹凸表面構造であり、
前記第2粗表面構造の最大高度粗さが、数マイクロメートルから数センチメートルの間であり、
前記作動流体は液体相の作動流体と気体相の作動流体の間で変換を行い、以下のステップ(1)〜ステップ(3)のサイクルを繰り返し、前記発熱素子によって生成された熱を取り除き、
ステップ(1)前記液体相の作動流体は前記発熱素子によって生成された熱を吸収して、蒸発し、前記気体相の作動流体となり、
ステップ(2)前記気体相の作動流体は対面の前記第2粗表面構造に移動し、凝縮して前記液体相の作動流体となり、
ステップ(3)前記液体相の作動流体は前記第2粗表面構造の凹凸表面構造及び前記第1粗表面構造の凹凸表面構造の毛細管作用によって、上向きに流入させ、二次元側方流動を行い、対応する前記発熱素子の位置に戻ること、
を含む放熱板。 - 前記熱伝導性材料層が、さらに、少なくとも1つの導電スルーホール構造を含み、
前記少なくとも1つの導電スルーホール構造が、前記第1金属層の一部を露出するとともに、前記第1金属層に電気接続された請求項1に記載の放熱板。 - 前記熱伝導性材料層の前記上表面に配置され、前記熱伝導性材料層を完全に覆うか、または、一部を露出する第2金属層をさらに含む請求項2に記載の放熱板。
- 前記熱伝導性材料層の前記上表面に配置され、前記熱伝導性材料層を完全に覆うか、または、一部を露出する第2金属層をさらに含む請求項1に記載の放熱板。
- 前記熱伝導性材料層と前記第1金属層を貫通し、前記流体チャンバーに連通する少なくとも1つの開口をさらに含む請求項1に記載の放熱板。
- 前記金属リングフレームを貫通し、前記流体チャンバーに連通する少なくとも1つの開口をさらに含む請求項1に記載の放熱板。
- 前記金属基板を貫通し、前記流体チャンバーに連通する少なくとも1つの開口をさらに含む請求項1に記載の放熱板。
- 前記第1金属層の材料、前記金属基板の材料および前記金属リングフレームの材料が、銅、アルミニウムまたはその合金を含む請求項1に記載の放熱板。
- 前記作動流体が、空気または液体を含む請求項1に記載の放熱板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW102117918A TWI513069B (zh) | 2013-05-21 | 2013-05-21 | 散熱板 |
TW102117918 | 2013-05-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014228270A JP2014228270A (ja) | 2014-12-08 |
JP5840663B2 true JP5840663B2 (ja) | 2016-01-06 |
Family
ID=48792976
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013189365A Expired - Fee Related JP5840663B2 (ja) | 2013-05-21 | 2013-09-12 | 放熱板 |
Country Status (5)
Country | Link |
---|---|
US (2) | US20140345841A1 (ja) |
EP (1) | EP2806455B1 (ja) |
JP (1) | JP5840663B2 (ja) |
CN (1) | CN104183690B (ja) |
TW (1) | TWI513069B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104538372B (zh) * | 2014-12-29 | 2018-05-22 | 华进半导体封装先导技术研发中心有限公司 | 散热型封装结构及其制作方法、散热型封装基板 |
JP6799503B2 (ja) * | 2016-12-14 | 2020-12-16 | 新光電気工業株式会社 | ヒートパイプ及びその製造方法 |
CN109257903A (zh) * | 2017-07-12 | 2019-01-22 | 深圳市蓝海华腾技术股份有限公司 | 流管散热装置及其制造方法 |
CN109891178A (zh) * | 2017-09-19 | 2019-06-14 | 华为技术有限公司 | 由冲压工艺形成的薄型均热板 |
DE102018206020A1 (de) * | 2018-04-19 | 2019-10-24 | Siemens Aktiengesellschaft | Kühlanordnung für elektrische Bauelemente, Stromrichter mit einer Kühlanordnung sowie Luftfahrzeug mit einem Stromrichter |
TW202022301A (zh) * | 2018-12-04 | 2020-06-16 | 十銓科技股份有限公司 | 水冷式固態硬碟裝置 |
JP7197346B2 (ja) * | 2018-12-19 | 2022-12-27 | 新光電気工業株式会社 | ループ型ヒートパイプ |
TWI686108B (zh) | 2019-02-26 | 2020-02-21 | 嘉聯益科技股份有限公司 | 線路板模組及其散熱板結構 |
US20210408619A1 (en) * | 2020-06-30 | 2021-12-30 | Valeo North America, Inc. | Heat exchange interface and a method of configuring the same |
TWI791342B (zh) | 2021-11-30 | 2023-02-01 | 財團法人工業技術研究院 | 異質整合半導體封裝結構 |
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2013
- 2013-05-21 TW TW102117918A patent/TWI513069B/zh not_active IP Right Cessation
- 2013-07-03 CN CN201310275893.6A patent/CN104183690B/zh not_active Expired - Fee Related
- 2013-07-05 US US13/935,580 patent/US20140345841A1/en not_active Abandoned
- 2013-07-05 EP EP13175376.6A patent/EP2806455B1/en not_active Not-in-force
- 2013-09-12 JP JP2013189365A patent/JP5840663B2/ja not_active Expired - Fee Related
-
2016
- 2016-06-14 US US15/181,434 patent/US20160282055A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP2806455B1 (en) | 2018-07-04 |
EP2806455A2 (en) | 2014-11-26 |
TWI513069B (zh) | 2015-12-11 |
EP2806455A3 (en) | 2016-08-24 |
CN104183690B (zh) | 2017-09-15 |
TW201445785A (zh) | 2014-12-01 |
CN104183690A (zh) | 2014-12-03 |
US20140345841A1 (en) | 2014-11-27 |
US20160282055A1 (en) | 2016-09-29 |
JP2014228270A (ja) | 2014-12-08 |
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