M361859 五、新型說明： 【新型所屬之技術領域】 本創作、係有關一種微均熱基板，尤指一種能夠有效降 低熱阻，藉以提升等效熱傳導係數與均溫效能並供電子元 件建構之微均熱基板。 疋 【先前技術】 按，一般各發光二極體多係建構在印刷電路板上並且 與印刷電路板上的電路接點電性連接，但由於印刷電路板 之導熱性較差，不利於發光二極體之廢熱排放，不但會因 為所產生的高溫影響發光二極體模組之運作效能，更有可 能因為發光二極體所產生的高溫而造成相關元件耗損。 為了解決發光二極體模組因為發光二極體產生的高、、θ 所衍生的相關問題，最直接的方妓在發光二極體模= 印刷電路板上方另外設置一散熱座(散熱板)，或是如第— 圖所示，由散熱板ίο取代印刷電路板，而將發光二極體 2〇係建構在該散熱板1G上，該散熱板1()上係、建構有相關 電路接點11供與各發光二極體2Q電性連接，再於電路接 點11與散熱才反10白勺板面之間設有—絕緣層30，用以將 路接點11與散熱板10隔絕。 上揭第-圖所示習用發光二極體模組當中的散熱板10 係可以為喊板、銅基板、陶£基板或^墨基板等，各該 位於散熱板10下方之發光二極體20所產生的廢熱，雖‘ 可以透過散熱板H)向外釋放，但受限於散熱板1G材料本 3 M361859 身的熱阻特性，其散熱效能仍有相當改善空間。 【新型内容】 s , 有鑑於此，；4創作之主要目的即在提供一種能知有效 降低熱阻，藉以提升等效熱傳導係數與均溫效能並供電子 元件建構之微均熱基板。 為達上揭目的，本創作之微均熱基板係在一微均熱板 ^ 内部係設有腔體，並於腔體内佈滿毛細結構，另將工作流 體以低壓或真空狀態封存於該腔體中，並在其上壁面建構 有電路接點供與電子元件電性連接，以及在電路接點與微 均熱板上壁面之間設有高導熱性絕緣層加以隔絕。 據以，當電子元件之熱源自微均熱板上壁面傳入腔體 時，工作流體因受熱成為蒸氣而充滿整個腔體，透過上、 下壁面將廢熱釋放至微均熱板外界，凝結後的工作流體再 順著毛細結構向熱源處回流補充被蒸發的工作流體，可利 用工作流體於微均熱板内部重複相變化循環，降低均熱板 > 熱阻，進而能夠有效提升整體微均熱基板之等效熱傳導係 數與均溫效能。 【實施方式】 ' 本創作之特點，可參閱本案圖式及實施例之詳細說明 -而獲得清楚地瞭解。 如第二圖所示，本創作「供電子元件建構之微均熱基 板」，係包括有：一微均熱板40，以及工作流體50 ;其中： 該微均熱板40内部係設有腔體41，並且於腔體41内佈 M361859 滿毛細結構42，整體微均熱板4〇主體係可以由一中空區段 43區隔成上、下板塊兩個區域。該工作流體5〇係可以為水、 氨、乙醇、甲醇、乙嵊或介電液，並以低壓或真空狀態封 存於該微均熱板40之腔;體41中。 ‘M361859 V. New description: [New technical field] This creation is related to a micro-homogeneous substrate, especially one that can effectively reduce the thermal resistance, thereby improving the equivalent heat transfer coefficient and the uniform temperature performance and the construction of electronic components. Soaking substrate.疋[Prior Art] Press, generally, each LED is constructed on a printed circuit board and electrically connected to the circuit contacts on the printed circuit board. However, due to the poor thermal conductivity of the printed circuit board, it is not conducive to the light-emitting diode. The waste heat discharge of the body not only affects the operating efficiency of the LED module due to the high temperature generated, but is also more likely to cause loss of related components due to the high temperature generated by the LED. In order to solve the problems associated with the high and θ generated by the LEDs of the LED module, the most direct method is to provide a heat sink (heat sink) on the LED board = above the printed circuit board. Or, as shown in the first figure, the heat-dissipating board ίο replaces the printed circuit board, and the light-emitting diode 2 is constructed on the heat-dissipating board 1G, and the heat-dissipating board 1() is constructed and connected with relevant circuits. Point 11 is electrically connected to each of the light-emitting diodes 2Q, and an insulating layer 30 is disposed between the circuit contacts 11 and the surface of the heat-dissipating surface 10 for isolating the road contact 11 from the heat-dissipating plate 10. . The heat dissipation plate 10 in the conventional light-emitting diode module shown in the above-mentioned figure may be a shim board, a copper substrate, a ceramic substrate or an ink substrate, and the light-emitting diodes 20 located under the heat dissipation plate 10 respectively. The generated waste heat, although 'can be released through the heat sink H), is limited by the thermal resistance of the heat sink 1G material, and the heat dissipation performance still has considerable room for improvement. [New content] s, in view of this, the main purpose of the creation is to provide a micro-heating substrate that can effectively reduce the thermal resistance, thereby improving the equivalent heat transfer coefficient and the uniform temperature performance and constructing the electronic components. In order to achieve the goal, the micro-heat-sense substrate of the present invention is provided with a cavity inside a micro-monothermal plate, and is covered with a capillary structure in the cavity, and the working fluid is sealed in a low pressure or vacuum state. In the cavity, a circuit contact is formed on the upper wall thereof for electrically connecting with the electronic component, and a high thermal conductive insulation layer is provided between the circuit contact and the wall surface of the micro-homogeneous heat plate to isolate. According to the figure, when the heat of the electronic component originates from the wall surface of the micro-averaged heat plate, the working fluid fills the entire cavity due to the heat becoming vapor, and the waste heat is released to the outside of the micro-heat plate through the upper and lower wall surfaces, and after condensation The working fluid then replenishes the evaporated working fluid along the capillary structure to the heat source, and the working fluid can be used to repeat the phase change cycle inside the micro-monothermal plate to reduce the heat transfer plate> thermal resistance, thereby effectively improving the overall micro-average The equivalent thermal conductivity and uniform temperature performance of the thermal substrate. [Embodiment] The characteristics of this creation can be clearly understood by referring to the detailed description of the drawings and the examples. As shown in the second figure, the present invention "micro-heating substrate for electronic component construction" includes: a micro-smooth plate 40, and a working fluid 50; wherein: the micro-hydrogen plate 40 is internally provided with a cavity The body 41 is covered with a M361859 full capillary structure 42 in the cavity 41, and the overall micro-smooth plate 4〇 main system can be divided into two regions of the upper and lower plates by a hollow section 43. The working fluid 5 can be water, ammonia, ethanol, methanol, acetamidine or a dielectric liquid, and is sealed in the cavity of the micro-monothermal plate 40 in a low pressure or vacuum state; ‘
再者，上揭微均熱板4〇之主體係可以為鋁、鋼或不銹 鋼，並在其下壁面建構有電路接點44供與晶#、發光二 -體等電子元件電性連接，以及在電路接點44與微D •=面之間时高導熱性絕緣層45力心隔絕；於實施時， 熱性絕緣層45可以由氮輪、氮化硼以及踢合材料 所、=成，、而該電路接點44係可以利用銀膠或共晶法與電子 凡件構成電性連接。 … 王π 微d恐极叫円邵的毛細構造42係可以 ^部的:維結構421(如第二圖所示)所產生奶 燒St:/，於腔體41内部的銅粉、鎳粉、銘粉等 内部的銅、不錄鋼等金屬網結構二:生由==體41 於可以為上揭纖維結構、燒iPf24所產生，甚至 ,几'、、σ知末，以及溝槽結構之袓人。 如弟六圖所示，本創作之 、，，口 :均熱板4。下壁面供建構電子元^基用時’係由 :的熱源自微均熱板40下壁 0二;子-件6。所產 因受熱成為蒸氣而充滿整個腔體4l;Jj二作流㈣ 4〇上壁面時，即透過上壁面將廢熱釋==均熱板 :且冷卻凝結成液體，凝結後的工作流體板4。外界 42向熱源處回流補充被蒸發 ^ 者毛細結 作，爪體，整體微均熱板 5 M361859 即！1用工作流體50於微均熱板40内部重複相變化循環，降 ^均熱板4 〇熱阻藉以提升整體微均熱板之等 數與均溫效能。 w ^的疋，本創作薇均熱板的工作流體乃以水之 熱力性貝為最適合微電子冷卻技術的應用，水有很大的潛 ，旦所以，彿騰發生相變化時，只需要少量的水就能帶走 里的熱里。水同時具有很大的表©張力，可以在毛細結Furthermore, the main system of the micro-heating plate 4 can be aluminum, steel or stainless steel, and a circuit contact 44 is formed on the lower wall surface thereof for electrically connecting with electronic components such as the crystal and the light-emitting body. The high thermal conductive insulating layer 45 is strongly insulated between the circuit contact 44 and the micro D•= face; in implementation, the thermal insulating layer 45 may be composed of a nitrogen wheel, a boron nitride, and a kicking material, The circuit contact 44 can be electrically connected to the electronic component by using silver glue or eutectic method. ... Wang π micro-deep screaming 円 的 的 的 的 的 的 的 的 42 42 42 42 42 的 的 的 的 的 的 42 42 42 421 421 421 421 421 421 421 421 421 421 421 421 421 421 421 421 421 421 421 421 , Ming powder and other internal copper, non-recorded steel and other metal mesh structure 2: raw == body 41 can be used to expose the fiber structure, burning iPf24, even, a few ', σ know the end, and the groove structure袓人. As shown in the sixth picture of the brother, the creation, and the mouth: the hot plate 4. The lower wall surface is used for constructing the electron element. The heat from the lower surface of the micro-hydrothermal plate 40 is 0; the sub-piece 6. The product is filled with steam to fill the entire cavity 4l; Jj two flow (4) 4 〇 upper wall surface, that is, through the upper wall surface will waste heat release = = soaking plate: and cooling condensed into a liquid, condensed working fluid plate 4 . The outside world 42 recirculates to the heat source to replenish the evaporated capillary, the claw body, and the overall micro-uniform heat plate. 5 M361859 That is! 1 Repeating the phase change cycle inside the micro-monolithic plate 40 with the working fluid 50, and reducing the thermal resistance of the soaking plate 4 to improve the equal and uniform temperature performance of the overall micro-smooth plate. w ^ 疋, the working fluid of this creation Wei is hot plate is the most suitable for the application of microelectronic cooling technology, the water has a great potential A small amount of water can take away the heat inside. Water also has a large gauge © tension, which can be in the capillary knot
構中產生巨大的毛細力，使微均熱板抗重力的效果更明 ^此外水的熱傳導係數在液體中亦相當高，將可使熱 置在傳遞日ΤΓ的過熱度降低。 由上揭微均熱板的工作原理可知，腔體為一低壓或真 空狀態二隨著微均熱板整體厚度的改變，腔體厚度也會不 同’而蒸氣及冷凝水於腔體内部的循環流動是影響微均敎 板熱性能的重要條件，當微均熱板的熱負荷加大時，立質 2流量也加大。腔體空間若太小，將不Μ使循環流動順 ί吉因此熱性能變差，·反之，腔體空間若太大，由於腔體 疋真空狀態，將導致微均熱板強度變差。 旦再者，工作流體在微均熱板内部產生相變化，使得教 ，可以很快的自面積狹小的發熱源，傳至面積廣大的腔體 -域’因此微均熱板可以有效的降低底板熱阻，增加絲 性能’除了表示能在小溫差下有很大的傳熱能力外，還音 味有相當大的均溫能力；尤其，毛細結構的設計對重㈣ 用較不敏感，傾斜之後仍然可以正常運作。 綜上所述’本創作提供一較佳可行供電子元件建構之 微均熱基板，爰依法提呈新型專利之申請；本創作之技術 M361859 内容及技術特點巳揭示如上，然而熟悉本項技術之人士仍 可能基於本創作之揭示而作各種不背離本案創作精神之替 摻及修飾。因此，本創作之保護範圍應不限於實施例所揭 不者，而應包括各種不背離本創作·之替換及修飾，並為以 下之申請專利範圍所涵蓋。 ‘' 【圖式簡單說明】 第一圖係為一習用散熱板之使用狀態結構剖視圖。 第二圖係為本創作第一實施例之微均熱基板結構剖視圖。 第三圖係為本創作第二實施例之微均熱基板結構剖視圖。 第四圖係為本創作第三實施例之微均熱基板結構剖視圖。 第五圖係為本創作第四實施例之微均熱基板結構剖視=。 第六圖係為本創作微均熱基板使用狀態之結構剖視圖 【主要元件符號說明】 10散熱板 11電路接點 20發光二極體 3 0向導熱性絕緣層 4 0微均熱板 41腔體 42毛細結構 421纖維結構 422燒結粉末 423金屬網結構 7 M361859 424溝槽結構 43中空區段 44電硌接點 45絕緣'層 50工作流體 60電子元件The formation of a large capillary force in the structure makes the micro-hydrogen plate more resistant to gravity. In addition, the heat transfer coefficient of water is also quite high in the liquid, which will reduce the superheat of the heat placed on the daylight. It can be seen from the working principle of the micro-heating plate that the cavity is a low pressure or vacuum state. The thickness of the cavity will be different with the change of the overall thickness of the micro-uniform heat plate, and the circulation of vapor and condensed water inside the cavity will be different. Flow is an important condition affecting the thermal performance of the micro-uniform plate. When the heat load of the micro-average plate increases, the flow rate of the standing 2 increases. If the cavity space is too small, the circulation flow will not be smooth, so the thermal performance will be deteriorated. Conversely, if the cavity space is too large, the strength of the micro-homogeneous plate will be deteriorated due to the vacuum state of the cavity. Once again, the working fluid produces a phase change inside the micro-monothermal plate, so that the teaching can be quickly transferred from a small heat source to a large cavity-domain. Therefore, the micro-homogeneous plate can effectively reduce the bottom plate. Thermal resistance, increased filament performance 'except that it can have a large heat transfer capacity under small temperature difference, but also has a considerable uniform temperature ability; especially, the design of capillary structure is less sensitive to weight (4), after tilting Still working. In summary, the present invention provides a micro-smooth substrate for the construction of electronic components that is better and more suitable for electronic components, and proposes a new type of patent according to law; the content and technical features of the technology of the creation M361859 are disclosed above, but are familiar with the technology. It is still possible for a person to make a variety of substitutions and modifications based on the disclosure of this creation without departing from the spirit of the creation of the case. Therefore, the scope of protection of this creation is not limited to the examples disclosed, but should include various alternatives and modifications that do not depart from the present invention and are covered by the scope of the patent application below. ‘' [Simple description of the diagram] The first diagram is a sectional view of the structure of a conventional heat sink. The second figure is a cross-sectional view showing the structure of the micro-average heat substrate of the first embodiment of the present invention. The third figure is a cross-sectional view showing the structure of the micro-hydrothermal substrate of the second embodiment of the present invention. The fourth figure is a cross-sectional view showing the structure of the micro-average heat substrate of the third embodiment of the present invention. The fifth figure is a cross-sectional view of the structure of the micro-average heat substrate of the fourth embodiment of the present invention. The sixth figure is a structural cross-sectional view of the state in which the micro-heat-receiving substrate is used. [Main component symbol description] 10 heat-dissipating plate 11 circuit contact 20 light-emitting diode 3 0 guide thermal insulating layer 4 0 micro-heating plate 41 cavity 42 capillary structure 421 fiber structure 422 sintered powder 423 metal mesh structure 7 M361859 424 groove structure 43 hollow section 44 electrical contact 45 insulation 'layer 50 working fluid 60 electronic components