JP5784736B2 - 加工性が改善されたアセチレンブラック半導体シールド材料 - Google Patents

加工性が改善されたアセチレンブラック半導体シールド材料 Download PDF

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Publication number
JP5784736B2
JP5784736B2 JP2013530203A JP2013530203A JP5784736B2 JP 5784736 B2 JP5784736 B2 JP 5784736B2 JP 2013530203 A JP2013530203 A JP 2013530203A JP 2013530203 A JP2013530203 A JP 2013530203A JP 5784736 B2 JP5784736 B2 JP 5784736B2
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acetylene black
composition
ethylene
polyolefin
carbon
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Japanese (ja)
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JP2013540172A5 (enExample
JP2013540172A (ja
Inventor
ブリガンディ，ポール，ジェイ．
Original Assignee
ユニオン カーバイド ケミカルズ アンド プラスティックス テクノロジー エルエルシー
ユニオン カーバイド ケミカルズ アンド プラスティックス テクノロジー エルエルシー
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Application filed by ユニオン カーバイド ケミカルズ アンド プラスティックス テクノロジー エルエルシー, ユニオン カーバイド ケミカルズ アンド プラスティックス テクノロジー エルエルシー filed Critical ユニオン カーバイド ケミカルズ アンド プラスティックス テクノロジー エルエルシー
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/44—Carbon
    • C09C1/48—Carbon black
    • C09C1/54—Acetylene black; thermal black ; Preparation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
    • C01P2002/72—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by d-values or two theta-values, e.g. as X-ray diagram
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
    • C01P2002/77—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by unit-cell parameters, atom positions or structure diagrams
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/10—Solid density
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/19—Oil-absorption capacity, e.g. DBP values
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/40—Electric properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/202—Applications use in electrical or conductive gadgets use in electrical wires or wirecoating

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
JP2013530203A 2010-09-22 2011-09-16 加工性が改善されたアセチレンブラック半導体シールド材料 Active JP5784736B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US38528910P 2010-09-22 2010-09-22
US61/385,289 2010-09-22
PCT/US2011/051987 WO2012040058A1 (en) 2010-09-22 2011-09-16 Acetylene black semiconducting shield material with improved processing

Publications (3)

Publication Number Publication Date
JP2013540172A JP2013540172A (ja) 2013-10-31
JP2013540172A5 JP2013540172A5 (enExample) 2014-09-25
JP5784736B2 true JP5784736B2 (ja) 2015-09-24

Family

ID=44883374

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013530203A Active JP5784736B2 (ja) 2010-09-22 2011-09-16 加工性が改善されたアセチレンブラック半導体シールド材料

Country Status (10)

Country Link
US (1) US9062175B2 (enExample)
EP (1) EP2619261B2 (enExample)
JP (1) JP5784736B2 (enExample)
KR (1) KR101833087B1 (enExample)
CN (1) CN103221464B (enExample)
BR (1) BR112013005983A2 (enExample)
CA (1) CA2809486C (enExample)
MX (1) MX338972B (enExample)
TW (1) TWI509636B (enExample)
WO (1) WO2012040058A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL2913368T3 (pl) 2014-02-28 2019-05-31 Orion Eng Carbons Gmbh Granulowana sadza acetylenowa
CN108026348B (zh) * 2015-10-07 2021-03-09 联合碳化公司 半导体屏蔽组合物
CN108884267B (zh) * 2016-02-01 2022-02-22 卡博特公司 包含炭黑的导热性聚合物组合物
CN114085555B (zh) * 2021-11-29 2023-03-14 苏州宝化炭黑有限公司 高体积电阻率炭黑、其制造工艺及其应用

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3296189A (en) 1965-07-29 1967-01-03 Warren O Eastman Chemically cross-linked polyethylene stabilized with polymerized trimethyl quinoline
US4144202A (en) 1977-12-27 1979-03-13 Union Carbide Corporation Dielectric compositions comprising ethylene polymer stabilized against water treeing with epoxy containing organo silanes
US5174924A (en) * 1990-06-04 1992-12-29 Fujikura Ltd. Ptc conductive polymer composition containing carbon black having large particle size and high dbp absorption
US5246783A (en) 1991-08-15 1993-09-21 Exxon Chemical Patents Inc. Electrical devices comprising polymeric insulating or semiconducting members
US5556697A (en) 1994-03-24 1996-09-17 Bicc Cables Corporation Semiconductive power cable shield
US5725650A (en) 1995-03-20 1998-03-10 Cabot Corporation Polyethylene glycol treated carbon black and compounds thereof
DE69611984T2 (de) 1996-01-19 2001-06-13 Denki Kagaku Kogyo K.K., Tokio/Tokyo Acetylenruss, seine Herstellung und seine Verwendung
JPH11224533A (ja) * 1998-02-06 1999-08-17 Fujikura Ltd 半導電性組成物
JP3551755B2 (ja) * 1998-04-03 2004-08-11 日立電線株式会社 剥離容易性半導電性樹脂組成物及び電線・ケーブル
ATE258709T1 (de) 1999-05-13 2004-02-15 Union Carbide Chem Plastic Halbleitfähiger kabel-schirm
US6496629B2 (en) 1999-05-28 2002-12-17 Tycom (Us) Inc. Undersea telecommunications cable
JP4294205B2 (ja) 2000-07-11 2009-07-08 電気化学工業株式会社 タイヤ成形用ゴム充填材及びその用途
EP1394878B1 (en) † 2001-05-11 2010-02-17 Kureha Corporation Separator for solid state polymer type fuel cell and method for producing the same
US6714707B2 (en) 2002-01-24 2004-03-30 Alcatel Optical cable housing an optical unit surrounded by a plurality of gel layers
JP2004018562A (ja) 2002-06-12 2004-01-22 Mitsubishi Polyester Film Copp 二軸配向ポリエステルフィルム
JP2004018652A (ja) * 2002-06-14 2004-01-22 Fujikura Ltd 半導電水密組成物
CA2528850C (en) * 2003-06-09 2012-05-01 Union Carbide Chemicals & Plastics Technology Corporation Strippable semi-conductive insulation shield
EP1726619A4 (en) * 2004-03-15 2009-08-19 Mitsubishi Chem Corp PROPYLENE RESIN COMPOSITION AND FORM BODY THEREOF
ATE517421T1 (de) * 2004-07-22 2011-08-15 Borealis Tech Oy Halbleitende polymerzusammensetzungen
JP4362116B2 (ja) 2005-10-20 2009-11-11 電気化学工業株式会社 アセチレンブラックとその製造方法、及び燃料電池用触媒
US8188191B2 (en) * 2006-08-31 2012-05-29 Mitsui Chemicals, Inc. Polyolefin polymer containing vinyl groups at both ends and composition thereof
CN101528864B (zh) * 2006-10-20 2012-10-10 电气化学工业株式会社 颗粒状乙炔黑、其制造方法和组合物
US8383012B2 (en) 2007-12-14 2013-02-26 Prysmian S.P.A. Electric article comprising at least one element made from a semiconductive polymeric material and semiconductive polymeric composition

Also Published As

Publication number Publication date
CA2809486A1 (en) 2012-03-29
CA2809486C (en) 2018-01-16
CN103221464B (zh) 2015-09-16
MX2013003343A (es) 2013-09-26
TW201218216A (en) 2012-05-01
US9062175B2 (en) 2015-06-23
BR112013005983A2 (pt) 2020-08-25
CN103221464A (zh) 2013-07-24
EP2619261B1 (en) 2014-10-29
WO2012040058A1 (en) 2012-03-29
JP2013540172A (ja) 2013-10-31
EP2619261B2 (en) 2018-10-24
KR20130140640A (ko) 2013-12-24
KR101833087B1 (ko) 2018-02-27
MX338972B (es) 2016-05-06
US20130178570A1 (en) 2013-07-11
TWI509636B (zh) 2015-11-21
EP2619261A1 (en) 2013-07-31

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