JP2013540172A5 - - Google Patents

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Publication number
JP2013540172A5
JP2013540172A5 JP2013530203A JP2013530203A JP2013540172A5 JP 2013540172 A5 JP2013540172 A5 JP 2013540172A5 JP 2013530203 A JP2013530203 A JP 2013530203A JP 2013530203 A JP2013530203 A JP 2013530203A JP 2013540172 A5 JP2013540172 A5 JP 2013540172A5
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JP
Japan
Prior art keywords
composition
acetylene black
astm
measured according
ethylene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013530203A
Other languages
English (en)
Japanese (ja)
Other versions
JP5784736B2 (ja
JP2013540172A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2011/051987 external-priority patent/WO2012040058A1/en
Publication of JP2013540172A publication Critical patent/JP2013540172A/ja
Publication of JP2013540172A5 publication Critical patent/JP2013540172A5/ja
Application granted granted Critical
Publication of JP5784736B2 publication Critical patent/JP5784736B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013530203A 2010-09-22 2011-09-16 加工性が改善されたアセチレンブラック半導体シールド材料 Active JP5784736B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US38528910P 2010-09-22 2010-09-22
US61/385,289 2010-09-22
PCT/US2011/051987 WO2012040058A1 (en) 2010-09-22 2011-09-16 Acetylene black semiconducting shield material with improved processing

Publications (3)

Publication Number Publication Date
JP2013540172A JP2013540172A (ja) 2013-10-31
JP2013540172A5 true JP2013540172A5 (enExample) 2014-09-25
JP5784736B2 JP5784736B2 (ja) 2015-09-24

Family

ID=44883374

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013530203A Active JP5784736B2 (ja) 2010-09-22 2011-09-16 加工性が改善されたアセチレンブラック半導体シールド材料

Country Status (10)

Country Link
US (1) US9062175B2 (enExample)
EP (1) EP2619261B2 (enExample)
JP (1) JP5784736B2 (enExample)
KR (1) KR101833087B1 (enExample)
CN (1) CN103221464B (enExample)
BR (1) BR112013005983A2 (enExample)
CA (1) CA2809486C (enExample)
MX (1) MX338972B (enExample)
TW (1) TWI509636B (enExample)
WO (1) WO2012040058A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2913368B1 (en) * 2014-02-28 2018-10-03 Orion Engineered Carbons GmbH Pelleted acetylene black
BR112018005526B1 (pt) * 2015-10-07 2022-06-14 Union Carbide Corporation Composição e fio ou cabo
KR102162652B1 (ko) * 2016-02-01 2020-10-08 캐보트 코포레이션 카본 블랙을 함유하는 열 전도성 중합체 조성물
CN114085555B (zh) * 2021-11-29 2023-03-14 苏州宝化炭黑有限公司 高体积电阻率炭黑、其制造工艺及其应用

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3296189A (en) 1965-07-29 1967-01-03 Warren O Eastman Chemically cross-linked polyethylene stabilized with polymerized trimethyl quinoline
US4144202A (en) 1977-12-27 1979-03-13 Union Carbide Corporation Dielectric compositions comprising ethylene polymer stabilized against water treeing with epoxy containing organo silanes
US5174924A (en) * 1990-06-04 1992-12-29 Fujikura Ltd. Ptc conductive polymer composition containing carbon black having large particle size and high dbp absorption
US5246783A (en) 1991-08-15 1993-09-21 Exxon Chemical Patents Inc. Electrical devices comprising polymeric insulating or semiconducting members
US5556697A (en) 1994-03-24 1996-09-17 Bicc Cables Corporation Semiconductive power cable shield
US5725650A (en) 1995-03-20 1998-03-10 Cabot Corporation Polyethylene glycol treated carbon black and compounds thereof
EP0785239B1 (en) * 1996-01-19 2001-03-07 Denki Kagaku Kogyo Kabushiki Kaisha Granulated acetylene black, process for its production and its application
JPH11224533A (ja) * 1998-02-06 1999-08-17 Fujikura Ltd 半導電性組成物
JP3551755B2 (ja) * 1998-04-03 2004-08-11 日立電線株式会社 剥離容易性半導電性樹脂組成物及び電線・ケーブル
DE60007914T2 (de) 1999-05-13 2004-12-23 Union Carbide Chemicals & Plastics Technology Corp., Danbury Halbleitfähiger Kabelschirm
US6496629B2 (en) 1999-05-28 2002-12-17 Tycom (Us) Inc. Undersea telecommunications cable
JP4294205B2 (ja) * 2000-07-11 2009-07-08 電気化学工業株式会社 タイヤ成形用ゴム充填材及びその用途
CN1316659C (zh) 2001-05-11 2007-05-16 株式会社吴羽 固体高分子型燃料电池用隔板及其制备方法
US6714707B2 (en) 2002-01-24 2004-03-30 Alcatel Optical cable housing an optical unit surrounded by a plurality of gel layers
JP2004018562A (ja) 2002-06-12 2004-01-22 Mitsubishi Polyester Film Copp 二軸配向ポリエステルフィルム
JP2004018652A (ja) * 2002-06-14 2004-01-22 Fujikura Ltd 半導電水密組成物
US20060142458A1 (en) * 2003-06-09 2006-06-29 Pang Kawai P Strippable semi-conductive insulation shield
JP4775257B2 (ja) * 2004-03-15 2011-09-21 三菱化学株式会社 プロピレン系樹脂組成物、及びその成形体
ATE517421T1 (de) * 2004-07-22 2011-08-15 Borealis Tech Oy Halbleitende polymerzusammensetzungen
JP4362116B2 (ja) 2005-10-20 2009-11-11 電気化学工業株式会社 アセチレンブラックとその製造方法、及び燃料電池用触媒
JP5296544B2 (ja) * 2006-08-31 2013-09-25 三井化学株式会社 両末端ビニル基含有ポリオレフィン重合体およびその組成物
JP5322652B2 (ja) * 2006-10-20 2013-10-23 電気化学工業株式会社 粒子状アセチレンブラックの製造方法及び組成物
ES2369632T3 (es) 2007-12-14 2011-12-02 Prysmian S.P.A. Artículo eléctrico que comprende al menos un elemento fabricado de un material polimérico semiconductor y una composición polimérica semiconductora.

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