JP5751258B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP5751258B2 JP5751258B2 JP2012551791A JP2012551791A JP5751258B2 JP 5751258 B2 JP5751258 B2 JP 5751258B2 JP 2012551791 A JP2012551791 A JP 2012551791A JP 2012551791 A JP2012551791 A JP 2012551791A JP 5751258 B2 JP5751258 B2 JP 5751258B2
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Description
この半田引け部64があると、ヒートサイクルなどの熱ストレスでこの箇所からクラックが導入され信頼性を低下させる。また、半田ボイドがあると熱抵抗が増大する。
また、特許文献1、2では、半田溜まり部を冷却用ベースの中心点から最短距離にある各導電パターン付絶縁基板端下の冷却用ベースに設けることは記載されていない。また、半田溜まり部を設け、かつ、冷却用ベースに温度勾配を持たせる製造方法を示唆することは記載されていない。
また、特許請求の範囲の請求項5に記載の発明によれば、請求項3に記載の発明において、前記ガスが水素ガスであるとよい。
また、特許請求の範囲の請求項6に記載の発明によれば、冷却用ベースと、前記冷却用ベース上に半田を介して固着した複数の導電パターン付絶縁基板とを具備する半導体装置の製造方法において、前記冷却用ベース上に第1溶融半田を介して前記導電パターン付絶縁基板を載置し、前記第1溶融半田に接するように、前記導電パターン付絶縁基板のうち4つの導電パターン付絶縁基板の隅で囲まれた領域の半田溜まり部に第2溶融半田を載置する工程と、冷却器上に前記冷却用ベースの外周部に接するリング状の冷却板を載置し、前記冷却板上に前記冷却用ベースを載置して、前記冷却用ベースの熱を前記冷却板を介して前記冷却器に放熱し、前記冷却用ベースの外周部の温度が低く中心点の温度が高くなるように前記冷却用ベースに温度勾配をつけ、前記隅の下の前記第1溶融半田に前記半田溜まり部から前記第2溶融半田を供給しながら前記第1溶融半田を順次固化する工程と、を含む製造方法とする。
また、特許請求の範囲の請求項7に記載の発明によれば、冷却用ベースと、前記冷却用ベース上に半田を介して固着した複数の導電パターン付絶縁基板とを具備する半導体装置の製造方法において、前記冷却用ベース上に第1溶融半田を介して前記導電パターン付絶縁基板が載置され、前記第1溶融半田に接する、前記導電パターン付絶縁基板のうち4つの導電パターン付絶縁基板の隅で囲まれた領域の半田溜まり部の第2溶融半田を設ける工程と、前記冷却用ベースの外周部に低温のガスを吹き付けることで、前記冷却用ベースの熱を放熱し、前記冷却用ベースの外周部の温度が低く中心点の温度が高くなるように前記冷却用ベースに温度勾配をつけ、前記隅の下の前記第1溶融半田に前記半田溜まり部から前記第2溶融半田を供給しながら前記第1溶融半田を順次固化させる工程と、を含む製造方法とする。
位置合わせ治具4には位置合わせ用ピン5が形成され、板半田6aと導電パターン付絶縁基板12を位置合わせする位置合わせ用の第1貫通孔21が形成されている。また、半田溜まり部8となる箇所である第2貫通孔22が中央に配置されている。この第2貫通孔22の箇所は冷却用ベース1において他の箇所より温度低下が遅くなる箇所に対応する箇所である。また、この半田溜まり部8に配置される板半田7aは、導電パターン付絶縁基板12下に配置される板半田6aにA部で接するように配置される。
この冷却板16は中央部に穴16bが開いており、この穴16bの中心点30と半田溜まり部8の中心点とは一致するように位置合わせされる。リング状の板部16aを介して冷却用ベース1の熱が冷却器18へ放熱されるので、冷却用ベース1の周囲の温度低下が早くなり、半田溜まり部8の温度低下が他の箇所よりも遅くなる。その結果、半田欠陥ができ易い半田溜まり部8に近接する導電パターン付絶縁基板12の隅に半田溜まり部8からの溶融半田7bが供給され、この隅の半田不足が解消されて、半田引け部や半田ボイドなどの半田欠陥の発生が防止される。
冷却板16を設置する代わりに、冷却板16の板部16a接する箇所に冷たいガスを吹き付けて冷却用ベース1の周囲を冷却してもよい。
2 高さ調整用突起
3 位置合わせ兼用の取付け穴
4 位置合わせ治具
5 位置合わせ用ピン
6 半田(固化した半田)
6a 板半田(導電パターン付絶縁基板下の板半田)
6b 溶融半田(導電パターン付絶縁基板下の溶融半田)
7a 板半田(半田溜まり部8に載置された板半田)
7b 溶融半田(半田溜まり部8の溶融半田)
8 半田溜まり部
9 裏面導電膜
10 絶縁板
11 導電パターン
12 導電パターン付絶縁基板
13 チャンバー
14 加熱器
15 圧力
16 冷却板
16a リング状の板部
16b 穴
17 突起
18 冷却器
21 第1貫通孔
22 第2貫通孔
23 凹部
30 中心点
31 熱
32 位置
Claims (7)
- 冷却用ベースと、前記冷却用ベース上に半田を介して固着した複数の導電パターン付絶縁基板とを具備する半導体装置の製造方法において、
前記冷却用ベースの前記導電パターン付絶縁基板の載置領域に形成された高さ調節用突起に貫通させて前記冷却用ベース上に配置した第1溶融半田を介して前記導電パターン付絶縁基板を載置し、前記第1溶融半田に接するように半田溜まり部に第2溶融半田を載置する工程と、
冷却器上に前記冷却用ベースの外周部に接するリング状の冷却板を載置し、前記冷却板上に前記冷却用ベースを載置して、前記冷却用ベースの熱を前記冷却板を介して前記冷却器に放熱し、前記冷却用ベースの外周部の温度が低く中心点の温度が高くなるように前記冷却用ベースに温度勾配をつけ、前記導電パターン付絶縁基板下の前記第1溶融半田に前記半田溜まり部から前記第2溶融半田を供給しながら前記第1溶融半田を順次固化する工程と、を含むことを特徴とする半導体装置の製造方法。 - 冷却用ベースと、前記冷却用ベース上に半田を介して固着した複数の導電パターン付絶縁基板とを具備する半導体装置の製造方法において、
前記冷却用ベース上に位置合わせ治具を位置決めして載置する工程と、
前記位置合わせ治具に形成される第1貫通孔に第1板半田を挿入し、前記第1貫通孔に接する第2貫通孔に第2板半田を挿入し、前記第1板半田上に導電パターン付絶縁基板を挿入する工程と、
前記冷却用ベース上の前記第1板半田および前記第2板半田を溶融させて第1溶融半田および前記第1溶融半田と接する第2溶融半田にする工程と、
冷却器上に前記冷却用ベースの外周部に接するリング状の冷却板を載置し、前記冷却板上に前記冷却用ベースを載置して前記冷却用ベースの中心点の温度低下を外周部の温度低下より遅くし、半田溜まり部から前記第2溶融半田を前記第1溶融半田に供給しながら前記第1溶融半田を固化する工程と、を含む半導体装置の製造方法であって、
前記半田溜まり部を前記各導電パターン付絶縁基板端と前記中心点との距離が最短になる前記冷却用ベースの位置に接するように前記冷却用ベース上に設け、前記半田溜まり部の前記第2溶融半田を前記第1溶融半田より遅く固化させることを特徴とする半導体装置の製造方法。 - 冷却用ベースと、前記冷却用ベース上に半田を介して固着した複数の導電パターン付絶縁基板とを具備する半導体装置の製造方法において、
前記冷却用ベースの前記導電パターン付絶縁基板の載置領域に形成された高さ調節用突起に貫通させて前記冷却用ベース上に配置した第1溶融半田を介して前記導電パターン付絶縁基板が載置され、前記第1溶融半田に接する半田溜まり部の第2溶融半田を設ける工程と、
前記冷却用ベースの外周部に低温のガスを吹き付けることで、前記冷却用ベースの熱を放熱し、前記冷却用ベースの外周部の温度が低く中心点の温度が高くなるように前記冷却用ベースに温度勾配をつけ、前記導電パターン付絶縁基板下の前記第1溶融半田に前記半田溜まり部から前記第2溶融半田を供給しながら前記第1溶融半田を順次固化させる工程と、を含むことを特徴とする半導体装置の製造方法。 - 前記半田溜まり部下の前記冷却用ベースに凹部を設けることを特徴とする請求項1〜3のいずれか一項に記載の半導体装置の製造方法。
- 前記ガスが水素ガスであることを特徴とする請求項3に記載の半導体装置の製造方法。
- 冷却用ベースと、前記冷却用ベース上に半田を介して固着した複数の導電パターン付絶縁基板とを具備する半導体装置の製造方法において、
前記冷却用ベース上に第1溶融半田を介して前記導電パターン付絶縁基板を載置し、前記第1溶融半田に接するように、前記導電パターン付絶縁基板のうち4つの導電パターン付絶縁基板の隅で囲まれた領域の半田溜まり部に第2溶融半田を載置する工程と、
冷却器上に前記冷却用ベースの外周部に接するリング状の冷却板を載置し、前記冷却板上に前記冷却用ベースを載置して、前記冷却用ベースの熱を前記冷却板を介して前記冷却器に放熱し、前記冷却用ベースの外周部の温度が低く中心点の温度が高くなるように前記冷却用ベースに温度勾配をつけ、前記隅の下の前記第1溶融半田に前記半田溜まり部から前記第2溶融半田を供給しながら前記第1溶融半田を順次固化する工程と、を含むことを特徴とする半導体装置の製造方法。 - 冷却用ベースと、前記冷却用ベース上に半田を介して固着した複数の導電パターン付絶縁基板とを具備する半導体装置の製造方法において、
前記冷却用ベース上に第1溶融半田を介して前記導電パターン付絶縁基板が載置され、前記第1溶融半田に接する、前記導電パターン付絶縁基板のうち4つの導電パターン付絶縁基板の隅で囲まれた領域の半田溜まり部の第2溶融半田を設ける工程と、
前記冷却用ベースの外周部に低温のガスを吹き付けることで、前記冷却用ベースの熱を放熱し、前記冷却用ベースの外周部の温度が低く中心点の温度が高くなるように前記冷却用ベースに温度勾配をつけ、前記隅の下の前記第1溶融半田に前記半田溜まり部から前記第2溶融半田を供給しながら前記第1溶融半田を順次固化させる工程と、を含むことを特徴とする半導体装置の製造方法。
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