JP5730048B2 - 加工装置 - Google Patents
加工装置 Download PDFInfo
- Publication number
- JP5730048B2 JP5730048B2 JP2011022782A JP2011022782A JP5730048B2 JP 5730048 B2 JP5730048 B2 JP 5730048B2 JP 2011022782 A JP2011022782 A JP 2011022782A JP 2011022782 A JP2011022782 A JP 2011022782A JP 5730048 B2 JP5730048 B2 JP 5730048B2
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- 238000003860 storage Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 description 39
- 239000004065 semiconductor Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Machine Tool Sensing Apparatuses (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011022782A JP5730048B2 (ja) | 2011-02-04 | 2011-02-04 | 加工装置 |
CN201210023465.XA CN102629566B (zh) | 2011-02-04 | 2012-02-02 | 加工装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011022782A JP5730048B2 (ja) | 2011-02-04 | 2011-02-04 | 加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012161861A JP2012161861A (ja) | 2012-08-30 |
JP5730048B2 true JP5730048B2 (ja) | 2015-06-03 |
Family
ID=46587794
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011022782A Active JP5730048B2 (ja) | 2011-02-04 | 2011-02-04 | 加工装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5730048B2 (zh) |
CN (1) | CN102629566B (zh) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2907621B1 (en) * | 2012-10-11 | 2019-12-04 | Makino Milling Machine Co., Ltd. | Tool path-generating method, machine tool control device and tool path-generating device |
WO2014068677A1 (ja) | 2012-10-30 | 2014-05-08 | 株式会社牧野フライス製作所 | ワーク取付情報報知装置 |
EP2915625B1 (en) * | 2012-10-30 | 2019-12-04 | Makino Milling Machine Co., Ltd. | Machine tool control device and machine tool |
WO2014068709A1 (ja) * | 2012-10-31 | 2014-05-08 | 株式会社牧野フライス製作所 | 工作機械の制御装置および工作機械 |
JP6215660B2 (ja) * | 2013-11-13 | 2017-10-18 | 株式会社ジェイテクト | 研削盤 |
JP6143668B2 (ja) * | 2013-12-28 | 2017-06-07 | Towa株式会社 | 電子部品製造用の切断装置及び切断方法 |
KR101679131B1 (ko) * | 2014-12-29 | 2016-11-23 | 주식회사 엘지실트론 | 웨이퍼 연마장치 및 그 연마방법 |
JP2016165785A (ja) * | 2015-03-10 | 2016-09-15 | 株式会社ディスコ | 可動装置および加工装置 |
CN105773303A (zh) * | 2016-04-12 | 2016-07-20 | 莱芜钢铁集团有限公司 | 机床直线升降精度矫正用辅助组件及方法 |
CN105855629B (zh) * | 2016-05-25 | 2018-05-08 | 重庆大学 | 自动修锉装置及其修锉方法 |
JP2019018326A (ja) | 2017-07-21 | 2019-02-07 | 株式会社ディスコ | 研削装置 |
JP7114166B2 (ja) * | 2018-01-16 | 2022-08-08 | 株式会社ディスコ | 切削ブレードの管理方法及び切削装置 |
JP7279326B2 (ja) * | 2018-09-27 | 2023-05-23 | 株式会社ジェイテクト | 工作機械 |
CN109531840B (zh) * | 2018-11-29 | 2020-12-04 | 武汉畅新科技发展有限公司 | Led晶圆片的切割装置 |
JP7246827B2 (ja) | 2018-12-27 | 2023-03-28 | 株式会社ディスコ | 自己診断機能を備える加工装置 |
CN112223501A (zh) * | 2020-10-13 | 2021-01-15 | 沈阳汉为科技有限公司 | 一种新型蜂窝陶瓷模具开槽装置 |
CN115284167A (zh) * | 2022-06-13 | 2022-11-04 | 哈尔滨汽轮机厂有限责任公司 | 一种轴承箱基架研磨非标装备及其使用方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5272180A (en) * | 1975-12-13 | 1977-06-16 | Fujitsu Ltd | Positioning stopper for moving object |
JPS55132971U (zh) * | 1979-03-14 | 1980-09-20 | ||
JPH01109048A (ja) * | 1987-10-23 | 1989-04-26 | Matsuo Sangyo Kk | ねじ送り装置の自動制御方法 |
-
2011
- 2011-02-04 JP JP2011022782A patent/JP5730048B2/ja active Active
-
2012
- 2012-02-02 CN CN201210023465.XA patent/CN102629566B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN102629566A (zh) | 2012-08-08 |
CN102629566B (zh) | 2016-04-06 |
JP2012161861A (ja) | 2012-08-30 |
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