JP2016165785A - 可動装置および加工装置 - Google Patents
可動装置および加工装置 Download PDFInfo
- Publication number
- JP2016165785A JP2016165785A JP2015047560A JP2015047560A JP2016165785A JP 2016165785 A JP2016165785 A JP 2016165785A JP 2015047560 A JP2015047560 A JP 2015047560A JP 2015047560 A JP2015047560 A JP 2015047560A JP 2016165785 A JP2016165785 A JP 2016165785A
- Authority
- JP
- Japan
- Prior art keywords
- scale
- axis
- cutting
- movable
- chuck table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012545 processing Methods 0.000 title claims abstract description 34
- 239000000463 material Substances 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 8
- 239000011347 resin Substances 0.000 claims abstract description 8
- 229920005989 resin Polymers 0.000 claims abstract description 8
- 239000011521 glass Substances 0.000 claims description 11
- 229910045601 alloy Inorganic materials 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 7
- 238000001514 detection method Methods 0.000 abstract description 32
- 238000003754 machining Methods 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 7
- 230000008602 contraction Effects 0.000 description 5
- 238000003384 imaging method Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Dicing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Transmission And Conversion Of Sensor Element Output (AREA)
Abstract
Description
実施形態に係る可動装置及び加工装置を図1から図4に基づいて説明する。図1は、実施形態に係る切削装置の構成例を示す斜視図である。図2は、実施形態に係る切削装置のY軸移動手段などを示す正面図である。図3は、実施形態に係る切削装置のY軸位置検出手段を示す上面図である。図4は、図3に示されたY軸移動手段のスケール部の正面図である。
2 装置本体(本体部)
3c 水平梁(本体部)
10 チャックテーブル(可動部)
10a 保持面
11 テーブル移動基台(可動部)
20 切削手段(加工手段、可動部)
30 X軸移動手段(移動手段)
40 Y軸移動手段(移動手段)
44 ブレード移動基台(可動部)
50 Z軸移動手段(移動手段)
60 X軸位置検出手段(位置検出手段)
70 Y軸位置検出手段(位置検出手段)
71 スケール部
72 読み取り手段
73 目盛
74 基台部
75 スケール
80 Z軸位置検出手段(位置検出手段)
W 被加工物
Claims (3)
- 本体部と該本体部に対して移動する可動部と、該可動部の可動方向に沿って該本体部に配設され目盛を備えるスケール部と、該スケール部の目盛を読み取る読み取り手段と、を有する可動装置であって、
該スケール部は、
低膨張材料からなる基台部と、
該基台部に固定されて伸縮を抑制された金属又は樹脂で形成されたスケールと、
から構成されることを特徴とする可動装置。 - 該基台部は、低膨張ガラス、低膨張セラミックス又は低膨張合金からなることを特徴とする請求項1記載の可動装置。
- 被加工物を保持する保持面を有するチャックテーブルと、該チャックテーブルに保持された被加工物を加工する加工手段と、該チャックテーブルと該加工手段とを相対的に移動させる移動手段と、該チャックテーブルに対する該加工手段の位置を検出する位置検出手段と、を備える加工装置であって、
該チャックテーブルと加工手段は、請求項1記載の該可動部であり、
該位置検出手段は、請求項1記載の該スケール部と該読み取り手段を有することを特徴とする加工装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015047560A JP2016165785A (ja) | 2015-03-10 | 2015-03-10 | 可動装置および加工装置 |
TW105103309A TW201639020A (zh) | 2015-03-10 | 2016-02-02 | 可動裝置及加工裝置 |
CN201610113307.1A CN105965709A (zh) | 2015-03-10 | 2016-02-29 | 可动装置和加工装置 |
KR1020160026246A KR20160110136A (ko) | 2015-03-10 | 2016-03-04 | 가동 장치 및 가공 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015047560A JP2016165785A (ja) | 2015-03-10 | 2015-03-10 | 可動装置および加工装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2016165785A true JP2016165785A (ja) | 2016-09-15 |
Family
ID=56897506
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015047560A Pending JP2016165785A (ja) | 2015-03-10 | 2015-03-10 | 可動装置および加工装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2016165785A (ja) |
KR (1) | KR20160110136A (ja) |
CN (1) | CN105965709A (ja) |
TW (1) | TW201639020A (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108247361A (zh) * | 2018-03-22 | 2018-07-06 | 中山市溢丰达机械设备有限公司 | 型材口部形状测数加工设备 |
CN109029591B (zh) * | 2018-10-17 | 2024-02-09 | 辽宁工业大学 | 一种电动微耕机研发实验装置及方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04286915A (ja) * | 1991-03-15 | 1992-10-12 | Sony Corp | 磁気スケール |
JP2010029952A (ja) * | 2008-07-25 | 2010-02-12 | Disco Abrasive Syst Ltd | 切削加工装置 |
JP2010223767A (ja) * | 2009-03-24 | 2010-10-07 | Mitsutoyo Corp | リニアスケール |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06231101A (ja) * | 1993-01-29 | 1994-08-19 | Natl Aerospace Lab | 受信タイムアウト検出機構 |
CN101701786B (zh) * | 2009-10-28 | 2012-07-25 | 合肥工业大学 | 低热膨胀石英量棒、其标定方法及其应用 |
JP5730048B2 (ja) * | 2011-02-04 | 2015-06-03 | 株式会社ディスコ | 加工装置 |
-
2015
- 2015-03-10 JP JP2015047560A patent/JP2016165785A/ja active Pending
-
2016
- 2016-02-02 TW TW105103309A patent/TW201639020A/zh unknown
- 2016-02-29 CN CN201610113307.1A patent/CN105965709A/zh active Pending
- 2016-03-04 KR KR1020160026246A patent/KR20160110136A/ko not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04286915A (ja) * | 1991-03-15 | 1992-10-12 | Sony Corp | 磁気スケール |
JP2010029952A (ja) * | 2008-07-25 | 2010-02-12 | Disco Abrasive Syst Ltd | 切削加工装置 |
JP2010223767A (ja) * | 2009-03-24 | 2010-10-07 | Mitsutoyo Corp | リニアスケール |
Also Published As
Publication number | Publication date |
---|---|
TW201639020A (zh) | 2016-11-01 |
CN105965709A (zh) | 2016-09-28 |
KR20160110136A (ko) | 2016-09-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5730048B2 (ja) | 加工装置 | |
KR102228487B1 (ko) | 피가공물의 절삭 방법 | |
US9396976B2 (en) | Cutting apparatus | |
JP2017108089A (ja) | レーザ加工装置及びレーザ加工方法 | |
US20130115861A1 (en) | Processing method for wafer having chamfered portion along the outer circumference thereof | |
TWI738816B (zh) | 被加工物之切削方法 | |
TW200936340A (en) | Dicing device and dicing method | |
JP5762005B2 (ja) | 加工位置調製方法及び加工装置 | |
KR20210088417A (ko) | 가공 장치 | |
JP7336960B2 (ja) | 中心位置づけ方法 | |
JP2008036806A (ja) | 溝加工装置およびその加工位置補正方法 | |
JP2015142022A (ja) | 切削装置 | |
JP2016165785A (ja) | 可動装置および加工装置 | |
KR20120094845A (ko) | 반도체 디바이스의 제조 방법 및 레이저 가공 장치 | |
JP7145643B2 (ja) | 検査治具及び検査方法 | |
JP6955975B2 (ja) | ウェーハの加工方法 | |
JP6229883B2 (ja) | ダイシング装置及びその切削方法 | |
JP2011151117A (ja) | 加工装置 | |
JP2013086188A (ja) | 加工装置 | |
JP5991890B2 (ja) | ウエーハの加工方法 | |
JP6498073B2 (ja) | 切削ブレードの位置ずれ検出方法 | |
JP2016153154A (ja) | ウェーハの位置合わせ方法 | |
JP6457327B2 (ja) | セットアップ方法 | |
JP2018083237A (ja) | 移動ユニットの劣化判定方法 | |
US11217466B2 (en) | Wafer processing method and cutting apparatus |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180129 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20190222 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190402 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190531 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20191029 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20200616 |