KR20160110136A - 가동 장치 및 가공 장치 - Google Patents

가동 장치 및 가공 장치 Download PDF

Info

Publication number
KR20160110136A
KR20160110136A KR1020160026246A KR20160026246A KR20160110136A KR 20160110136 A KR20160110136 A KR 20160110136A KR 1020160026246 A KR1020160026246 A KR 1020160026246A KR 20160026246 A KR20160026246 A KR 20160026246A KR 20160110136 A KR20160110136 A KR 20160110136A
Authority
KR
South Korea
Prior art keywords
axis
scale
cutting
moving
chuck table
Prior art date
Application number
KR1020160026246A
Other languages
English (en)
Korean (ko)
Inventor
신타로 마츠오카
겐타로 데라시
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20160110136A publication Critical patent/KR20160110136A/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/799—Apparatus for disconnecting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020160026246A 2015-03-10 2016-03-04 가동 장치 및 가공 장치 KR20160110136A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2015-047560 2015-03-10
JP2015047560A JP2016165785A (ja) 2015-03-10 2015-03-10 可動装置および加工装置

Publications (1)

Publication Number Publication Date
KR20160110136A true KR20160110136A (ko) 2016-09-21

Family

ID=56897506

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160026246A KR20160110136A (ko) 2015-03-10 2016-03-04 가동 장치 및 가공 장치

Country Status (4)

Country Link
JP (1) JP2016165785A (ja)
KR (1) KR20160110136A (ja)
CN (1) CN105965709A (ja)
TW (1) TW201639020A (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108247361A (zh) * 2018-03-22 2018-07-06 中山市溢丰达机械设备有限公司 型材口部形状测数加工设备
CN109029591B (zh) * 2018-10-17 2024-02-09 辽宁工业大学 一种电动微耕机研发实验装置及方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010029952A (ja) 2008-07-25 2010-02-12 Disco Abrasive Syst Ltd 切削加工装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04286915A (ja) * 1991-03-15 1992-10-12 Sony Corp 磁気スケール
JPH06231101A (ja) * 1993-01-29 1994-08-19 Natl Aerospace Lab 受信タイムアウト検出機構
JP5162800B2 (ja) * 2009-03-24 2013-03-13 株式会社ミツトヨ リニアスケール
CN101701786B (zh) * 2009-10-28 2012-07-25 合肥工业大学 低热膨胀石英量棒、其标定方法及其应用
JP5730048B2 (ja) * 2011-02-04 2015-06-03 株式会社ディスコ 加工装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010029952A (ja) 2008-07-25 2010-02-12 Disco Abrasive Syst Ltd 切削加工装置

Also Published As

Publication number Publication date
CN105965709A (zh) 2016-09-28
JP2016165785A (ja) 2016-09-15
TW201639020A (zh) 2016-11-01

Similar Documents

Publication Publication Date Title
JP5730048B2 (ja) 加工装置
KR102154719B1 (ko) 판형물의 가공 방법
US9396976B2 (en) Cutting apparatus
KR102228487B1 (ko) 피가공물의 절삭 방법
TWI738816B (zh) 被加工物之切削方法
US20190109023A1 (en) Apparatus for dividing workpiece
KR102008532B1 (ko) 가공 장치
TW201711788A (zh) 被加工物的支持治具
JP5762005B2 (ja) 加工位置調製方法及び加工装置
KR101786123B1 (ko) 반도체 디바이스의 제조 방법 및 레이저 가공 장치
KR20160110136A (ko) 가동 장치 및 가공 장치
JP4554265B2 (ja) 切削ブレードの位置ずれ検出方法
JP2016153154A (ja) ウェーハの位置合わせ方法
JP2011151117A (ja) 加工装置
JP6486785B2 (ja) 端面修正治具および端面修正方法
JP6579930B2 (ja) 加工装置
JP2017038028A (ja) 切削ブレードの位置ずれ検出方法
JP6653562B2 (ja) 加工装置
JP2011181623A (ja) 板状物の加工方法
JP5372429B2 (ja) 板状物の分割方法
JP2018032825A (ja) 被加工物のアライメント方法
JP2017157748A (ja) 切削装置
JP6486230B2 (ja) アライメント方法
US11534862B2 (en) Laser processing apparatus
JP5657935B2 (ja) 切削装置

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application