JP5701319B2 - ヒドリドシランをオリゴマー化する方法、該方法により製造可能なオリゴマー及びその使用 - Google Patents
ヒドリドシランをオリゴマー化する方法、該方法により製造可能なオリゴマー及びその使用 Download PDFInfo
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- JP5701319B2 JP5701319B2 JP2012554288A JP2012554288A JP5701319B2 JP 5701319 B2 JP5701319 B2 JP 5701319B2 JP 2012554288 A JP2012554288 A JP 2012554288A JP 2012554288 A JP2012554288 A JP 2012554288A JP 5701319 B2 JP5701319 B2 JP 5701319B2
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- hydridosilane
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- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 title claims description 91
- 238000000034 method Methods 0.000 title claims description 55
- 230000003606 oligomerizing effect Effects 0.000 title claims description 7
- 239000000203 mixture Substances 0.000 claims description 60
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 26
- 238000006243 chemical reaction Methods 0.000 claims description 18
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 claims description 17
- 239000003054 catalyst Substances 0.000 claims description 16
- 125000004122 cyclic group Chemical group 0.000 claims description 14
- 230000015572 biosynthetic process Effects 0.000 claims description 12
- -1 hydride silane Chemical compound 0.000 claims description 10
- 239000002904 solvent Substances 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 9
- 229910052731 fluorine Inorganic materials 0.000 claims description 8
- 229910000077 silane Inorganic materials 0.000 claims description 8
- 125000002015 acyclic group Chemical group 0.000 claims description 7
- 125000000217 alkyl group Chemical group 0.000 claims description 6
- 125000002619 bicyclic group Chemical group 0.000 claims description 6
- 229910052794 bromium Inorganic materials 0.000 claims description 6
- 229910052801 chlorine Inorganic materials 0.000 claims description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 5
- 239000007791 liquid phase Substances 0.000 claims description 5
- 150000001412 amines Chemical class 0.000 claims description 3
- 229910052736 halogen Inorganic materials 0.000 claims description 3
- 125000001072 heteroaryl group Chemical group 0.000 claims description 3
- 150000001408 amides Chemical class 0.000 claims description 2
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- 150000002825 nitriles Chemical class 0.000 claims description 2
- 150000003462 sulfoxides Chemical class 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims 1
- 150000002367 halogens Chemical class 0.000 claims 1
- 229920006395 saturated elastomer Polymers 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 14
- 239000010703 silicon Substances 0.000 description 14
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 239000000654 additive Substances 0.000 description 9
- 239000011541 reaction mixture Substances 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- 150000004756 silanes Chemical class 0.000 description 6
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- CVLHDNLPWKYNNR-UHFFFAOYSA-N pentasilolane Chemical compound [SiH2]1[SiH2][SiH2][SiH2][SiH2]1 CVLHDNLPWKYNNR-UHFFFAOYSA-N 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- VEDJZFSRVVQBIL-UHFFFAOYSA-N trisilane Chemical compound [SiH3][SiH2][SiH3] VEDJZFSRVVQBIL-UHFFFAOYSA-N 0.000 description 5
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 4
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 4
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- PQNFLJBBNBOBRQ-UHFFFAOYSA-N indane Chemical compound C1=CC=C2CCCC2=C1 PQNFLJBBNBOBRQ-UHFFFAOYSA-N 0.000 description 4
- IVSZLXZYQVIEFR-UHFFFAOYSA-N m-xylene Chemical group CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 4
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 4
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 3
- WJTCGQSWYFHTAC-UHFFFAOYSA-N cyclooctane Chemical compound C1CCCCCCC1 WJTCGQSWYFHTAC-UHFFFAOYSA-N 0.000 description 3
- 239000004914 cyclooctane Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 238000006384 oligomerization reaction Methods 0.000 description 3
- 230000005693 optoelectronics Effects 0.000 description 3
- DOBUHXUCKMAKSP-UHFFFAOYSA-N pentasilolanylsilane Chemical compound [SiH3][SiH]1[SiH2][SiH2][SiH2][SiH2]1 DOBUHXUCKMAKSP-UHFFFAOYSA-N 0.000 description 3
- 125000003367 polycyclic group Chemical group 0.000 description 3
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical group ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 101100297421 Homarus americanus phc-2 gene Proteins 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 150000001923 cyclic compounds Chemical class 0.000 description 2
- LMGZGXSXHCMSAA-UHFFFAOYSA-N cyclodecane Chemical compound C1CCCCCCCCC1 LMGZGXSXHCMSAA-UHFFFAOYSA-N 0.000 description 2
- NNBZCPXTIHJBJL-UHFFFAOYSA-N decalin Chemical compound C1CCCC2CCCCC21 NNBZCPXTIHJBJL-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052747 lanthanoid Inorganic materials 0.000 description 2
- 150000002602 lanthanoids Chemical class 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 2
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052752 metalloid Inorganic materials 0.000 description 2
- 150000002738 metalloids Chemical class 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- CNJRPYFBORAQAU-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxyethoxy)ethane Chemical compound CCOCCOCCOC CNJRPYFBORAQAU-UHFFFAOYSA-N 0.000 description 1
- CAQYAZNFWDDMIT-UHFFFAOYSA-N 1-ethoxy-2-methoxyethane Chemical compound CCOCCOC CAQYAZNFWDDMIT-UHFFFAOYSA-N 0.000 description 1
- DPMZXMBOYHBELT-UHFFFAOYSA-N CN1CN(C)CN(C)C1 Chemical compound CN1CN(C)CN(C)C1 DPMZXMBOYHBELT-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 1
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical compound C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- ZSIQJIWKELUFRJ-UHFFFAOYSA-N azepane Chemical compound C1CCCNCC1 ZSIQJIWKELUFRJ-UHFFFAOYSA-N 0.000 description 1
- LUXIMSHPDKSEDK-UHFFFAOYSA-N bis(disilanyl)silane Chemical compound [SiH3][SiH2][SiH2][SiH2][SiH3] LUXIMSHPDKSEDK-UHFFFAOYSA-N 0.000 description 1
- 150000001639 boron compounds Chemical class 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000004759 cyclic silanes Chemical class 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000004817 gas chromatography Methods 0.000 description 1
- 239000011491 glass wool Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 125000005429 oxyalkyl group Chemical group 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000548 poly(silane) polymer Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 125000002943 quinolinyl group Chemical group N1=C(C=CC2=CC=CC=C12)* 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- CXWXQJXEFPUFDZ-UHFFFAOYSA-N tetralin Chemical compound C1=CC=C2CCCCC2=C1 CXWXQJXEFPUFDZ-UHFFFAOYSA-N 0.000 description 1
- OBSZRRSYVTXPNB-UHFFFAOYSA-N tetraphosphorus Chemical compound P12P3P1P32 OBSZRRSYVTXPNB-UHFFFAOYSA-N 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 150000003623 transition metal compounds Chemical class 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/60—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which all the silicon atoms are connected by linkages other than oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/21—Cyclic compounds having at least one ring containing silicon, but no carbon in the ring
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/16—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02422—Non-crystalline insulating materials, e.g. glass, polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02623—Liquid deposition
- H01L21/02628—Liquid deposition using solutions
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Silicon Compounds (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Description
a)i) 一般式SinX2n+2(n≧3及びX=F、Cl、Br及び/若しくはI)の少なくとも1種のハロゲンシランと
ii) 一般式NRR'aR''bYc(a=0若しくは1、b=0若しくは1、及びc=0若しくは1、及び
aa) − R、R'及び/若しくはR''は、−C1〜C12−アルキル、−C1〜C12−アリール、−C1〜C12−アラルキル、−C1〜C12−アミノアルキル、−C1〜C12−アミノアリール、−C1〜C12−アミノアラルキル、殊に有利には−Ph、PhCH3、PhC2H5、−PhC3H7、−CH2(C6H4)CH3、−CH2(C6H4)C2H5、−C2H4(C6H4)C2H5、−C2H4(C6H4)C3H7、−C3H6(C6H4)C3H7、−C6H2(CH3)3、−C6H3(CH3)2、−C8H7、−C8H6CH3、−PhNR'''R''''、−PhCH2NR'''R''''、−PhC2H4NR'''R''''、−PhC3H6NR'''R''''、−CH2(C6H4)CH2NR'''R''''、−CH2(C6H4)C2H4NR'''R''''、−C2H4(C6H4)C2H4NR'''R''''、−C2H4(C6H4)C3H6NR'''R''''、−C3H6(C6H4)C3H6NR'''R''''、−CH2NR'''R''''、−C2H4NR'''R''''、−C3H6NR'''R''''、−C4H8NR'''R''''、−C5H10NR'''R''''、−C6H12NR'''R''''、−C7H14NR'''R''''、−C8H16NR'''R''''、−C9H18NR'''R''''及び/若しくは−C10H20NR'''R''''(R'''及びR''''=−C1〜C10−アルキル、−C1〜C10−アリール及び/若しくは−C1〜C10−アラルキル)であり、
及び/又は
− 2つ若しくは3つの基R、R'及びR''は、c=0の場合に一緒になって、N含有の環式若しくは二環式のヘテロ脂肪族若しくはヘテロ芳香族の系を形成し、殊に、その際、有利には、環式若しくは二環式のヘテロ脂肪族若しくはヘテロ芳香族の系は、ピロリジン−、ピロール−、ピペリジン−、ピリジン−、ヘキサメチレンイミン−、アザトロピリデン−若しくはキノリン環系であり、
− ただし、少なくとも1つの基R、R'若しくはR''は−CH3ではなく、
及び/又は
bb) − R及びR'及び/若しくはR''(c=1の場合)は、−C1〜C12−アルキレン、−C1〜C12−アリーレン、−C1〜C12−アラルキレン、−C1〜C12−ヘテロアルキレン、−C1〜C12−ヘテロアリーレン、−C1〜C12−ヘテロアラルキレン及び/若しくは−N=、殊に有利には、−CH2−、−C2H4−、−C3H6−、−C4H8−、−C5H10−、−C6H12−、−C7H14−、−C8H16−、−C9H18−、−C10H20−、−Ph−、−PhCH2−、−PhC2H4−、−PhC3H6−、−CH2(C6H4)CH2−、−CH2(C6H4)C2H4−、−C2H4(C6H4)C2H4−、−C2H4(C6H4)C3H6−、−C3H6(C6H4)C3H6−、−C6H(CH3)3−、−C6H2(CH3)2−、−CH=、−CH=CH−、−N=、−N=CH−及び/若しくは−CH=N−であり、
又は
cc) − (a=b=c=0の場合)R=≡C−R'''(R'''=−C1〜C10−アルキル、−C1〜C10−アリール及び/若しくは−C1〜C10−アラルキル)である])の少なくとも1種の触媒とを、一般式SimX2m+2(m>n及びX=F、Cl、Br及び/若しくはI)及びSiX4(X=F、Cl、Br及び/若しくはI)の少なくとも1種のハロゲンシランを包含する混合物の形成下で反応させ、
並びに
b) 一般式SimX2m+2の少なくとも1種のハロゲンシランを、一般式SimH2m+2のヒドリドシランの形成下で水素化する。
ガラス容器中のネオペンタシラン0.5mLを、280℃で熱板上で加熱する。液体はすぐに沸騰し始め、そして約10分後には、シリコン製造にとって相応しくない黄色の固形分のみが残る。
ガラス容器中のネオペンタシラン0.5mLを、30℃で5時間、熱板上で加熱する。得られた混合物のGPC測定から突き止めた質量平均分子量は230g/モルである。
ガラス容器中のネオペンタシラン0.5mLを、150℃で5時間、熱板上で加熱する。得られたオリゴマー混合物のGPC測定から突き止めた質量平均分子量は3330g/モルである。
例3からのオリゴマー化されたH−シラン0.05mLとシクロオクタン0.25mL中のネオペンタシラン0.05mLより成る配合液を4滴、ガラス基材に滴下し、引き続き、6000rpmでスピンコーティングを行う。フィルムが得られ、これを続けて10分間、400℃にてSi膜に転換させる。得られたSi膜は、厚みが約62mmであり、かつ約3.3nmの粗度Rqと約3.9nmのうねりWtを有する。
Claims (12)
- ヒドリドシランをオリゴマー化する方法であって、
− ヒドリドシランとして実質的に少なくとも1種のシリコン原子最大20個を有する非環状ヒドリドシランを包含する組成物を、
− 触媒の不在下で
− 235℃より小さい温度で熱により反応させる、
ヒドリドシランをオリゴマー化する方法。 - 前記方法が液相法であることを特徴とする、請求項1記載の方法。
- 前記少なくとも1種のヒドリドシランを包含する前記組成物が、Mw≦500g/モルの質量平均分子量を有するヒドリドシラン混合物を包含する組成物であることを特徴とする、請求項1又は2記載の方法。
- 前記少なくとも1種のヒドリドシランを包含する前記組成物が、
i) 一般式SinX2n+2(n≧3及びX=F、Cl、Br及び/若しくはI)の少なくとも1種のハロゲンシランと
ii) 一般式NRR'aR''bYc(a=0若しくは1、b=0若しくは1、及びc=0若しくは1、及び
aa) − R、R'及び/若しくはR''は、−C1〜C12−アルキル、−C1〜C12−アリール、−C1〜C12−アラルキル、−C1〜C12−アミノアルキル、−C1〜C12−アミノアリール及び/若しくは−C1〜C12−アミノアラルキルであり、
及び/又は
− 2つ若しくは3つの基R、R'及びR''は、c=0の場合に一緒になって、N含有の環式若しくは二環式のヘテロ脂肪族若しくはヘテロ芳香族の系を形成し、
− ただし、少なくとも1つの基R、R'若しくはR''は−CH3ではなく、
及び/又は
bb) − R及びR'及び/若しくはR''(c=1の場合)は、−C1〜C12−アルキレン、−C1〜C12−アリーレン、−C1〜C12−アラルキレン、−C1〜C12−ヘテロアルキレン、−C1〜C12−ヘテロアリーレン、−C1〜C12−ヘテロアラルキレン及び/若しくは−N=であり、
又は
cc) − (a=b=c=0の場合)R=≡C−R'''(R'''=−C1〜C10−アルキル、−C1〜C10−アリール及び/若しくは−C1〜C10−アラルキル)である])の少なくとも1種の触媒とを、一般式SimX2m+2(m>n及びX=F、Cl、Br及び/若しくはI)及びSiX4(X=F、Cl、Br及び/若しくはI)の少なくとも1種のハロゲンシランを包含する混合物の形成下で反応させ、
並びに
一般式SimX2m+2の少なくとも1種のハロゲンシランを、一般式SimH2m+2のヒドリドシランの形成下で水素化する、ハロゲンシランからヒドリドシランを製造する方法により製造可能であることを特徴とする、請求項1から3までのいずれか1項記載の方法。 - 前記組成物が、ヒドリドシランとして実質的にネオペンタシランを包含することを特徴とする、請求項1から4までのいずれか1項記載の方法。
- 前記組成物が、直鎖状、分枝鎖状若しくは環状の飽和、不飽和若しくは芳香族の炭素原子1〜12個を有する炭化水素、アルコール、エーテル、カルボン酸、エステル、ニトリル、アミン、アミド、スルホキシド及び水から成る群から選択された少なくとも1種の溶媒を有することを特徴とする、請求項1から5までのいずれか1項記載の方法。
- 前記組成物が、少なくとも1種の溶媒を、前記組成物の全質量を基準として20〜80質量%の割合で有することを特徴とする、請求項1から6までのいずれか1項記載の方法。
- 前記組成物が、
− BHxR3-x(x=0〜3及びR=C1〜C10−アルキル基又は不飽和の環状の、場合によりエーテルで錯体化された若しくはアミンで錯体化されたC2〜C10−アルキル基)、
− Si5H9BR2(R=H、Ph又はC1〜C10−アルキル基)
− Si4H9BR2(R=H、Ph又はC1〜C10−アルキル基)
− 赤リン、
− 白リン(P4)、
− PHxR3-x(x=0〜3及びR=Ph、SiMe3 又はC1〜C10−アルキル基)、
− P7(SiR3)3(R=H、Ph又はC1〜C10−アルキル基)
− Si5H9PR2(R=H、Ph又はC1〜C10−アルキル基)並びに
− Si4H9PR2(R=H、Ph又はC1〜C10−アルキル基)
から成る群から選択された少なくとも1種のドーピング物質を有することを特徴とする、請求項1から7までのいずれか1項記載の方法。 - 前記組成物が、少なくとも1種のドーピング物質を、前記組成物の全質量を基準として0.01〜20質量%の割合で有することを特徴とする、請求項8記載の方法。
- − BHxR3-x(x=0〜3及びR=C1〜C10−アルキル基又は不飽和の環状の、場合によりエーテルで錯体化された若しくはアミンで錯体化されたC2〜C10−アルキル基)、
− Si5H9BR2(R=H、Ph又はC1〜C10−アルキル基)
− Si4H9BR2(R=H、Ph又はC1〜C10−アルキル基)
− 赤リン、
− 白リン(P4)、
− PHxR3-x(x=0〜3及びR=Ph、SiMe3 又はC1〜C10−アルキル基)、
− P7(SiR3)3(R=H、Ph又はC1〜C10−アルキル基)
− Si5H9PR2(R=H、Ph又はC1〜C10−アルキル基)並びに
− Si4H9PR2(R=H、Ph又はC1〜C10−アルキル基)
から成る群から選択された少なくとも1種のドーピング物質を、反応過程の間に又はその後に添加することを特徴とする、請求項1から7までのいずれか1項記載の方法。 - 前記方法を、70〜220℃の温度で実施することを特徴とする、請求項1から10までのいずれか1項記載の方法。
- 前記温度が90〜210℃であることを特徴とする、請求項11記載の方法。
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