JP5675161B2 - 外部電極用導電性ペースト、及びそれを用いて形成した外部電極を備えた積層セラミック電子部品 - Google Patents

外部電極用導電性ペースト、及びそれを用いて形成した外部電極を備えた積層セラミック電子部品 Download PDF

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Publication number
JP5675161B2
JP5675161B2 JP2010104884A JP2010104884A JP5675161B2 JP 5675161 B2 JP5675161 B2 JP 5675161B2 JP 2010104884 A JP2010104884 A JP 2010104884A JP 2010104884 A JP2010104884 A JP 2010104884A JP 5675161 B2 JP5675161 B2 JP 5675161B2
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Japan
Prior art keywords
conductor layer
external electrode
conductive paste
component
particles
Prior art date
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Active
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JP2010104884A
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English (en)
Japanese (ja)
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JP2011233452A (ja
JP2011233452A5 (OSRAM
Inventor
仙一 五十嵐
仙一 五十嵐
広龍 五十嵐
広龍 五十嵐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Namics Corp
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Namics Corp filed Critical Namics Corp
Priority to JP2010104884A priority Critical patent/JP5675161B2/ja
Priority to KR1020110040488A priority patent/KR101807876B1/ko
Publication of JP2011233452A publication Critical patent/JP2011233452A/ja
Publication of JP2011233452A5 publication Critical patent/JP2011233452A5/ja
Application granted granted Critical
Publication of JP5675161B2 publication Critical patent/JP5675161B2/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/10—Metal-oxide dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Structural Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Ceramic Capacitors (AREA)
  • Conductive Materials (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2010104884A 2010-04-30 2010-04-30 外部電極用導電性ペースト、及びそれを用いて形成した外部電極を備えた積層セラミック電子部品 Active JP5675161B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010104884A JP5675161B2 (ja) 2010-04-30 2010-04-30 外部電極用導電性ペースト、及びそれを用いて形成した外部電極を備えた積層セラミック電子部品
KR1020110040488A KR101807876B1 (ko) 2010-04-30 2011-04-29 외부 전극용 도전성 페이스트, 및 그것을 이용하여 형성한 외부 전극을 구비한 적층 세라믹 전자 부품

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010104884A JP5675161B2 (ja) 2010-04-30 2010-04-30 外部電極用導電性ペースト、及びそれを用いて形成した外部電極を備えた積層セラミック電子部品

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014260959A Division JP5877239B2 (ja) 2014-12-24 2014-12-24 外部電極用導電性ペースト、及びそれを用いて形成した外部電極を備えた積層セラミック電子部品

Publications (3)

Publication Number Publication Date
JP2011233452A JP2011233452A (ja) 2011-11-17
JP2011233452A5 JP2011233452A5 (OSRAM) 2013-05-02
JP5675161B2 true JP5675161B2 (ja) 2015-02-25

Family

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Family Applications (1)

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JP2010104884A Active JP5675161B2 (ja) 2010-04-30 2010-04-30 外部電極用導電性ペースト、及びそれを用いて形成した外部電極を備えた積層セラミック電子部品

Country Status (2)

Country Link
JP (1) JP5675161B2 (OSRAM)
KR (1) KR101807876B1 (OSRAM)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101719838B1 (ko) * 2012-09-06 2017-03-24 삼성전기주식회사 도전성 수지 조성물 및 이를 포함하는 적층 세라믹 전자 부품
KR101412822B1 (ko) * 2012-09-06 2014-06-27 삼성전기주식회사 외부전극용 전도성 페이스트, 이를 이용한 적층 세라믹 전자부품 및 이의 제조방법
KR20140090466A (ko) 2013-01-09 2014-07-17 삼성전기주식회사 도전성 수지 조성물, 이를 포함하는 적층 세라믹 커패시터 및 그 제조방법
KR101565639B1 (ko) * 2013-02-20 2015-11-03 삼성전기주식회사 적층 세라믹 전자부품
KR101462798B1 (ko) * 2013-07-16 2014-11-20 삼성전기주식회사 외부 전극용 도전성 페이스트 조성물 및 이를 포함하는 적층 세라믹 전자 부품
JP2016004659A (ja) 2014-06-16 2016-01-12 株式会社村田製作所 導電性樹脂ペーストおよびセラミック電子部品
KR101630050B1 (ko) * 2014-07-25 2016-06-13 삼성전기주식회사 적층 세라믹 전자부품
JP2017147163A (ja) * 2016-02-19 2017-08-24 三菱マテリアル株式会社 導電性ペースト及びこれを用いて形成された導電性膜
JP2018009112A (ja) * 2016-07-14 2018-01-18 タツタ電線株式会社 導電性塗料及びそれを用いたシールドパッケージの製造方法
JP6911754B2 (ja) * 2017-12-27 2021-07-28 Tdk株式会社 電子部品および積層セラミックコンデンサ
JP7528763B2 (ja) * 2020-12-11 2024-08-06 株式会社村田製作所 積層セラミック電子部品および樹脂電極用導電性ペースト
JPWO2024202136A1 (OSRAM) * 2023-03-28 2024-10-03

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2603053B2 (ja) * 1993-10-29 1997-04-23 松下電器産業株式会社 ビアホール充填用導体ペースト組成物並びにそれを用いた両面及び多層プリント基板とその製造方法
JPH11162771A (ja) * 1997-11-25 1999-06-18 Kyocera Corp 積層セラミックコンデンサ
JP4019254B2 (ja) * 2002-04-24 2007-12-12 信越化学工業株式会社 導電性樹脂組成物
JP4380145B2 (ja) * 2002-11-20 2009-12-09 株式会社村田製作所 導電ペースト及びセラミック電子部品の製造方法
JP2005293851A (ja) * 2004-03-10 2005-10-20 Toyobo Co Ltd 導電性ペースト

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Publication number Publication date
KR20110121572A (ko) 2011-11-07
KR101807876B1 (ko) 2017-12-11
JP2011233452A (ja) 2011-11-17

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