JP5669723B2 - レチクルローディングおよびアンローディング方法およびシステム - Google Patents

レチクルローディングおよびアンローディング方法およびシステム Download PDF

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Publication number
JP5669723B2
JP5669723B2 JP2011504368A JP2011504368A JP5669723B2 JP 5669723 B2 JP5669723 B2 JP 5669723B2 JP 2011504368 A JP2011504368 A JP 2011504368A JP 2011504368 A JP2011504368 A JP 2011504368A JP 5669723 B2 JP5669723 B2 JP 5669723B2
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JP
Japan
Prior art keywords
base plate
reticle
arm
red
supported
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2011504368A
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English (en)
Japanese (ja)
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JP2011517128A5 (https=
JP2011517128A (ja
Inventor
ランスバーゲン，ロバート，ガブリエル，マリア
ハロルド，ジョージ，ヒラリー
ジョンソン，リチャード，ジョン
デル ウェイデン，ヒューゴ，ヤコブス，ヘラルドゥス ファン
デル ウェイデン，ヒューゴ，ヤコブス，ヘラルドゥス ファン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Holding NV
ASML Netherlands BV
Original Assignee
ASML Holding NV
ASML Netherlands BV
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Publication of JP2011517128A5 publication Critical patent/JP2011517128A5/ja
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Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/57—Mask-wafer alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Library & Information Science (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2011504368A 2008-04-18 2009-04-14 レチクルローディングおよびアンローディング方法およびシステム Expired - Fee Related JP5669723B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US7126808P 2008-04-18 2008-04-18
US61/071,268 2008-04-18
PCT/EP2009/002719 WO2009127391A1 (en) 2008-04-18 2009-04-14 Rapid exchange device for lithography reticles

Publications (3)

Publication Number Publication Date
JP2011517128A JP2011517128A (ja) 2011-05-26
JP2011517128A5 JP2011517128A5 (https=) 2012-06-07
JP5669723B2 true JP5669723B2 (ja) 2015-02-12

Family

ID=40846172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011504368A Expired - Fee Related JP5669723B2 (ja) 2008-04-18 2009-04-14 レチクルローディングおよびアンローディング方法およびシステム

Country Status (7)

Country Link
US (2) US9268241B2 (https=)
JP (1) JP5669723B2 (https=)
KR (2) KR101738515B1 (https=)
CN (2) CN103713475B (https=)
NL (1) NL1036785A1 (https=)
TW (1) TWI488007B (https=)
WO (1) WO2009127391A1 (https=)

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US10598832B2 (en) * 2018-01-09 2020-03-24 Varian Semiconductor Equipment Associates, Inc. System and method for forming diffracted optical element having varied gratings
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Also Published As

Publication number Publication date
CN103713475B (zh) 2015-09-30
US9983487B2 (en) 2018-05-29
KR101738515B1 (ko) 2017-05-22
US20160077443A1 (en) 2016-03-17
NL1036785A1 (nl) 2009-10-20
KR20110004876A (ko) 2011-01-14
WO2009127391A1 (en) 2009-10-22
KR20160052804A (ko) 2016-05-12
CN102007455A (zh) 2011-04-06
TW201001090A (en) 2010-01-01
US9268241B2 (en) 2016-02-23
CN103713475A (zh) 2014-04-09
JP2011517128A (ja) 2011-05-26
CN102007455B (zh) 2014-02-12
TWI488007B (zh) 2015-06-11
US20110020104A1 (en) 2011-01-27

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