KR101738515B1 - 리소그래피 레티클용 급속 교환 디바이스 - Google Patents
리소그래피 레티클용 급속 교환 디바이스 Download PDFInfo
- Publication number
- KR101738515B1 KR101738515B1 KR1020167011398A KR20167011398A KR101738515B1 KR 101738515 B1 KR101738515 B1 KR 101738515B1 KR 1020167011398 A KR1020167011398 A KR 1020167011398A KR 20167011398 A KR20167011398 A KR 20167011398A KR 101738515 B1 KR101738515 B1 KR 101738515B1
- Authority
- KR
- South Korea
- Prior art keywords
- base plate
- reticle
- arm
- red
- loading
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask
-
- H01L21/0274—
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- H01L21/67742—
-
- H01L21/67778—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3302—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
- H10P72/57—Mask-wafer alignment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
- H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
- H10P76/2041—Photolithographic processes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Library & Information Science (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US7126808P | 2008-04-18 | 2008-04-18 | |
| US61/071,268 | 2008-04-18 | ||
| PCT/EP2009/002719 WO2009127391A1 (en) | 2008-04-18 | 2009-04-14 | Rapid exchange device for lithography reticles |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020107025812A Division KR20110004876A (ko) | 2008-04-18 | 2009-04-14 | 리소그래피 레티클용 급속 교환 디바이스 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20160052804A KR20160052804A (ko) | 2016-05-12 |
| KR101738515B1 true KR101738515B1 (ko) | 2017-05-22 |
Family
ID=40846172
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020167011398A Active KR101738515B1 (ko) | 2008-04-18 | 2009-04-14 | 리소그래피 레티클용 급속 교환 디바이스 |
| KR1020107025812A Ceased KR20110004876A (ko) | 2008-04-18 | 2009-04-14 | 리소그래피 레티클용 급속 교환 디바이스 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020107025812A Ceased KR20110004876A (ko) | 2008-04-18 | 2009-04-14 | 리소그래피 레티클용 급속 교환 디바이스 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US9268241B2 (https=) |
| JP (1) | JP5669723B2 (https=) |
| KR (2) | KR101738515B1 (https=) |
| CN (2) | CN103713475B (https=) |
| NL (1) | NL1036785A1 (https=) |
| TW (1) | TWI488007B (https=) |
| WO (1) | WO2009127391A1 (https=) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL1036785A1 (nl) | 2008-04-18 | 2009-10-20 | Asml Netherlands Bv | Rapid exchange device for lithography reticles. |
| JP5827827B2 (ja) | 2010-06-29 | 2015-12-02 | エーエスエムエル ネザーランズ ビー.ブイ. | アクチュエータ |
| WO2012123144A1 (en) | 2011-03-11 | 2012-09-20 | Asml Netherlands B.V. | Electrostatic clamp apparatus and lithographic apparatus |
| KR101633369B1 (ko) * | 2011-12-06 | 2016-07-08 | 고쿠리츠켄큐카이하츠호진 상교기쥬츠 소고켄큐쇼 | 옐로 룸 시스템 |
| CN105093836B (zh) * | 2014-05-06 | 2017-08-29 | 上海微电子装备(集团)股份有限公司 | Euv光刻装置及其曝光方法 |
| US10283456B2 (en) | 2015-10-26 | 2019-05-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Lithography engraving machine for forming water identification marks and aligment marks |
| JP7097872B2 (ja) | 2016-07-29 | 2022-07-08 | エーエスエムエル ホールディング エヌ.ブイ. | ステージ装置 |
| NL2020502A (en) * | 2017-03-30 | 2018-10-03 | Asml Netherlands Bv | Apparatus, substrate handler, patterning device handler, damping system and method of manufacturing |
| WO2019050507A1 (en) * | 2017-09-05 | 2019-03-14 | Applied Materials, Inc. | METHODS OF MANIPULATING A MASKING DEVICE, APPARATUS FOR EXCHANGING A MASKING DEVICE, MASK EXCHANGING CHAMBER, AND VACUUM SYSTEM |
| US10598832B2 (en) * | 2018-01-09 | 2020-03-24 | Varian Semiconductor Equipment Associates, Inc. | System and method for forming diffracted optical element having varied gratings |
| US10976674B2 (en) | 2018-08-17 | 2021-04-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for detecting EUV pellicle rupture |
| IL318821A (en) | 2018-12-28 | 2025-04-01 | Asml Holding Nv | Method and device for cleaning a support structure in a lithographic system |
| US11156926B2 (en) * | 2019-08-12 | 2021-10-26 | Kla Corporation | Vacuum actuator containment for molecular contaminant and particle mitigation |
| CN112255888A (zh) * | 2020-10-22 | 2021-01-22 | 无锡中微掩模电子有限公司 | 一种电子束曝光机的上下料方法 |
| CN115477138A (zh) * | 2022-09-16 | 2022-12-16 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | 掩模传输装置及掩模传输系统 |
| US20250258436A1 (en) * | 2024-02-09 | 2025-08-14 | Carl Zeiss Smt Gmbh | Euv collector for use in an euv projection exposure apparatus |
| CN119717408B (zh) * | 2024-12-31 | 2025-11-11 | 上海新毅东半导体科技有限公司 | 掩膜版传送装置及光刻机 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006351863A (ja) | 2005-06-16 | 2006-12-28 | Nikon Corp | 物体搬送装置及び露光装置 |
| JP2007141925A (ja) | 2005-11-15 | 2007-06-07 | Nikon Corp | マスク収容容器、露光装置 |
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| US3968885A (en) * | 1973-06-29 | 1976-07-13 | International Business Machines Corporation | Method and apparatus for handling workpieces |
| US4758127A (en) * | 1983-06-24 | 1988-07-19 | Canon Kabushiki Kaisha | Original feeding apparatus and a cassette for containing the original |
| US4984953A (en) * | 1987-02-20 | 1991-01-15 | Canon Kabushiki Kaisha | Plate-like article conveying system |
| JPS63258341A (ja) * | 1987-04-17 | 1988-10-25 | Hitachi Ltd | レテイクル自動交換装置 |
| US5080549A (en) * | 1987-05-11 | 1992-01-14 | Epsilon Technology, Inc. | Wafer handling system with Bernoulli pick-up |
| US5135349A (en) * | 1990-05-17 | 1992-08-04 | Cybeq Systems, Inc. | Robotic handling system |
| US6473157B2 (en) * | 1992-02-07 | 2002-10-29 | Nikon Corporation | Method of manufacturing exposure apparatus and method for exposing a pattern on a mask onto a substrate |
| US6712577B2 (en) * | 1994-04-28 | 2004-03-30 | Semitool, Inc. | Automated semiconductor processing system |
| JPH098103A (ja) * | 1995-06-19 | 1997-01-10 | Nikon Corp | 投影露光装置及び投影露光方法 |
| DE19549045C1 (de) | 1995-12-28 | 1997-06-05 | Jenoptik Jena Gmbh | Einrichtung zur Handhabung von scheibenförmigen Objekten |
| JPH09186072A (ja) * | 1996-01-04 | 1997-07-15 | Canon Inc | 原板搬送装置および方法 |
| US6054029A (en) | 1996-02-23 | 2000-04-25 | Singulus Technologies Gmbh | Device for gripping, holdings and/or transporting substrates |
| JP3022488B2 (ja) | 1997-06-04 | 2000-03-21 | 社団法人高等技術研究院研究組合 | 抵抗スポット溶接品質制御装置 |
| US6589789B1 (en) * | 1997-07-21 | 2003-07-08 | Quest Diagnostics Incorporated | Automated centrifuge loading device |
| US6158951A (en) * | 1998-07-10 | 2000-12-12 | Asm America, Inc. | Wafer carrier and method for handling of wafers with minimal contact |
| JP3863671B2 (ja) * | 1998-07-25 | 2006-12-27 | 株式会社ダイヘン | 搬送用ロボット装置 |
| TW446858B (en) | 1999-04-21 | 2001-07-21 | Asm Lithography Bv | Lithographic projection apparatus, method of manufacturing a device using such a lithographic projection apparatus, and device made by such a method of manufacturing |
| JP2001024045A (ja) * | 1999-07-08 | 2001-01-26 | Nikon Corp | 搬送装置およびそれを用いた露光装置 |
| US6379095B1 (en) | 2000-04-14 | 2002-04-30 | Applied Materials, Inc. | Robot for handling semiconductor wafers |
| TW559855B (en) * | 2000-09-06 | 2003-11-01 | Olympus Optical Co | Wafer transfer apparatus |
| TW512478B (en) * | 2000-09-14 | 2002-12-01 | Olympus Optical Co | Alignment apparatus |
| EP1211562B1 (en) * | 2000-11-30 | 2005-05-11 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP4201564B2 (ja) * | 2001-12-03 | 2008-12-24 | 日東電工株式会社 | 半導体ウエハ搬送方法およびこれを用いた半導体ウエハ搬送装置 |
| US7004715B2 (en) * | 2002-01-09 | 2006-02-28 | Asml Holding N.V. | Apparatus for transferring and loading a reticle with a robotic reticle end-effector |
| US6906783B2 (en) | 2002-02-22 | 2005-06-14 | Asml Holding N.V. | System for using a two part cover for protecting a reticle |
| US7053393B2 (en) * | 2002-06-04 | 2006-05-30 | Olympus Corporation | Alignment apparatus for object on stage |
| US6826451B2 (en) | 2002-07-29 | 2004-11-30 | Asml Holding N.V. | Lithography tool having a vacuum reticle library coupled to a vacuum chamber |
| JP2004158643A (ja) | 2002-11-06 | 2004-06-03 | Nikon Corp | 露光方法及び露光装置 |
| JP4450664B2 (ja) * | 2003-06-02 | 2010-04-14 | 東京エレクトロン株式会社 | 基板処理装置及び基板搬送方法 |
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| JP4564742B2 (ja) | 2003-12-03 | 2010-10-20 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
| US7078708B2 (en) * | 2003-12-24 | 2006-07-18 | Asml Netherlands B.V. | Lithographic apparatus and method of manufacturing a device and method of performing maintenance |
| JP2005353988A (ja) | 2004-06-14 | 2005-12-22 | Canon Inc | 板状体搬送方法、搬送装置及び露光装置 |
| ATE388787T1 (de) * | 2004-07-15 | 2008-03-15 | Hermle Berthold Maschf Ag | Bearbeitungsmaschine mit werkstückwechsler |
| US7167233B2 (en) | 2004-09-20 | 2007-01-23 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and apparatus for processing an exchangeable object |
| US7394525B2 (en) * | 2004-10-21 | 2008-07-01 | Asml Netherlands B.V. | Exchangeable object handling apparatus, lithographic apparatus including such exchangeable object handling apparatus, and device manufacturing method |
| US7477358B2 (en) | 2004-09-28 | 2009-01-13 | Nikon Corporation | EUV reticle handling system and method |
| JP2006128188A (ja) | 2004-10-26 | 2006-05-18 | Nikon Corp | 基板搬送装置、基板搬送方法および露光装置 |
| CN101006554A (zh) * | 2004-10-29 | 2007-07-25 | 株式会社尼康 | 标线保护构件、标线运送装置、曝光装置及标线运送方法 |
| JP4710308B2 (ja) | 2004-10-29 | 2011-06-29 | 株式会社ニコン | レチクル搬送装置、露光装置、及びレチクルの搬送方法 |
| US7428958B2 (en) | 2004-11-15 | 2008-09-30 | Nikon Corporation | Substrate conveyor apparatus, substrate conveyance method and exposure apparatus |
| US7136147B2 (en) * | 2004-12-20 | 2006-11-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US20060138681A1 (en) * | 2004-12-27 | 2006-06-29 | Asml Netherlands B.V. | Substrate and lithography process using the same |
| CN1942288B (zh) * | 2005-02-12 | 2010-12-22 | 应用材料公司 | 一种多轴真空电机组件 |
| JP4667140B2 (ja) | 2005-06-30 | 2011-04-06 | キヤノン株式会社 | 露光装置およびデバイス製造方法 |
| JP2007134575A (ja) | 2005-11-11 | 2007-05-31 | Canon Inc | レチクルカセットおよびそれを用いた露光装置 |
| US7808616B2 (en) | 2005-12-28 | 2010-10-05 | Nikon Corporation | Reticle transport apparatus, exposure apparatus, reticle transport method, and reticle processing method |
| JP4848845B2 (ja) * | 2006-06-01 | 2011-12-28 | 株式会社安川電機 | 真空ロボット、処理装置、モータの製造方法、およびモータ |
| US20080025821A1 (en) | 2006-07-25 | 2008-01-31 | Applied Materials, Inc. | Octagon transfer chamber |
| KR100847888B1 (ko) * | 2006-12-12 | 2008-07-23 | 세메스 주식회사 | 반도체 소자 제조 장치 |
| NL1036785A1 (nl) | 2008-04-18 | 2009-10-20 | Asml Netherlands Bv | Rapid exchange device for lithography reticles. |
-
2009
- 2009-03-30 NL NL1036785A patent/NL1036785A1/nl not_active Application Discontinuation
- 2009-04-13 TW TW098112204A patent/TWI488007B/zh active
- 2009-04-14 WO PCT/EP2009/002719 patent/WO2009127391A1/en not_active Ceased
- 2009-04-14 JP JP2011504368A patent/JP5669723B2/ja not_active Expired - Fee Related
- 2009-04-14 US US12/921,555 patent/US9268241B2/en not_active Expired - Fee Related
- 2009-04-14 KR KR1020167011398A patent/KR101738515B1/ko active Active
- 2009-04-14 CN CN201410009171.0A patent/CN103713475B/zh active Active
- 2009-04-14 KR KR1020107025812A patent/KR20110004876A/ko not_active Ceased
- 2009-04-14 CN CN200980113525.3A patent/CN102007455B/zh active Active
-
2015
- 2015-11-20 US US14/947,628 patent/US9983487B2/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006351863A (ja) | 2005-06-16 | 2006-12-28 | Nikon Corp | 物体搬送装置及び露光装置 |
| JP2007141925A (ja) | 2005-11-15 | 2007-06-07 | Nikon Corp | マスク収容容器、露光装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103713475B (zh) | 2015-09-30 |
| US9983487B2 (en) | 2018-05-29 |
| US20160077443A1 (en) | 2016-03-17 |
| NL1036785A1 (nl) | 2009-10-20 |
| KR20110004876A (ko) | 2011-01-14 |
| WO2009127391A1 (en) | 2009-10-22 |
| KR20160052804A (ko) | 2016-05-12 |
| CN102007455A (zh) | 2011-04-06 |
| TW201001090A (en) | 2010-01-01 |
| US9268241B2 (en) | 2016-02-23 |
| JP5669723B2 (ja) | 2015-02-12 |
| CN103713475A (zh) | 2014-04-09 |
| JP2011517128A (ja) | 2011-05-26 |
| CN102007455B (zh) | 2014-02-12 |
| TWI488007B (zh) | 2015-06-11 |
| US20110020104A1 (en) | 2011-01-27 |
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