TWI488007B - 交換光罩之系統及方法 - Google Patents

交換光罩之系統及方法 Download PDF

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Publication number
TWI488007B
TWI488007B TW098112204A TW98112204A TWI488007B TW I488007 B TWI488007 B TW I488007B TW 098112204 A TW098112204 A TW 098112204A TW 98112204 A TW98112204 A TW 98112204A TW I488007 B TWI488007 B TW I488007B
Authority
TW
Taiwan
Prior art keywords
reticle
bottom plate
loading
arm
red
Prior art date
Application number
TW098112204A
Other languages
English (en)
Chinese (zh)
Other versions
TW201001090A (en
Inventor
羅博特 嘉博爾 瑪利亞 蘭博根
喬治 希拉蕊 哈洛
理查 約翰 強森
德 維登 雨果 傑卡布斯 葛瑞德司 凡
Original Assignee
Ａｓｍｌ荷蘭公司
Asml控股公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ａｓｍｌ荷蘭公司, Asml控股公司 filed Critical Ａｓｍｌ荷蘭公司
Publication of TW201001090A publication Critical patent/TW201001090A/zh
Application granted granted Critical
Publication of TWI488007B publication Critical patent/TWI488007B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/57—Mask-wafer alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Library & Information Science (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW098112204A 2008-04-18 2009-04-13 交換光罩之系統及方法 TWI488007B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7126808P 2008-04-18 2008-04-18

Publications (2)

Publication Number Publication Date
TW201001090A TW201001090A (en) 2010-01-01
TWI488007B true TWI488007B (zh) 2015-06-11

Family

ID=40846172

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098112204A TWI488007B (zh) 2008-04-18 2009-04-13 交換光罩之系統及方法

Country Status (7)

Country Link
US (2) US9268241B2 (https=)
JP (1) JP5669723B2 (https=)
KR (2) KR101738515B1 (https=)
CN (2) CN103713475B (https=)
NL (1) NL1036785A1 (https=)
TW (1) TWI488007B (https=)
WO (1) WO2009127391A1 (https=)

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NL1036785A1 (nl) 2008-04-18 2009-10-20 Asml Netherlands Bv Rapid exchange device for lithography reticles.
JP5827827B2 (ja) 2010-06-29 2015-12-02 エーエスエムエル ネザーランズ ビー．ブイ． アクチュエータ
WO2012123144A1 (en) 2011-03-11 2012-09-20 Asml Netherlands B.V. Electrostatic clamp apparatus and lithographic apparatus
KR101633369B1 (ko) * 2011-12-06 2016-07-08 고쿠리츠켄큐카이하츠호진 상교기쥬츠 소고켄큐쇼 옐로 룸 시스템
CN105093836B (zh) * 2014-05-06 2017-08-29 上海微电子装备（集团）股份有限公司 Euv光刻装置及其曝光方法
US10283456B2 (en) 2015-10-26 2019-05-07 Taiwan Semiconductor Manufacturing Co., Ltd. Lithography engraving machine for forming water identification marks and aligment marks
JP7097872B2 (ja) 2016-07-29 2022-07-08 エーエスエムエル ホールディング エヌ．ブイ． ステージ装置
NL2020502A (en) * 2017-03-30 2018-10-03 Asml Netherlands Bv Apparatus, substrate handler, patterning device handler, damping system and method of manufacturing
WO2019050507A1 (en) * 2017-09-05 2019-03-14 Applied Materials, Inc. METHODS OF MANIPULATING A MASKING DEVICE, APPARATUS FOR EXCHANGING A MASKING DEVICE, MASK EXCHANGING CHAMBER, AND VACUUM SYSTEM
US10598832B2 (en) * 2018-01-09 2020-03-24 Varian Semiconductor Equipment Associates, Inc. System and method for forming diffracted optical element having varied gratings
US10976674B2 (en) 2018-08-17 2021-04-13 Taiwan Semiconductor Manufacturing Co., Ltd. Method for detecting EUV pellicle rupture
IL318821A (en) 2018-12-28 2025-04-01 Asml Holding Nv Method and device for cleaning a support structure in a lithographic system
US11156926B2 (en) * 2019-08-12 2021-10-26 Kla Corporation Vacuum actuator containment for molecular contaminant and particle mitigation
CN112255888A (zh) * 2020-10-22 2021-01-22 无锡中微掩模电子有限公司 一种电子束曝光机的上下料方法
CN115477138A (zh) * 2022-09-16 2022-12-16 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 掩模传输装置及掩模传输系统
US20250258436A1 (en) * 2024-02-09 2025-08-14 Carl Zeiss Smt Gmbh Euv collector for use in an euv projection exposure apparatus
CN119717408B (zh) * 2024-12-31 2025-11-11 上海新毅东半导体科技有限公司 掩膜版传送装置及光刻机

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TW490368B (en) * 2000-04-14 2002-06-11 Applied Materials Inc Improved robot for handling semiconductor wafers
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Also Published As

Publication number Publication date
CN103713475B (zh) 2015-09-30
US9983487B2 (en) 2018-05-29
KR101738515B1 (ko) 2017-05-22
US20160077443A1 (en) 2016-03-17
NL1036785A1 (nl) 2009-10-20
KR20110004876A (ko) 2011-01-14
WO2009127391A1 (en) 2009-10-22
KR20160052804A (ko) 2016-05-12
CN102007455A (zh) 2011-04-06
TW201001090A (en) 2010-01-01
US9268241B2 (en) 2016-02-23
JP5669723B2 (ja) 2015-02-12
CN103713475A (zh) 2014-04-09
JP2011517128A (ja) 2011-05-26
CN102007455B (zh) 2014-02-12
US20110020104A1 (en) 2011-01-27

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