JP5649957B2 - メタライジングされている表面を有するセラミックボディを備えた構成部材 - Google Patents
メタライジングされている表面を有するセラミックボディを備えた構成部材 Download PDFInfo
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- JP5649957B2 JP5649957B2 JP2010504630A JP2010504630A JP5649957B2 JP 5649957 B2 JP5649957 B2 JP 5649957B2 JP 2010504630 A JP2010504630 A JP 2010504630A JP 2010504630 A JP2010504630 A JP 2010504630A JP 5649957 B2 JP5649957 B2 JP 5649957B2
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/12—All metal or with adjacent metals
- Y10T428/12479—Porous [e.g., foamed, spongy, cracked, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12611—Oxide-containing component
- Y10T428/12618—Plural oxides
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description
Claims (16)
- セラミックボディ(2)を備えた構成部材(1)であって、該セラミックボディ(2)はメタライジング部(5,6;11)によってセラミックボディ(2)の表面(3,4)の少なくとも1つの領域においてカバーされている、セラミックボディを備えた構成部材において、
同種又は種々異なる材料から成るメタライジング部(5,6)の少なくとも2つの層の間、及びメタライジング部の層(5;11)とセラミックスとの間の部分放電耐性は20pCより小さく、
セラミックボディ(2)は、上面と下面と側面とを有し、上面と下面とが、それぞれ異なる大きさの表面を有しているように構成して、立体的に構造化され(7)、メタライジング部(5,6)が、セラミックボディ(2)の、上面と、下面および側面の少なくとも一方の表面とに設けられることを特徴とする、セラミックボディを備えた構成部材。 - メタライジング部(5,6;11)として、有利にはコーティング又はシート又は金属薄板の形式の金属が、セラミックボディ(2)に全面的に又は部分的に素材結合式に結合されているか、又は機械的な形状結合により結合されていて、前記金属はキャリアボディと同じ又はキャリアボディとは異なる熱伝導率を有していることを特徴とする、請求項1記載の構成部材。
- メタライジング部(5,6;11)は、純粋な品質又は工業用の品質におけるタングステン、銀、金、銅、白金、パラジウム、ニッケル、アルミニウム又は鋼から成っているか、又は、少なくとも2つの種々異なる金属の混合物、及び/又は付加的に又は単独で、反応はんだ、軟質はんだ又は硬質はんだ(9;13)から成っていることを特徴とする、請求項1または2記載の構成部材。
- セラミックボディ(2)におけるメタライジング部(5,6;11)は、少なくとも1つの層から成っており、かつ、DCB方法(銅ダイレクトボンディング法)の使用のもと、又はAMB方法(活性金属はんだ付け法)の使用のもと、又はスクリーン印刷方法の使用のもと、又は電解式の方法の使用のもと、又は化学的な析出法の使用のもと、又は蒸着方法の使用のもと、又は接着又は付着を介して、又は前記方法の組合せを介して、相対している及び/又は隣接している面において前記ボディの表面に被着されていることを特徴とする、請求項1から3までのいずれか一項記載の構成部材。
- メタライジング部(5,6;11)は金属体としてセラミックボディ(2)の表面を、部分的に又は全面的にカバーするか、又は、
平行平面の形式において、部分的に又は完全にカバーするか、又は、
幾何学的に任意に成形されてカバーするか、又は、
前記形式の組合せにおいてカバーすることを特徴とする、請求項1から4までのいずれか一項記載の構成部材。 - セラミックボディ(2)における少なくとも1つのメタライジング部(5)に、少なくとも1つの別のメタライジング部(6)が被着されていて、該別のメタライジング部(6)はメタライジング部(5)の表面を部分的に又は全面的にカバーしていることを特徴とする、請求項1から5までのいずれか一項記載の構成部材。
- セラミックボディ(2)における1つ又は複数のメタライジング部(11)は、銅のみから成っており、セラミックボディ(2)との結合は、引き続きの熱的な処理を備えたスクリーン印刷方法によって、又はDCB方法によって行われることを特徴とする、請求項1から6までのいずれか一項記載の構成部材。
- セラミックボディ(2)における1つ又は複数のメタライジング部は、アルミニウムのみから成っていて、セラミックボディ(2)との結合は、引き続きの熱的な処理を備えたスクリーン印刷方法によって、又はAMBプロセスによって行われることを特徴とする、請求項1から6までのいずれか一項記載の構成部材。
- 少なくとも1つのメタライジング部及び/又は別のメタライジング部(5,6;11)のセラミックボディ(2)への結合は、90%より大きいことを特徴とする、請求項1から8までのいずれか一項記載の構成部材。
- 少なくとも1つのメタライジング部(5,6;11)は、少なくとも12N/cmの付着耐性でセラミックボディ(2)に結合されていることを特徴とする、請求項1から9までのいずれか一項記載の構成部材。
- メタライジング部(5,6;11)の層の厚さは2mm以下であることを特徴とする、請求項1から10までのいずれか一項記載の構成部材。
- セラミックボディ(2)の少なくとも1つの表面又はメタライジング部に、別の層(11)又は構成部材の付着仲介をするために、介在層(12)が被着されていることを特徴とする、請求項1から11までのいずれか一項記載の構成部材。
- 介在層(12)の厚さは20μm以下であることを特徴とする、請求項12記載の構成部材。
- 介在層(12)はAl2O3から成っていることを特徴とする、請求項12又は13記載の構成部材。
- セラミック材料は、主成分として50.1〜100重量%のZrO2/HfO2、又は50.1〜100重量%のAl2O3、又は50.1〜100重量%のAlN、又は50.1〜100重量%のSi3N4、又は50.1〜100重量%のBeO、又は50.1〜100重量%のSiC、又は前記割合範囲内での任意の組合せの少なくとも2つの主成分の組合せを含有し、及び、
副成分として、49.9重量%以下の割合で単独で又は前記割合範囲における任意の組合せで、少なくとも1の酸化数の状態で及び/又は化合物の形の元素Ca,Sr,Si,Mg,B,Y,Sc,Ce,Cu,Zn,Pbを含有しており、
主成分と副成分とが、3重量%以下の不純物の割合を差し引いて、100重量%の全体組成になるように互いに任意の組合せで互いに組み合わされていることを特徴とする請求項1から14までのいずれか一項記載の構成部材。 - セラミックボディ(2)は冷却リブ(7)を備えてヒートシンクとして構成されていることを特徴とする、請求項1から15までのいずれか一項記載の構成部材。
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Application Number | Priority Date | Filing Date | Title |
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DE102007019635 | 2007-04-24 | ||
DE102007019635.2 | 2007-04-24 | ||
PCT/EP2008/054625 WO2008128944A1 (de) | 2007-04-24 | 2008-04-17 | Bauteil mit einem keramikkörper, dessen oberfläche metallisiert ist |
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JP2010526008A JP2010526008A (ja) | 2010-07-29 |
JP2010526008A5 JP2010526008A5 (ja) | 2013-10-31 |
JP5649957B2 true JP5649957B2 (ja) | 2015-01-07 |
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JP2010504630A Expired - Fee Related JP5649957B2 (ja) | 2007-04-24 | 2008-04-17 | メタライジングされている表面を有するセラミックボディを備えた構成部材 |
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US (1) | US20100112372A1 (ja) |
EP (1) | EP2142488A1 (ja) |
JP (1) | JP5649957B2 (ja) |
KR (1) | KR101519813B1 (ja) |
CN (1) | CN101801886B (ja) |
DE (1) | DE102008001220A1 (ja) |
WO (1) | WO2008128944A1 (ja) |
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DE102009025033A1 (de) | 2009-06-10 | 2010-12-16 | Behr Gmbh & Co. Kg | Thermoelektrische Vorrichtung und Verfahren zum Herstellen einer thermoelektrischen Vorrichtung |
CN109336645A (zh) * | 2013-06-05 | 2019-02-15 | 陶瓷技术有限责任公司 | 在陶瓷基材上的金属层 |
CN107078175A (zh) * | 2014-08-12 | 2017-08-18 | 陶瓷技术有限责任公司 | 具有太阳能电池的陶瓷承载体 |
KR102421016B1 (ko) * | 2014-09-09 | 2022-07-13 | 세람테크 게엠베하 | 다중-층 냉각 엘리먼트 |
CN105758058B (zh) * | 2014-12-19 | 2020-09-15 | 中国电子科技集团公司第十八研究所 | 一种高电压密集型温差电致冷器及其制备方法 |
CN104617204B (zh) * | 2015-01-16 | 2017-07-14 | 隆科电子(惠阳)有限公司 | 一种碳化硅基电路板及其制备方法 |
CN106145952B (zh) * | 2015-03-23 | 2019-06-11 | 隆科电子(惠阳)有限公司 | 高绝缘碳化硅陶瓷基板与碳化硅基电路板及其制备方法 |
JP6965768B2 (ja) * | 2017-02-28 | 2021-11-10 | 三菱マテリアル株式会社 | 銅/セラミックス接合体、絶縁回路基板、及び、銅/セラミックス接合体の製造方法、絶縁回路基板の製造方法 |
EP3607581A1 (de) * | 2017-04-06 | 2020-02-12 | CeramTec GmbH | Zweiseitig gekühlter schaltkreis |
DE102018215224A1 (de) * | 2018-09-07 | 2019-12-19 | Continental Automotive Gmbh | Vorrichtung zur Energieübertragung mit kühlendem Keramikelement |
KR20240038268A (ko) * | 2022-09-16 | 2024-03-25 | 주식회사 아모그린텍 | 히트싱크 일체형 파워모듈용 기판 및 그 제조방법 |
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JPS6370545A (ja) * | 1986-09-12 | 1988-03-30 | Hitachi Ltd | 半導体パツケ−ジ |
JPH01111360A (ja) * | 1987-10-26 | 1989-04-28 | Fujitsu Ltd | 半導体装置 |
JPH0437662A (ja) * | 1990-06-01 | 1992-02-07 | Murata Mfg Co Ltd | セラミック基板と金属板の接合構造 |
EP0714127B1 (en) * | 1991-11-28 | 2003-01-29 | Kabushiki Kaisha Toshiba | Semiconductor package |
JP3208438B2 (ja) * | 1992-01-16 | 2001-09-10 | イビデン株式会社 | 金属層を備えたセラミックス基板とその製造方法 |
JPH10284808A (ja) * | 1997-04-08 | 1998-10-23 | Denki Kagaku Kogyo Kk | 回路基板 |
JP3339572B2 (ja) * | 1999-10-04 | 2002-10-28 | 日本電気株式会社 | 半導体装置及びその製造方法 |
JP5038565B2 (ja) * | 2000-09-22 | 2012-10-03 | 株式会社東芝 | セラミックス回路基板およびその製造方法 |
JP2004335877A (ja) * | 2003-05-09 | 2004-11-25 | Nissin Electric Co Ltd | 樹脂モールド型積層セラミックコンデンサ |
CN1707886A (zh) * | 2004-06-11 | 2005-12-14 | 中国科学院半导体研究所 | 一种氮化铝交叠式单片集成微通道热沉 |
DE102004033933B4 (de) * | 2004-07-08 | 2009-11-05 | Electrovac Ag | Verfahren zum Herstellen eines Metall-Keramik-Substrates |
DE102004033227A1 (de) | 2004-07-08 | 2006-01-26 | Curamik Electronics Gmbh | Metall-Keramik-Substrat |
JP2005101624A (ja) * | 2004-10-15 | 2005-04-14 | Kyocera Corp | パワーモジュール用配線基板 |
TWI449137B (zh) * | 2006-03-23 | 2014-08-11 | Ceramtec Ag | 構件或電路用的攜帶體 |
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- 2008-04-17 EP EP08736298A patent/EP2142488A1/de not_active Ceased
- 2008-04-17 DE DE102008001220A patent/DE102008001220A1/de not_active Withdrawn
- 2008-04-17 JP JP2010504630A patent/JP5649957B2/ja not_active Expired - Fee Related
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- 2008-04-17 CN CN200880021824.XA patent/CN101801886B/zh not_active Expired - Fee Related
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CN101801886B (zh) | 2014-07-16 |
WO2008128944A1 (de) | 2008-10-30 |
KR101519813B1 (ko) | 2015-05-14 |
DE102008001220A1 (de) | 2008-10-30 |
KR20100017259A (ko) | 2010-02-16 |
CN101801886A (zh) | 2010-08-11 |
EP2142488A1 (de) | 2010-01-13 |
JP2010526008A (ja) | 2010-07-29 |
US20100112372A1 (en) | 2010-05-06 |
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