JP6797797B2 - セラミックス金属回路基板およびそれを用いた半導体装置 - Google Patents
セラミックス金属回路基板およびそれを用いた半導体装置 Download PDFInfo
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- JP6797797B2 JP6797797B2 JP2017527123A JP2017527123A JP6797797B2 JP 6797797 B2 JP6797797 B2 JP 6797797B2 JP 2017527123 A JP2017527123 A JP 2017527123A JP 2017527123 A JP2017527123 A JP 2017527123A JP 6797797 B2 JP6797797 B2 JP 6797797B2
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Description
これら活性金属ろう材としては、Ag−Cu−Ti系が好ましい。Tiは窒化物セラミックスと反応してTiN(窒化チタン)相を形成する。これにより、セラミックス基板と金属板との強固な接合を得ることができる。
(実施例1〜10および比較例1〜2)
セラミックス金属回路基板の構成材として、表1に示す各試料を用意した。窒化珪素基板は、熱伝導率が90W/m・Kであり、3点曲げ強度が650MPaの基板を使用した。AlN(窒化アルミニウム)基板は、熱伝導率が180W/m・Kであり、3点曲げ強度が350MPaである基板を用いた。アルミナ(酸化アルミニウム)基板は、熱伝導率が20W/m・Kであり、3点曲げ強度が400MPaである基板を用いた。アルジル(ZrO2を20wt%含有したAl2O3)基板は、熱伝導率が25W/m・Kであり、3点曲げ強度が450MPaである基板を用いた。
次に、ケースジョイニング後、ポッティングゲルを充填してベースレスタイプのパワーモジュールを作製した。次に、裏金属板側にシリコーングリース層(厚さ100μm)を介してAl放熱板をねじ止めした。これによりインバータ(半導体装置)を作製した。
セラミックス基板の長辺の長さを20mm長くした点以外は実施例1〜10および比較例1〜2のセラミックス金属回路基板を用いて、図7に示すように、ねじ止め構造を有する半導体装置をそれぞれ作製した。ねじ止め構造はセラミックス基板2にねじ穴を設けて、直接放熱板(放熱フィン14)にねじ15を挿通してねじ止めを行った。各半導体装置に対してパワーサイクル試験を実施した。パワーサイクル試験は、温度80〜150℃(ΔT=70℃)の条件で実施し、故障発生までのサイクル回数を測定した。そして故障発生までのサイクル回数が10万回以上を○で表示し、1万回以上10万回未満を△で表示し、1万回未満を×で表示した。その測定結果を下記表5に示す。
2 …セラミックス基板
3 …金属板(表金属板)
3−1 …第一の金属板(表金属板)
3−2 …第二の金属板(表金属板)
4 …金属板(裏金属板)
5 …接合層(表側接合層)
5a…接合層のはみ出し部
6 …接合層(裏側接合層)
6a…接合層のはみ出し部
7 …金属被膜(裏面側金属被膜)
8 …金属被膜(表側面側金属被膜)
9 …金属端子
10 …半導体装置
11…半導体素子
12 …半田層
13 …グリース層
14 …放熱フィン(放熱部材)
15 …ねじ
Claims (12)
- セラミックス基板と、このセラミックス基板の第1の面及び第2の面にそれぞれ接合層を介して接合された第1の金属板及び第2の金属板とを備えるセラミックス金属回路基板において、
前記第1の金属板の、前記セラミックス基板との接合面の反対側の面に金属被膜が設けられ、
前記第2の金属板の、前記セラミックス基板との接合面の反対側の面の一部には半導体素子又は金属端子を実装するために金属被膜が設けられていない箇所が存在し、
前記第1の金属板及び前記第2の金属板は、それぞれ、銅と、銅合金と、アルミニウムと、アルミニウム合金とから選ばれた1種類からなり、
前記第1の金属板及び/又は前記第2の金属板の、前記金属被膜が設けられた面の最大高さRzは、1.5μm以下であり、
前記金属被膜の平均膜厚は、10μm以下である、
ことを特徴とするセラミックス金属回路基板。 - 前記接合層には前記第1の金属板及び前記第2の金属板の側面からはみ出たはみ出し部が形成されていることを特徴とする請求項1記載のセラミックス金属回路基板。
- 前記第1の金属板及び前記第2の金属板の側面および前記はみ出し部を覆うように金属被膜が設けられていることを特徴とする請求項2に記載のセラミックス金属回路基板。
- 前記接合層はAg、Cu、Alから選ばれる少なくとも1種を含有することを特徴とする請求項1ないし請求項3のいずれか1項に記載のセラミックス金属回路基板。
- 前記金属被膜がニッケル、金、またはこれらを主成分とする合金から選択される選ばれる1種であることを特徴とする請求項1ないし請求項4のいずれか1項であることを特徴とするセラミックス金属回路基板。
- 前記セラミックス基板が、窒化珪素基板、窒化アルミニウム基板、酸化アルミニウム基板から選択される1種であることを特徴とする請求項1ないし請求項5のいずれか1項に記載のセラミックス金属回路基板。
- 前記第2の金属板の表面の前記金属被膜が設けられていない箇所に前記金属端子を接合したことを特徴とする請求項1ないし請求項6のいずれか1項に記載のセラミックス金属回路基板。
- 前記第1の金属板が再結晶組織を有していることを特徴とする請求項1ないし請求項7のいずれか1項に記載のセラミックス金属回路基板。
- 前記第1の金属板及び前記第2の金属板の平均結晶粒径は、200μm以上であることを特徴とする請求項1ないし請求項8のいずれか1項に記載のセラミックス金属回路基板。
- 請求項1ないし請求項9のいずれか1項に記載の前記セラミックス金属回路基板に半導体素子を実装したことを特徴とする半導体装置。
- 前記第2の金属板の表面の金属被膜が設けられていない箇所に半田層を介して前記半導体素子を実装したことを特徴とする請求項10に記載の半導体装置。
- 前記半田層は鉛フリー半田で構成されることを特徴とする請求項11に記載の半導体装置。
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2016
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- 2016-06-01 JP JP2017527123A patent/JP6797797B2/ja active Active
- 2016-06-01 EP EP16821132.4A patent/EP3321957B1/en active Active
- 2016-06-01 CN CN201680039837.4A patent/CN107851617B/zh active Active
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US10872841B2 (en) | 2020-12-22 |
EP3321957A4 (en) | 2019-03-27 |
US20180190568A1 (en) | 2018-07-05 |
JPWO2017006661A1 (ja) | 2018-04-19 |
WO2017006661A1 (ja) | 2017-01-12 |
EP3321957B1 (en) | 2022-07-27 |
CN107851617B (zh) | 2021-04-30 |
EP3321957A1 (en) | 2018-05-16 |
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