JP5649957B2 - メタライジングされている表面を有するセラミックボディを備えた構成部材 - Google Patents

メタライジングされている表面を有するセラミックボディを備えた構成部材 Download PDF

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JP5649957B2
JP5649957B2 JP2010504630A JP2010504630A JP5649957B2 JP 5649957 B2 JP5649957 B2 JP 5649957B2 JP 2010504630 A JP2010504630 A JP 2010504630A JP 2010504630 A JP2010504630 A JP 2010504630A JP 5649957 B2 JP5649957 B2 JP 5649957B2
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ceramic body
component
metallizing
metalizing
ceramic
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JP2010526008A (ja
JP2010526008A5 (enExample
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ペーター クルーゲ クラウス
ペーター クルーゲ クラウス
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Ceramtec GmbH
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Families Citing this family (13)

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Publication number Priority date Publication date Assignee Title
DE102009025033A1 (de) 2009-06-10 2010-12-16 Behr Gmbh & Co. Kg Thermoelektrische Vorrichtung und Verfahren zum Herstellen einer thermoelektrischen Vorrichtung
US10207958B2 (en) * 2013-06-05 2019-02-19 Ceramtec Gmbh Metal coating on ceramic substrates
EP3180805A1 (de) * 2014-08-12 2017-06-21 CeramTec GmbH Keramischer trägerkörper mit solarzellen
JP6761800B2 (ja) * 2014-09-09 2020-09-30 セラムテック ゲゼルシャフト ミット ベシュレンクテル ハフツングCeramTec GmbH 多層冷却体
CN105758058B (zh) * 2014-12-19 2020-09-15 中国电子科技集团公司第十八研究所 一种高电压密集型温差电致冷器及其制备方法
CN104617204B (zh) * 2015-01-16 2017-07-14 隆科电子(惠阳)有限公司 一种碳化硅基电路板及其制备方法
CN106145952B (zh) * 2015-03-23 2019-06-11 隆科电子(惠阳)有限公司 高绝缘碳化硅陶瓷基板与碳化硅基电路板及其制备方法
JP6965768B2 (ja) * 2017-02-28 2021-11-10 三菱マテリアル株式会社 銅/セラミックス接合体、絶縁回路基板、及び、銅/セラミックス接合体の製造方法、絶縁回路基板の製造方法
KR20190137086A (ko) * 2017-04-06 2019-12-10 세람테크 게엠베하 2개의 측들 상에서 냉각되는 회로
DE102018215224A1 (de) * 2018-09-07 2019-12-19 Continental Automotive Gmbh Vorrichtung zur Energieübertragung mit kühlendem Keramikelement
KR102816899B1 (ko) * 2022-09-16 2025-06-05 주식회사 아모그린텍 히트싱크 일체형 파워모듈용 기판 및 그 제조방법
EP4428914A1 (en) * 2023-03-09 2024-09-11 Infineon Technologies AG Power semiconductor module arrangement
EP4563550A1 (de) 2023-11-30 2025-06-04 Heraeus Electronics GmbH & Co. KG Verfahren zur strukturierung eines metall-keramik-verbunds

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6370545A (ja) * 1986-09-12 1988-03-30 Hitachi Ltd 半導体パツケ−ジ
JPH01111360A (ja) * 1987-10-26 1989-04-28 Fujitsu Ltd 半導体装置
JPH0437662A (ja) * 1990-06-01 1992-02-07 Murata Mfg Co Ltd セラミック基板と金属板の接合構造
EP0544329A3 (en) * 1991-11-28 1993-09-01 Kabushiki Kaisha Toshiba Semiconductor package
JP3208438B2 (ja) * 1992-01-16 2001-09-10 イビデン株式会社 金属層を備えたセラミックス基板とその製造方法
JPH10284808A (ja) * 1997-04-08 1998-10-23 Denki Kagaku Kogyo Kk 回路基板
JP3339572B2 (ja) * 1999-10-04 2002-10-28 日本電気株式会社 半導体装置及びその製造方法
JP5038565B2 (ja) * 2000-09-22 2012-10-03 株式会社東芝 セラミックス回路基板およびその製造方法
JP2004335877A (ja) * 2003-05-09 2004-11-25 Nissin Electric Co Ltd 樹脂モールド型積層セラミックコンデンサ
CN1707886A (zh) * 2004-06-11 2005-12-14 中国科学院半导体研究所 一种氮化铝交叠式单片集成微通道热沉
DE102004033933B4 (de) * 2004-07-08 2009-11-05 Electrovac Ag Verfahren zum Herstellen eines Metall-Keramik-Substrates
DE102004033227A1 (de) * 2004-07-08 2006-01-26 Curamik Electronics Gmbh Metall-Keramik-Substrat
JP2005101624A (ja) * 2004-10-15 2005-04-14 Kyocera Corp パワーモジュール用配線基板
TWI449137B (zh) * 2006-03-23 2014-08-11 製陶技術創新製陶工程股份公司 構件或電路用的攜帶體

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WO2008128944A1 (de) 2008-10-30
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