CN101801886B - 具有其表面已金属化的陶瓷体的结构部件 - Google Patents

具有其表面已金属化的陶瓷体的结构部件 Download PDF

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CN101801886B
CN101801886B CN200880021824.XA CN200880021824A CN101801886B CN 101801886 B CN101801886 B CN 101801886B CN 200880021824 A CN200880021824 A CN 200880021824A CN 101801886 B CN101801886 B CN 101801886B
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metallization
ceramic body
structural component
component according
ceramic
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CN101801886A (zh
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C·P·克卢格
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Ceramtec GmbH
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Ceramtec GmbH
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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
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    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
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    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
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    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
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    • H05K1/02—Details
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    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
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    • H05K2201/01—Dielectrics
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    • Y10T428/00—Stock material or miscellaneous articles
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    • Y10T428/00—Stock material or miscellaneous articles
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    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
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    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
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    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T428/00—Stock material or miscellaneous articles
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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Ceramic Products (AREA)
CN200880021824.XA 2007-04-24 2008-04-17 具有其表面已金属化的陶瓷体的结构部件 Expired - Fee Related CN101801886B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007019635 2007-04-24
DE102007019635.2 2007-04-24
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US20100112372A1 (en) 2010-05-06

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