WO2008128944A1 - Bauteil mit einem keramikkörper, dessen oberfläche metallisiert ist - Google Patents

Bauteil mit einem keramikkörper, dessen oberfläche metallisiert ist Download PDF

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Publication number
WO2008128944A1
WO2008128944A1 PCT/EP2008/054625 EP2008054625W WO2008128944A1 WO 2008128944 A1 WO2008128944 A1 WO 2008128944A1 EP 2008054625 W EP2008054625 W EP 2008054625W WO 2008128944 A1 WO2008128944 A1 WO 2008128944A1
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WIPO (PCT)
Prior art keywords
metallization
component according
ceramic body
component
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2008/054625
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German (de)
English (en)
French (fr)
Inventor
Claus Peter Kluge
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ceramtec GmbH
Original Assignee
Ceramtec GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ceramtec GmbH filed Critical Ceramtec GmbH
Priority to JP2010504630A priority Critical patent/JP5649957B2/ja
Priority to US12/596,880 priority patent/US20100112372A1/en
Priority to KR1020097024346A priority patent/KR101519813B1/ko
Priority to CN200880021824.XA priority patent/CN101801886B/zh
Priority to EP08736298A priority patent/EP2142488A1/de
Publication of WO2008128944A1 publication Critical patent/WO2008128944A1/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C—CHEMISTRY; METALLURGY
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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
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    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
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    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
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    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
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Definitions

  • the object of the invention is to present a component with a metallized on its surface ceramic body, which is not exclusively plate-shaped, flat, and has a high partial discharge resistance.
  • the object is achieved by means of the characterizing features of claim 1.
  • Advantageous embodiments of the invention are presented in the dependent claims.
  • the component according to the invention is spatially structured.
  • the ceramic body is a three-dimensional structure.
  • connect to a plate more parts so that a body arises in any form.
  • the whole body is in one piece, d. h., he is not composed of individual parts.
  • further plates are vertical on a plate, then for example an overall body can be produced which is E-shaped.
  • Such a form for example, heatsinks.
  • This partial discharge strength is achieved, depending on the predetermined same or different measuring method with the same or unequal or changing predetermined measuring voltage or the same or unequal or changing measuring conditions.
  • Measurement conditions can be, for example, pressure or temperature or air humidity or equal or unequal distances of the metallizations.
  • these defects may only have an edge profile, whose radius of curvature does not fall below 10 microns, so that the required partial discharge resistance of ⁇ 20 pC is not exceeded.
  • a metallization metals are preferred in the form of coatings or films or sheets cohesively or by mechanical positive connection over the entire surface or part of the surface connected to the ceramic body, which have the same or different thermal conductivity as the ceramic body.
  • the metallization can consist, for example, of tungsten, silver, gold, copper, platinum, palladium, nickel, aluminum or steel in pure or industrial quality or of mixtures of at least two different metals.
  • the metallization can also, for example, additionally or alone, from reaction solders, soft solders or brazing alloys.
  • the metals of the metallization in the form of coatings or foils or sheets may be added to adhesion promoting or other additives such as glasses or polymeric materials or they may be coated with it to increase the adhesion of the metallization on the ceramic body.
  • the layer (s) of metallization are formed using a DCB (Direct Copper Bonding) or AMB (Active Metal Brazing) or screen printing or electrolytic or chemical deposition or vapor deposition process or by adhesion or bonding or a combination of these processes applied to the surface of the body on opposite and / or adjacent surfaces.
  • One or more metallizations on the ceramic body may consist exclusively of copper.
  • the connection with the ceramic body by means of the screen printing process followed by thermal treatment or the DCB process.
  • One or more metallizations on the ceramic body may consist exclusively of aluminum.
  • the connection with the ceramic body takes place by means of the screen printing process with subsequent thermal treatment or by means of the AMB process.
  • connection of the at least one metallization and / or a further metallization to the ceramic body is> 90%.
  • the at least one metallization is connected to the ceramic body with an adhesive strength of at least 12 N / cm. This ensures that, in particular due to the thermal stress, no detachment of the metallization from the ceramic body takes place.
  • the ceramic material contains as main component 50.1% by weight to 100% by weight ZrO 2 / HfO 2 or 50.1% by weight to 100% by weight Al 2 O 3 or 50.1% by weight to 100
  • the main components and the minor components with deduction of a content of impurities of ⁇ 3% by weight, can be combined in any combination with one another to give a total composition of 100% by weight.
  • the ceramic body of the component is formed as a heat sink.
  • a heatsink is understood to mean a body which carries electrical or electronic components or circuits and which is shaped in such a way that it can dissipate the heat generated in the components or circuits in such a way that no accumulation of heat occurs, which can damage the components or circuits.
  • the carrier body is a body made of a material that is electrically non-conductive or almost non-conductive and has good thermal conductivity. The ideal material for such a body is ceramic.
  • the body is integral and has heat dissipating or feeding elements for protecting the electronic components or circuits.
  • the body is integral and has heat dissipating or feeding elements for protecting the electronic components or circuits.
  • the body is integral and has heat dissipating or feeding elements for protecting the electronic components or circuits.
  • a component 1 which has a ceramic body 2, which according to the invention is not plate-shaped. Not plate-shaped means that the top 3 and the bottom 4 of the ceramic body 2 are formed so that they each have a different surface area.
  • the body is spatially structured.
  • the upper side 3 of the component 1 has a flat surface in the present exemplary embodiment.
  • the top 3 is a circuit carrier.
  • On at least one metallization 5 on the upper side 3 of the ceramic body 2, at least one further metallization 6 is applied, which in the present case covers the surface of the first metallization 5 over part of the area.
  • the ceramic body 2 is E-shaped.
  • the body is a heatsink.
  • the underside 4 of the ceramic body 2 has cooling ribs 7. Also, the cooling fins 7 are provided with metallized areas 5, where, for example, electronic components can be soldered.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Ceramic Products (AREA)
PCT/EP2008/054625 2007-04-24 2008-04-17 Bauteil mit einem keramikkörper, dessen oberfläche metallisiert ist Ceased WO2008128944A1 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010504630A JP5649957B2 (ja) 2007-04-24 2008-04-17 メタライジングされている表面を有するセラミックボディを備えた構成部材
US12/596,880 US20100112372A1 (en) 2007-04-24 2008-04-17 Component having a ceramic base the surface of which is metalized
KR1020097024346A KR101519813B1 (ko) 2007-04-24 2008-04-17 표면이 금속화된 세라믹 베이스를 구비하는 부품
CN200880021824.XA CN101801886B (zh) 2007-04-24 2008-04-17 具有其表面已金属化的陶瓷体的结构部件
EP08736298A EP2142488A1 (de) 2007-04-24 2008-04-17 Bauteil mit einem keramikkörper, dessen oberfläche metallisiert ist

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007019635 2007-04-24
DE102007019635.2 2007-04-24

Publications (1)

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WO2008128944A1 true WO2008128944A1 (de) 2008-10-30

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PCT/EP2008/054625 Ceased WO2008128944A1 (de) 2007-04-24 2008-04-17 Bauteil mit einem keramikkörper, dessen oberfläche metallisiert ist

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US (1) US20100112372A1 (enExample)
EP (1) EP2142488A1 (enExample)
JP (1) JP5649957B2 (enExample)
KR (1) KR101519813B1 (enExample)
CN (1) CN101801886B (enExample)
DE (1) DE102008001220A1 (enExample)
WO (1) WO2008128944A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009025033A1 (de) 2009-06-10 2010-12-16 Behr Gmbh & Co. Kg Thermoelektrische Vorrichtung und Verfahren zum Herstellen einer thermoelektrischen Vorrichtung
US10207958B2 (en) * 2013-06-05 2019-02-19 Ceramtec Gmbh Metal coating on ceramic substrates
EP3180805A1 (de) * 2014-08-12 2017-06-21 CeramTec GmbH Keramischer trägerkörper mit solarzellen
JP6761800B2 (ja) * 2014-09-09 2020-09-30 セラムテック ゲゼルシャフト ミット ベシュレンクテル ハフツングＣｅｒａｍＴｅｃ ＧｍｂＨ 多層冷却体
CN105758058B (zh) * 2014-12-19 2020-09-15 中国电子科技集团公司第十八研究所 一种高电压密集型温差电致冷器及其制备方法
CN104617204B (zh) * 2015-01-16 2017-07-14 隆科电子(惠阳)有限公司 一种碳化硅基电路板及其制备方法
CN106145952B (zh) * 2015-03-23 2019-06-11 隆科电子(惠阳)有限公司 高绝缘碳化硅陶瓷基板与碳化硅基电路板及其制备方法
JP6965768B2 (ja) * 2017-02-28 2021-11-10 三菱マテリアル株式会社 銅／セラミックス接合体、絶縁回路基板、及び、銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法
KR20190137086A (ko) * 2017-04-06 2019-12-10 세람테크 게엠베하 2개의 측들 상에서 냉각되는 회로
DE102018215224A1 (de) * 2018-09-07 2019-12-19 Continental Automotive Gmbh Vorrichtung zur Energieübertragung mit kühlendem Keramikelement
KR102816899B1 (ko) * 2022-09-16 2025-06-05 주식회사 아모그린텍 히트싱크 일체형 파워모듈용 기판 및 그 제조방법
EP4428914A1 (en) * 2023-03-09 2024-09-11 Infineon Technologies AG Power semiconductor module arrangement
EP4563550A1 (de) 2023-11-30 2025-06-04 Heraeus Electronics GmbH & Co. KG Verfahren zur strukturierung eines metall-keramik-verbunds

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6370545A (ja) * 1986-09-12 1988-03-30 Hitachi Ltd 半導体パツケ−ジ
JPH01111360A (ja) * 1987-10-26 1989-04-28 Fujitsu Ltd 半導体装置
JPH0437662A (ja) * 1990-06-01 1992-02-07 Murata Mfg Co Ltd セラミック基板と金属板の接合構造
JPH05191038A (ja) * 1992-01-16 1993-07-30 Ibiden Co Ltd 金属層を備えたセラミックス基板とその製造方法
US5703397A (en) * 1991-11-28 1997-12-30 Tokyo Shibaura Electric Co Semiconductor package having an aluminum nitride substrate
JPH10284808A (ja) * 1997-04-08 1998-10-23 Denki Kagaku Kogyo Kk 回路基板
US20020117683A1 (en) * 1999-10-04 2002-08-29 Nec Corporation Semiconductor device
CN1707886A (zh) * 2004-06-11 2005-12-14 中国科学院半导体研究所 一种氮化铝交叠式单片集成微通道热沉
DE102004033227A1 (de) * 2004-07-08 2006-01-26 Curamik Electronics Gmbh Metall-Keramik-Substrat
WO2007107601A2 (de) * 2006-03-23 2007-09-27 Ceramtec Ag Trägerkörper für bauelemente oder schaltungen

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5038565B2 (ja) * 2000-09-22 2012-10-03 株式会社東芝 セラミックス回路基板およびその製造方法
JP2004335877A (ja) * 2003-05-09 2004-11-25 Nissin Electric Co Ltd 樹脂モールド型積層セラミックコンデンサ
DE102004033933B4 (de) * 2004-07-08 2009-11-05 Electrovac Ag Verfahren zum Herstellen eines Metall-Keramik-Substrates
JP2005101624A (ja) * 2004-10-15 2005-04-14 Kyocera Corp パワーモジュール用配線基板

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6370545A (ja) * 1986-09-12 1988-03-30 Hitachi Ltd 半導体パツケ−ジ
JPH01111360A (ja) * 1987-10-26 1989-04-28 Fujitsu Ltd 半導体装置
JPH0437662A (ja) * 1990-06-01 1992-02-07 Murata Mfg Co Ltd セラミック基板と金属板の接合構造
US5703397A (en) * 1991-11-28 1997-12-30 Tokyo Shibaura Electric Co Semiconductor package having an aluminum nitride substrate
JPH05191038A (ja) * 1992-01-16 1993-07-30 Ibiden Co Ltd 金属層を備えたセラミックス基板とその製造方法
JPH10284808A (ja) * 1997-04-08 1998-10-23 Denki Kagaku Kogyo Kk 回路基板
US20020117683A1 (en) * 1999-10-04 2002-08-29 Nec Corporation Semiconductor device
CN1707886A (zh) * 2004-06-11 2005-12-14 中国科学院半导体研究所 一种氮化铝交叠式单片集成微通道热沉
DE102004033227A1 (de) * 2004-07-08 2006-01-26 Curamik Electronics Gmbh Metall-Keramik-Substrat
WO2007107601A2 (de) * 2006-03-23 2007-09-27 Ceramtec Ag Trägerkörper für bauelemente oder schaltungen

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Week 200631, Derwent World Patents Index; AN 2006-295902, XP002487892 *

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EP2142488A1 (de) 2010-01-13
JP2010526008A (ja) 2010-07-29
JP5649957B2 (ja) 2015-01-07
DE102008001220A1 (de) 2008-10-30
KR101519813B1 (ko) 2015-05-14
CN101801886A (zh) 2010-08-11
KR20100017259A (ko) 2010-02-16
US20100112372A1 (en) 2010-05-06
CN101801886B (zh) 2014-07-16

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