JP5635246B2 - Iii族窒化物半導体光素子及びエピタキシャル基板 - Google Patents

Iii族窒化物半導体光素子及びエピタキシャル基板 Download PDF

Info

Publication number
JP5635246B2
JP5635246B2 JP2009167177A JP2009167177A JP5635246B2 JP 5635246 B2 JP5635246 B2 JP 5635246B2 JP 2009167177 A JP2009167177 A JP 2009167177A JP 2009167177 A JP2009167177 A JP 2009167177A JP 5635246 B2 JP5635246 B2 JP 5635246B2
Authority
JP
Japan
Prior art keywords
layer
gallium nitride
group iii
type gallium
based semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009167177A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011023541A (ja
JP2011023541A5 (enExample
Inventor
祐介 善積
祐介 善積
陽平 塩谷
陽平 塩谷
秋田 勝史
勝史 秋田
上野 昌紀
昌紀 上野
孝史 京野
孝史 京野
中村 孝夫
孝夫 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2009167177A priority Critical patent/JP5635246B2/ja
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to CN201080031731.2A priority patent/CN102474076B/zh
Priority to PCT/JP2010/061839 priority patent/WO2011007777A1/ja
Priority to EP10799835A priority patent/EP2456026A1/en
Priority to KR1020127000699A priority patent/KR20120024955A/ko
Priority to US12/836,117 priority patent/US8304793B2/en
Priority to TW099123335A priority patent/TW201110414A/zh
Publication of JP2011023541A publication Critical patent/JP2011023541A/ja
Publication of JP2011023541A5 publication Critical patent/JP2011023541A5/ja
Application granted granted Critical
Publication of JP5635246B2 publication Critical patent/JP5635246B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/34Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
    • H01S5/343Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/34Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
    • H01S5/343Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • H01S5/34333Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer based on Ga(In)N or Ga(In)P, e.g. blue laser
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00Nanooptics, e.g. quantum optics or photonic crystals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/20Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/32Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/3202Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures grown on specifically orientated substrates, or using orientation dependent growth
    • H01S5/320275Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures grown on specifically orientated substrates, or using orientation dependent growth semi-polar orientation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/0014Measuring characteristics or properties thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/20Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/2004Confining in the direction perpendicular to the layer structure
    • H01S5/2009Confining in the direction perpendicular to the layer structure by using electron barrier layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/20Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/2004Confining in the direction perpendicular to the layer structure
    • H01S5/2018Optical confinement, e.g. absorbing-, reflecting- or waveguide-layers
    • H01S5/2031Optical confinement, e.g. absorbing-, reflecting- or waveguide-layers characterized by special waveguide layers, e.g. asymmetric waveguide layers or defined bandgap discontinuities
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/20Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/305Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure
    • H01S5/3054Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure p-doping
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/32Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/3211Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures characterised by special cladding layers, e.g. details on band-discontinuities
    • H01S5/3213Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures characterised by special cladding layers, e.g. details on band-discontinuities asymmetric clading layers

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Biophysics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geometry (AREA)
  • Led Devices (AREA)
  • Semiconductor Lasers (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2009167177A 2009-07-15 2009-07-15 Iii族窒化物半導体光素子及びエピタキシャル基板 Expired - Fee Related JP5635246B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2009167177A JP5635246B2 (ja) 2009-07-15 2009-07-15 Iii族窒化物半導体光素子及びエピタキシャル基板
PCT/JP2010/061839 WO2011007777A1 (ja) 2009-07-15 2010-07-13 Iii族窒化物半導体光素子、エピタキシャル基板
EP10799835A EP2456026A1 (en) 2009-07-15 2010-07-13 Group iii nitride semiconductor optical element and epitaxial substrate
KR1020127000699A KR20120024955A (ko) 2009-07-15 2010-07-13 Ⅲ족 질화물 반도체 광소자 및 에피택셜 기판
CN201080031731.2A CN102474076B (zh) 2009-07-15 2010-07-13 Iii族氮化物半导体光元件、外延衬底
US12/836,117 US8304793B2 (en) 2009-07-15 2010-07-14 III-nitride semiconductor optical device and epitaxial substrate
TW099123335A TW201110414A (en) 2009-07-15 2010-07-15 Group iii nitride semiconductor optical element and epitaxial substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009167177A JP5635246B2 (ja) 2009-07-15 2009-07-15 Iii族窒化物半導体光素子及びエピタキシャル基板

Publications (3)

Publication Number Publication Date
JP2011023541A JP2011023541A (ja) 2011-02-03
JP2011023541A5 JP2011023541A5 (enExample) 2012-04-26
JP5635246B2 true JP5635246B2 (ja) 2014-12-03

Family

ID=43449384

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009167177A Expired - Fee Related JP5635246B2 (ja) 2009-07-15 2009-07-15 Iii族窒化物半導体光素子及びエピタキシャル基板

Country Status (7)

Country Link
US (1) US8304793B2 (enExample)
EP (1) EP2456026A1 (enExample)
JP (1) JP5635246B2 (enExample)
KR (1) KR20120024955A (enExample)
CN (1) CN102474076B (enExample)
TW (1) TW201110414A (enExample)
WO (1) WO2011007777A1 (enExample)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007080896A (ja) * 2005-09-12 2007-03-29 Sanyo Electric Co Ltd 半導体素子
JP5553035B2 (ja) * 2011-01-24 2014-07-16 住友電気工業株式会社 窒化ガリウム系半導体レーザ素子
JP5503574B2 (ja) * 2011-02-21 2014-05-28 住友電気工業株式会社 レーザダイオード
JP5361925B2 (ja) * 2011-03-08 2013-12-04 株式会社東芝 半導体発光素子およびその製造方法
JP6070548B2 (ja) * 2011-05-18 2017-02-01 住友電気工業株式会社 化合物半導体基板
JP2012248575A (ja) * 2011-05-25 2012-12-13 Sumitomo Electric Ind Ltd 窒化物半導体レーザ素子、エピタキシャル基板、及び窒化物半導体レーザ素子を作製する方法
JP2013033930A (ja) * 2011-06-29 2013-02-14 Sumitomo Electric Ind Ltd Iii族窒化物半導体素子、及び、iii族窒化物半導体素子の製造方法
JP5252042B2 (ja) 2011-07-21 2013-07-31 住友電気工業株式会社 Iii族窒化物半導体発光素子、及びiii族窒化物半導体発光素子を作製する方法
US8946788B2 (en) 2011-08-04 2015-02-03 Avogy, Inc. Method and system for doping control in gallium nitride based devices
JP5668647B2 (ja) * 2011-09-06 2015-02-12 豊田合成株式会社 Iii族窒化物半導体発光素子およびその製造方法
JP5255106B2 (ja) * 2011-10-24 2013-08-07 住友電気工業株式会社 窒化物半導体発光素子
JP2013102043A (ja) * 2011-11-08 2013-05-23 Sumitomo Electric Ind Ltd 半導体レーザ素子、及び、半導体レーザ素子の作製方法
JP5940355B2 (ja) * 2012-04-19 2016-06-29 ソウル セミコンダクター カンパニー リミテッド p型窒化物半導体層の製造方法
KR102062382B1 (ko) 2012-04-19 2020-01-03 서울반도체 주식회사 반도체 장치 및 이를 제조하는 방법
JP5699983B2 (ja) * 2012-04-27 2015-04-15 住友電気工業株式会社 窒化ガリウム系半導体を作製する方法、iii族窒化物半導体デバイスを作製する方法、及びiii族窒化物半導体デバイス
WO2013165134A1 (en) * 2012-05-01 2013-11-07 Seoul Opto Device Co., Ltd. Method for fabricating p-type aluminum gallium nitride semiconductor
JP2014086507A (ja) * 2012-10-22 2014-05-12 Sumitomo Electric Ind Ltd 窒化物半導体レーザ、窒化物半導体レーザを作製する方法
TWI589018B (zh) * 2012-11-19 2017-06-21 新世紀光電股份有限公司 氮化物半導體結構
TWI535055B (zh) 2012-11-19 2016-05-21 新世紀光電股份有限公司 氮化物半導體結構及半導體發光元件
TWI631727B (zh) * 2012-11-19 2018-08-01 新世紀光電股份有限公司 氮化物半導體結構
TWI511325B (zh) * 2012-11-19 2015-12-01 Genesis Photonics Inc 氮化物半導體結構及半導體發光元件
TWI663745B (zh) * 2012-11-19 2019-06-21 新世紀光電股份有限公司 氮化物半導體結構
TWI524551B (zh) 2012-11-19 2016-03-01 新世紀光電股份有限公司 氮化物半導體結構及半導體發光元件
US10153394B2 (en) 2012-11-19 2018-12-11 Genesis Photonics Inc. Semiconductor structure
TWI499080B (zh) 2012-11-19 2015-09-01 Genesis Photonics Inc 氮化物半導體結構及半導體發光元件
JP2014127708A (ja) * 2012-12-27 2014-07-07 Toshiba Corp 半導体発光素子及び半導体発光素子の製造方法
CN107104174A (zh) * 2013-01-25 2017-08-29 新世纪光电股份有限公司 氮化物半导体结构及半导体发光元件
CN108550670B (zh) * 2013-01-25 2020-10-27 新世纪光电股份有限公司 氮化物半导体结构及半导体发光元件
CN107482097A (zh) * 2013-01-25 2017-12-15 新世纪光电股份有限公司 氮化物半导体结构及半导体发光元件
CN107833956B (zh) * 2013-01-25 2020-04-07 新世纪光电股份有限公司 氮化物半导体结构及半导体发光元件
JP6453542B2 (ja) 2013-02-14 2019-01-16 ソウル セミコンダクター カンパニー リミテッド 半導体装置及びこれの製造方法
JP2015176936A (ja) * 2014-03-13 2015-10-05 株式会社東芝 半導体装置
KR102223037B1 (ko) 2014-10-01 2021-03-05 삼성전자주식회사 반도체 발광소자 제조방법
JP5953447B1 (ja) * 2015-02-05 2016-07-20 Dowaエレクトロニクス株式会社 Iii族窒化物半導体発光素子およびその製造方法
JP6479615B2 (ja) * 2015-09-14 2019-03-06 株式会社東芝 半導体装置の製造方法
JP6218791B2 (ja) * 2015-10-28 2017-10-25 シャープ株式会社 窒化物半導体レーザ素子
TWI581454B (zh) * 2016-01-04 2017-05-01 錼創科技股份有限公司 半導體發光元件
TWI738640B (zh) 2016-03-08 2021-09-11 新世紀光電股份有限公司 半導體結構
TWI717386B (zh) 2016-09-19 2021-02-01 新世紀光電股份有限公司 含氮半導體元件
JP7043802B2 (ja) * 2017-11-16 2022-03-30 住友電気工業株式会社 垂直共振型面発光レーザ、垂直共振型面発光レーザを作製する方法
EP3731355A4 (en) * 2018-03-13 2021-10-27 Fujikura Ltd. OPTICAL SEMICONDUCTOR ELEMENT, STRUCTURE FOR MANUFACTURING A SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING AN OPTICAL SEMICONDUCTOR ELEMENT IN WHICH THE STRUCTURE IS USED
WO2021070469A1 (ja) * 2019-10-09 2021-04-15 パナソニック株式会社 窒化物半導体デバイス
JP7642553B2 (ja) 2019-11-08 2025-03-10 ヌヴォトンテクノロジージャパン株式会社 半導体発光素子、及び半導体発光素子の製造方法
CN111786259A (zh) * 2020-08-25 2020-10-16 北京蓝海创芯智能科技有限公司 一种提高载流子注入效率的氮化镓基激光器外延结构及其制备方法
TWI839293B (zh) * 2021-09-28 2024-04-11 晶元光電股份有限公司 發光元件及其製造方法
TWI816186B (zh) * 2021-09-28 2023-09-21 晶元光電股份有限公司 發光元件及其製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3269344B2 (ja) * 1995-08-21 2002-03-25 松下電器産業株式会社 結晶成長方法および半導体発光素子
JP2003133246A (ja) * 1996-01-19 2003-05-09 Matsushita Electric Ind Co Ltd 窒化ガリウム系化合物半導体発光素子及び窒化ガリウム系化合物半導体の製造方法
JP2000156544A (ja) * 1998-09-17 2000-06-06 Matsushita Electric Ind Co Ltd 窒化物半導体素子の製造方法
JP3788444B2 (ja) 2003-03-31 2006-06-21 日立電線株式会社 発光ダイオード及びその製造方法
US7239392B2 (en) * 2003-05-22 2007-07-03 Xitronix Corporation Polarization modulation photoreflectance characterization of semiconductor electronic interfaces
KR101351396B1 (ko) 2005-06-01 2014-02-07 재팬 사이언스 앤드 테크놀로지 에이젼시 반극성 (Ga,Al,In,B)N 박막들, 헤테로구조들, 및소자들의 성장 및 제조에 대한 기술
JP2008258503A (ja) * 2007-04-06 2008-10-23 Sumitomo Electric Ind Ltd 窒化物系半導体発光素子、および窒化物系半導体発光素子を作製する方法
JP2009021279A (ja) 2007-07-10 2009-01-29 Hitachi Cable Ltd 半導体エピタキシャルウエハ
JP2009021361A (ja) 2007-07-11 2009-01-29 Sumitomo Electric Ind Ltd 窒化物系半導体発光素子、および窒化物系半導体発光素子を作製する方法
WO2009047894A1 (ja) 2007-10-09 2009-04-16 Panasonic Corporation Iii族窒化物結晶基板の製造方法、iii族窒化物結晶基板、iii族窒化物結晶基板を用いた半導体装置
JP2009152448A (ja) 2007-12-21 2009-07-09 Dowa Electronics Materials Co Ltd 窒化物半導体素子およびその製造方法
JP4375497B1 (ja) * 2009-03-11 2009-12-02 住友電気工業株式会社 Iii族窒化物半導体素子、エピタキシャル基板、及びiii族窒化物半導体素子を作製する方法

Also Published As

Publication number Publication date
JP2011023541A (ja) 2011-02-03
US20110114916A1 (en) 2011-05-19
EP2456026A1 (en) 2012-05-23
KR20120024955A (ko) 2012-03-14
WO2011007777A1 (ja) 2011-01-20
CN102474076A (zh) 2012-05-23
CN102474076B (zh) 2014-06-18
US8304793B2 (en) 2012-11-06
TW201110414A (en) 2011-03-16

Similar Documents

Publication Publication Date Title
JP5635246B2 (ja) Iii族窒化物半導体光素子及びエピタキシャル基板
CN101919076B (zh) Ⅲ族氮化物半导体器件、外延衬底及ⅲ族氮化物半导体器件的制作方法
US6455877B1 (en) III-N compound semiconductor device
US6920166B2 (en) Thin film deposition method of nitride semiconductor and nitride semiconductor light emitting device
JP5003527B2 (ja) Iii族窒化物発光素子、及びiii族窒化物系半導体発光素子を作製する方法
US8183071B2 (en) Method for producing nitride semiconductor optical device and epitaxial wafer
US20100297784A1 (en) Nitride based semiconductor optical device, epitaxial wafer for nitride based semiconductor optical device, and method of fabricating semiconductor light-emitting device
US9147804B2 (en) Nitride semiconductor light-emitting element and light source including the nitride semiconductor light-emitting element
US20110212560A1 (en) Method for fabricating nitride semiconductor light emitting device and method for fabricating epitaxial wafer
US20110220867A1 (en) Superlattice free ultraviolet emitter
JP5699983B2 (ja) 窒化ガリウム系半導体を作製する方法、iii族窒化物半導体デバイスを作製する方法、及びiii族窒化物半導体デバイス
US20130009202A1 (en) Group iii nitride semiconductor device, method of fabricating group iii nitride semiconductor device
WO2009107516A1 (ja) Iii族窒化物半導体レーザ
CN101826581A (zh) 氮化镓类半导体光元件及其制造方法、外延晶片
JP5401145B2 (ja) Iii族窒化物積層体の製造方法
US8477818B2 (en) Gallium nitride-based semiconductor laser device, and method for fabricating gallium nitride-based semiconductor laser device
JP5310382B2 (ja) Iii族窒化物半導体光素子、及びiii族窒化物半導体光素子を作製する方法
TW201320392A (zh) 氮化物半導體發光元件、及氮化物半導體發光元件之製造方法
KR100742989B1 (ko) 질화갈륨계 발광 소자의 제조 방법
JP2003289047A (ja) 窒化物系iii−v族化合物半導体の成長方法、半導体装置の製造方法および半導体装置
KURAMATA et al. Continuous wave operation of InGaN laser diodes fabricated on SiC substrates
JP2012109624A (ja) Iii族窒化物発光素子、及びiii族窒化物系半導体発光素子を作製する方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120313

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120313

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130205

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130408

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20130618

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130918

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20130926

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20131025

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140901

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20141016

R150 Certificate of patent or registration of utility model

Ref document number: 5635246

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees