JP5634497B2 - レーザー使用による材料除去中の熱効果の最小化方法 - Google Patents

レーザー使用による材料除去中の熱効果の最小化方法 Download PDF

Info

Publication number
JP5634497B2
JP5634497B2 JP2012502069A JP2012502069A JP5634497B2 JP 5634497 B2 JP5634497 B2 JP 5634497B2 JP 2012502069 A JP2012502069 A JP 2012502069A JP 2012502069 A JP2012502069 A JP 2012502069A JP 5634497 B2 JP5634497 B2 JP 5634497B2
Authority
JP
Japan
Prior art keywords
routing
tool path
laser
routings
sheet material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012502069A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012521888A5 (enExample
JP2012521888A (ja
Inventor
康 大迫
康 大迫
Original Assignee
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド, エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド filed Critical エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
Publication of JP2012521888A publication Critical patent/JP2012521888A/ja
Publication of JP2012521888A5 publication Critical patent/JP2012521888A5/ja
Application granted granted Critical
Publication of JP5634497B2 publication Critical patent/JP5634497B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/18—Sheet panels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2012502069A 2009-03-27 2010-02-26 レーザー使用による材料除去中の熱効果の最小化方法 Active JP5634497B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/413,084 2009-03-27
US12/413,084 US8729427B2 (en) 2009-03-27 2009-03-27 Minimizing thermal effect during material removal using a laser
PCT/US2010/025639 WO2010110991A2 (en) 2009-03-27 2010-02-26 Minimizing thermal effect during material removal using a laser

Publications (3)

Publication Number Publication Date
JP2012521888A JP2012521888A (ja) 2012-09-20
JP2012521888A5 JP2012521888A5 (enExample) 2013-04-11
JP5634497B2 true JP5634497B2 (ja) 2014-12-03

Family

ID=42781749

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012502069A Active JP5634497B2 (ja) 2009-03-27 2010-02-26 レーザー使用による材料除去中の熱効果の最小化方法

Country Status (6)

Country Link
US (1) US8729427B2 (enExample)
JP (1) JP5634497B2 (enExample)
KR (1) KR101729671B1 (enExample)
CN (1) CN102348529B (enExample)
TW (1) TWI535516B (enExample)
WO (1) WO2010110991A2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7633033B2 (en) 2004-01-09 2009-12-15 General Lasertronics Corporation Color sensing for laser decoating
WO2008118365A1 (en) 2007-03-22 2008-10-02 General Lasertronics Corporation Methods for stripping and modifying surfaces with laser-induced ablation
US8383984B2 (en) 2010-04-02 2013-02-26 Electro Scientific Industries, Inc. Method and apparatus for laser singulation of brittle materials
US10112257B1 (en) 2010-07-09 2018-10-30 General Lasertronics Corporation Coating ablating apparatus with coating removal detection
KR102035619B1 (ko) * 2010-07-26 2019-12-16 하마마츠 포토닉스 가부시키가이샤 레이저 가공방법
JP6392514B2 (ja) * 2010-12-30 2018-09-19 スリーエム イノベイティブ プロパティズ カンパニー レーザー切断方法及びこれにより製造された物品
JP2012196689A (ja) * 2011-03-22 2012-10-18 Fujitsu Ltd レーザ加工方法及びそのプログラム
US9895771B2 (en) 2012-02-28 2018-02-20 General Lasertronics Corporation Laser ablation for the environmentally beneficial removal of surface coatings
US9387041B2 (en) * 2013-03-15 2016-07-12 University Of North Texas Laser-assisted machining (LAM) of hard tissues and bones
US10188519B2 (en) 2013-03-15 2019-01-29 University Of North Texas Laser-assisted machining (LAM) of hard tissues and bones
KR102199211B1 (ko) * 2013-10-11 2021-01-07 삼성디스플레이 주식회사 레이저 가공 장치 및 이를 이용한 가공 방법
US10086597B2 (en) 2014-01-21 2018-10-02 General Lasertronics Corporation Laser film debonding method
KR102859580B1 (ko) * 2023-05-25 2025-09-12 현대모비스 주식회사 레이저 라우팅 방법

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1015610B (zh) * 1990-05-03 1992-02-26 江西省机械工业设计研究院 钢结硬质合金模具激光切割工艺
JP2720669B2 (ja) 1991-11-11 1998-03-04 株式会社大林組 レーザービームによる厚板の溶断方法
DE4316012C2 (de) * 1993-05-13 1998-09-24 Gehring Gmbh & Co Maschf Verfahren zur Feinbearbeitung von Werkstück-Oberflächen
JP3159593B2 (ja) * 1994-02-28 2001-04-23 三菱電機株式会社 レーザ加工方法及びその装置
JP3534807B2 (ja) 1994-02-28 2004-06-07 三菱電機株式会社 レーザ切断方法
US6987786B2 (en) * 1998-07-02 2006-01-17 Gsi Group Corporation Controlling laser polarization
JP3518405B2 (ja) 1999-04-02 2004-04-12 三菱電機株式会社 レーザ加工方法及びレーザ加工装置
EP1262315B8 (de) 2001-05-25 2005-01-05 Stork Prints Austria GmbH Verfahren und Vorrichtung zur Herstellung einer Druckform
SG108262A1 (en) * 2001-07-06 2005-01-28 Inst Data Storage Method and apparatus for cutting a multi-layer substrate by dual laser irradiation
JP3753657B2 (ja) * 2001-12-27 2006-03-08 本田技研工業株式会社 ツインスポットパルスレーザ溶接方法および装置
JP2005161322A (ja) 2003-11-28 2005-06-23 Seiko Epson Corp 硬質材料の加工方法
US20060097430A1 (en) * 2004-11-05 2006-05-11 Li Xiaochun UV pulsed laser machining apparatus and method
JP2007277636A (ja) * 2006-04-06 2007-10-25 Yamazaki Mazak Corp レーザ焼入れ方法
US8624157B2 (en) 2006-05-25 2014-01-07 Electro Scientific Industries, Inc. Ultrashort laser pulse wafer scribing
US9029731B2 (en) 2007-01-26 2015-05-12 Electro Scientific Industries, Inc. Methods and systems for laser processing continuously moving sheet material
US7817685B2 (en) 2007-01-26 2010-10-19 Electro Scientific Industries, Inc. Methods and systems for generating pulse trains for material processing
JP2009049390A (ja) * 2007-07-25 2009-03-05 Rohm Co Ltd 窒化物半導体素子およびその製造方法

Also Published As

Publication number Publication date
US20100243625A1 (en) 2010-09-30
KR101729671B1 (ko) 2017-04-24
CN102348529B (zh) 2015-08-26
TW201034781A (en) 2010-10-01
WO2010110991A2 (en) 2010-09-30
JP2012521888A (ja) 2012-09-20
WO2010110991A3 (en) 2011-01-06
US8729427B2 (en) 2014-05-20
TWI535516B (zh) 2016-06-01
CN102348529A (zh) 2012-02-08
KR20120002599A (ko) 2012-01-06

Similar Documents

Publication Publication Date Title
JP5634497B2 (ja) レーザー使用による材料除去中の熱効果の最小化方法
JP6220775B2 (ja) ピコ秒レーザパルスを用いた高いパルス繰り返し周波数でのレーザダイレクトアブレーション
US20210053160A1 (en) Method and System for Ultrafast Laser-based Material Removal, Figuring and Polishing
US10137527B2 (en) Laser-based modification of transparent materials
JP5432285B2 (ja) 面取りした端部を有する形状にガラスをレーザ加工する方法
JP4171399B2 (ja) レーザ照射装置
US11389902B2 (en) Reducing surface asperities
Chaja et al. Influence of laser spot size and shape on ablation efficiency using ultrashort pulse laser system
JP2015189667A (ja) 強化ガラスのレーザ加工方法
TW202015849A (zh) 使用雷射脈衝進行的材料切割
JP7008740B2 (ja) 最適化されたレーザー切断
KR102168334B1 (ko) 레이저 방사선을 이용한 취성 경질 재료의 제거 방법
JP2014144485A (ja) レーザ加工方法、およびノズルの製造方法
KR20100032650A (ko) 레이저 및 절삭 공구를 이용한 홈 가공 방법
Zahrani et al. Investigation of scanning strategies on performance of nanosecond and picosecond laser volume ablation of bronze
Czotscher et al. Analysis of melting and melt expulsion during nanosecond pulsed laser ablation
JP2007288219A (ja) レーザ照射装置
KR20240123798A (ko) 기판 절단 및 쪼개기를 위한 기판 준비
JP2008194709A (ja) レーザ加工方法
JP3776913B2 (ja) レーザによって材料を除去するための方法
JP2005136365A (ja) レーザ照射装置及びレーザ照射方法
Kuršelis et al. Experimental study on femtosecond laser micromachining of grooves in stainless steel
Wee et al. Dimensional analyses and surface quality of pulsed UV laser micro-machining of STAVAX stainless steel mold inserts
Baskevicius et al. Optimization of Laser-Ablation Micromachining by Choice of Scanning Algorithms and Use of Laser-Induced-Breakdown Spectroscopy
CN119136941A (zh) 切削加工方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130220

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20130220

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20140116

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140121

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20140414

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20140421

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20140514

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20140521

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20140617

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20140624

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140717

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140930

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20141014

R150 Certificate of patent or registration of utility model

Ref document number: 5634497

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250