TWI535516B - 於利用雷射移除材料之期間減少熱效應 - Google Patents

於利用雷射移除材料之期間減少熱效應 Download PDF

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Publication number
TWI535516B
TWI535516B TW099105835A TW99105835A TWI535516B TW I535516 B TWI535516 B TW I535516B TW 099105835 A TW099105835 A TW 099105835A TW 99105835 A TW99105835 A TW 99105835A TW I535516 B TWI535516 B TW I535516B
Authority
TW
Taiwan
Prior art keywords
routings
laser
routing
sheet
tool path
Prior art date
Application number
TW099105835A
Other languages
English (en)
Chinese (zh)
Other versions
TW201034781A (en
Inventor
大迫康
Original Assignee
電子科學工業有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 電子科學工業有限公司 filed Critical 電子科學工業有限公司
Publication of TW201034781A publication Critical patent/TW201034781A/zh
Application granted granted Critical
Publication of TWI535516B publication Critical patent/TWI535516B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/18—Sheet panels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
TW099105835A 2009-03-27 2010-03-01 於利用雷射移除材料之期間減少熱效應 TWI535516B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/413,084 US8729427B2 (en) 2009-03-27 2009-03-27 Minimizing thermal effect during material removal using a laser

Publications (2)

Publication Number Publication Date
TW201034781A TW201034781A (en) 2010-10-01
TWI535516B true TWI535516B (zh) 2016-06-01

Family

ID=42781749

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099105835A TWI535516B (zh) 2009-03-27 2010-03-01 於利用雷射移除材料之期間減少熱效應

Country Status (6)

Country Link
US (1) US8729427B2 (enExample)
JP (1) JP5634497B2 (enExample)
KR (1) KR101729671B1 (enExample)
CN (1) CN102348529B (enExample)
TW (1) TWI535516B (enExample)
WO (1) WO2010110991A2 (enExample)

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US7633033B2 (en) 2004-01-09 2009-12-15 General Lasertronics Corporation Color sensing for laser decoating
WO2008118365A1 (en) 2007-03-22 2008-10-02 General Lasertronics Corporation Methods for stripping and modifying surfaces with laser-induced ablation
US8383984B2 (en) 2010-04-02 2013-02-26 Electro Scientific Industries, Inc. Method and apparatus for laser singulation of brittle materials
US10112257B1 (en) 2010-07-09 2018-10-30 General Lasertronics Corporation Coating ablating apparatus with coating removal detection
KR102035619B1 (ko) * 2010-07-26 2019-12-16 하마마츠 포토닉스 가부시키가이샤 레이저 가공방법
JP6392514B2 (ja) * 2010-12-30 2018-09-19 スリーエム イノベイティブ プロパティズ カンパニー レーザー切断方法及びこれにより製造された物品
JP2012196689A (ja) * 2011-03-22 2012-10-18 Fujitsu Ltd レーザ加工方法及びそのプログラム
US9895771B2 (en) 2012-02-28 2018-02-20 General Lasertronics Corporation Laser ablation for the environmentally beneficial removal of surface coatings
US9387041B2 (en) * 2013-03-15 2016-07-12 University Of North Texas Laser-assisted machining (LAM) of hard tissues and bones
US10188519B2 (en) 2013-03-15 2019-01-29 University Of North Texas Laser-assisted machining (LAM) of hard tissues and bones
KR102199211B1 (ko) * 2013-10-11 2021-01-07 삼성디스플레이 주식회사 레이저 가공 장치 및 이를 이용한 가공 방법
US10086597B2 (en) 2014-01-21 2018-10-02 General Lasertronics Corporation Laser film debonding method
KR102859580B1 (ko) * 2023-05-25 2025-09-12 현대모비스 주식회사 레이저 라우팅 방법

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1015610B (zh) * 1990-05-03 1992-02-26 江西省机械工业设计研究院 钢结硬质合金模具激光切割工艺
JP2720669B2 (ja) 1991-11-11 1998-03-04 株式会社大林組 レーザービームによる厚板の溶断方法
DE4316012C2 (de) * 1993-05-13 1998-09-24 Gehring Gmbh & Co Maschf Verfahren zur Feinbearbeitung von Werkstück-Oberflächen
JP3159593B2 (ja) * 1994-02-28 2001-04-23 三菱電機株式会社 レーザ加工方法及びその装置
JP3534807B2 (ja) 1994-02-28 2004-06-07 三菱電機株式会社 レーザ切断方法
US6987786B2 (en) * 1998-07-02 2006-01-17 Gsi Group Corporation Controlling laser polarization
JP3518405B2 (ja) 1999-04-02 2004-04-12 三菱電機株式会社 レーザ加工方法及びレーザ加工装置
EP1262315B8 (de) 2001-05-25 2005-01-05 Stork Prints Austria GmbH Verfahren und Vorrichtung zur Herstellung einer Druckform
SG108262A1 (en) * 2001-07-06 2005-01-28 Inst Data Storage Method and apparatus for cutting a multi-layer substrate by dual laser irradiation
JP3753657B2 (ja) * 2001-12-27 2006-03-08 本田技研工業株式会社 ツインスポットパルスレーザ溶接方法および装置
JP2005161322A (ja) 2003-11-28 2005-06-23 Seiko Epson Corp 硬質材料の加工方法
US20060097430A1 (en) * 2004-11-05 2006-05-11 Li Xiaochun UV pulsed laser machining apparatus and method
JP2007277636A (ja) * 2006-04-06 2007-10-25 Yamazaki Mazak Corp レーザ焼入れ方法
US8624157B2 (en) 2006-05-25 2014-01-07 Electro Scientific Industries, Inc. Ultrashort laser pulse wafer scribing
US9029731B2 (en) 2007-01-26 2015-05-12 Electro Scientific Industries, Inc. Methods and systems for laser processing continuously moving sheet material
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JP2009049390A (ja) * 2007-07-25 2009-03-05 Rohm Co Ltd 窒化物半導体素子およびその製造方法

Also Published As

Publication number Publication date
US20100243625A1 (en) 2010-09-30
KR101729671B1 (ko) 2017-04-24
CN102348529B (zh) 2015-08-26
TW201034781A (en) 2010-10-01
WO2010110991A2 (en) 2010-09-30
JP2012521888A (ja) 2012-09-20
JP5634497B2 (ja) 2014-12-03
WO2010110991A3 (en) 2011-01-06
US8729427B2 (en) 2014-05-20
CN102348529A (zh) 2012-02-08
KR20120002599A (ko) 2012-01-06

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