CN102348529B - 最小化在使用激光器的材料移除期间的热效应 - Google Patents

最小化在使用激光器的材料移除期间的热效应 Download PDF

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Publication number
CN102348529B
CN102348529B CN201080011500.5A CN201080011500A CN102348529B CN 102348529 B CN102348529 B CN 102348529B CN 201080011500 A CN201080011500 A CN 201080011500A CN 102348529 B CN102348529 B CN 102348529B
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China
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cutter path
route
laser
routes
perform
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CN201080011500.5A
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English (en)
Chinese (zh)
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CN102348529A (zh
Inventor
大迫康
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Electro Scientific Industries Inc
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Electro Scientific Industries Inc
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Publication of CN102348529A publication Critical patent/CN102348529A/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/18—Sheet panels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
CN201080011500.5A 2009-03-27 2010-02-26 最小化在使用激光器的材料移除期间的热效应 Active CN102348529B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/413,084 2009-03-27
US12/413,084 US8729427B2 (en) 2009-03-27 2009-03-27 Minimizing thermal effect during material removal using a laser
PCT/US2010/025639 WO2010110991A2 (en) 2009-03-27 2010-02-26 Minimizing thermal effect during material removal using a laser

Publications (2)

Publication Number Publication Date
CN102348529A CN102348529A (zh) 2012-02-08
CN102348529B true CN102348529B (zh) 2015-08-26

Family

ID=42781749

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080011500.5A Active CN102348529B (zh) 2009-03-27 2010-02-26 最小化在使用激光器的材料移除期间的热效应

Country Status (6)

Country Link
US (1) US8729427B2 (enExample)
JP (1) JP5634497B2 (enExample)
KR (1) KR101729671B1 (enExample)
CN (1) CN102348529B (enExample)
TW (1) TWI535516B (enExample)
WO (1) WO2010110991A2 (enExample)

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US7633033B2 (en) 2004-01-09 2009-12-15 General Lasertronics Corporation Color sensing for laser decoating
WO2008118365A1 (en) 2007-03-22 2008-10-02 General Lasertronics Corporation Methods for stripping and modifying surfaces with laser-induced ablation
US8383984B2 (en) 2010-04-02 2013-02-26 Electro Scientific Industries, Inc. Method and apparatus for laser singulation of brittle materials
US10112257B1 (en) 2010-07-09 2018-10-30 General Lasertronics Corporation Coating ablating apparatus with coating removal detection
KR102035619B1 (ko) * 2010-07-26 2019-12-16 하마마츠 포토닉스 가부시키가이샤 레이저 가공방법
JP6392514B2 (ja) * 2010-12-30 2018-09-19 スリーエム イノベイティブ プロパティズ カンパニー レーザー切断方法及びこれにより製造された物品
JP2012196689A (ja) * 2011-03-22 2012-10-18 Fujitsu Ltd レーザ加工方法及びそのプログラム
US9895771B2 (en) 2012-02-28 2018-02-20 General Lasertronics Corporation Laser ablation for the environmentally beneficial removal of surface coatings
US9387041B2 (en) * 2013-03-15 2016-07-12 University Of North Texas Laser-assisted machining (LAM) of hard tissues and bones
US10188519B2 (en) 2013-03-15 2019-01-29 University Of North Texas Laser-assisted machining (LAM) of hard tissues and bones
KR102199211B1 (ko) * 2013-10-11 2021-01-07 삼성디스플레이 주식회사 레이저 가공 장치 및 이를 이용한 가공 방법
US10086597B2 (en) 2014-01-21 2018-10-02 General Lasertronics Corporation Laser film debonding method
KR102859580B1 (ko) * 2023-05-25 2025-09-12 현대모비스 주식회사 레이저 라우팅 방법

Citations (4)

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CN1046303A (zh) * 1990-05-03 1990-10-24 江西省机械工业设计研究院 钢结硬质合金模具激光切割工艺
CN1115271A (zh) * 1994-02-28 1996-01-24 三菱电机株式会社 激光机械加工法和激光机器
JP2000288752A (ja) * 1999-04-02 2000-10-17 Mitsubishi Electric Corp レーザ加工方法及びレーザ加工装置
US20020195012A1 (en) * 2001-05-25 2002-12-26 Josef Juffinger Method and device for producing a printing block

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JP2720669B2 (ja) 1991-11-11 1998-03-04 株式会社大林組 レーザービームによる厚板の溶断方法
DE4316012C2 (de) * 1993-05-13 1998-09-24 Gehring Gmbh & Co Maschf Verfahren zur Feinbearbeitung von Werkstück-Oberflächen
JP3534807B2 (ja) 1994-02-28 2004-06-07 三菱電機株式会社 レーザ切断方法
US6987786B2 (en) * 1998-07-02 2006-01-17 Gsi Group Corporation Controlling laser polarization
SG108262A1 (en) * 2001-07-06 2005-01-28 Inst Data Storage Method and apparatus for cutting a multi-layer substrate by dual laser irradiation
JP3753657B2 (ja) * 2001-12-27 2006-03-08 本田技研工業株式会社 ツインスポットパルスレーザ溶接方法および装置
JP2005161322A (ja) 2003-11-28 2005-06-23 Seiko Epson Corp 硬質材料の加工方法
US20060097430A1 (en) * 2004-11-05 2006-05-11 Li Xiaochun UV pulsed laser machining apparatus and method
JP2007277636A (ja) * 2006-04-06 2007-10-25 Yamazaki Mazak Corp レーザ焼入れ方法
US8624157B2 (en) 2006-05-25 2014-01-07 Electro Scientific Industries, Inc. Ultrashort laser pulse wafer scribing
US9029731B2 (en) 2007-01-26 2015-05-12 Electro Scientific Industries, Inc. Methods and systems for laser processing continuously moving sheet material
US7817685B2 (en) 2007-01-26 2010-10-19 Electro Scientific Industries, Inc. Methods and systems for generating pulse trains for material processing
JP2009049390A (ja) * 2007-07-25 2009-03-05 Rohm Co Ltd 窒化物半導体素子およびその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1046303A (zh) * 1990-05-03 1990-10-24 江西省机械工业设计研究院 钢结硬质合金模具激光切割工艺
CN1115271A (zh) * 1994-02-28 1996-01-24 三菱电机株式会社 激光机械加工法和激光机器
JP2000288752A (ja) * 1999-04-02 2000-10-17 Mitsubishi Electric Corp レーザ加工方法及びレーザ加工装置
US20020195012A1 (en) * 2001-05-25 2002-12-26 Josef Juffinger Method and device for producing a printing block

Also Published As

Publication number Publication date
US20100243625A1 (en) 2010-09-30
KR101729671B1 (ko) 2017-04-24
TW201034781A (en) 2010-10-01
WO2010110991A2 (en) 2010-09-30
JP2012521888A (ja) 2012-09-20
JP5634497B2 (ja) 2014-12-03
WO2010110991A3 (en) 2011-01-06
US8729427B2 (en) 2014-05-20
TWI535516B (zh) 2016-06-01
CN102348529A (zh) 2012-02-08
KR20120002599A (ko) 2012-01-06

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