KR101729671B1 - 레이저를 사용하는 재료 제거 중에 열 효과를 최소화하는 방법 - Google Patents

레이저를 사용하는 재료 제거 중에 열 효과를 최소화하는 방법 Download PDF

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KR101729671B1
KR101729671B1 KR1020117025264A KR20117025264A KR101729671B1 KR 101729671 B1 KR101729671 B1 KR 101729671B1 KR 1020117025264 A KR1020117025264 A KR 1020117025264A KR 20117025264 A KR20117025264 A KR 20117025264A KR 101729671 B1 KR101729671 B1 KR 101729671B1
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South Korea
Prior art keywords
routing
laser
tool path
sheet material
polymer sheet
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Korean (ko)
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KR20120002599A (ko
Inventor
야수 오사코
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일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/18—Sheet panels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
KR1020117025264A 2009-03-27 2010-02-26 레이저를 사용하는 재료 제거 중에 열 효과를 최소화하는 방법 Active KR101729671B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/413,084 2009-03-27
US12/413,084 US8729427B2 (en) 2009-03-27 2009-03-27 Minimizing thermal effect during material removal using a laser
PCT/US2010/025639 WO2010110991A2 (en) 2009-03-27 2010-02-26 Minimizing thermal effect during material removal using a laser

Publications (2)

Publication Number Publication Date
KR20120002599A KR20120002599A (ko) 2012-01-06
KR101729671B1 true KR101729671B1 (ko) 2017-04-24

Family

ID=42781749

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117025264A Active KR101729671B1 (ko) 2009-03-27 2010-02-26 레이저를 사용하는 재료 제거 중에 열 효과를 최소화하는 방법

Country Status (6)

Country Link
US (1) US8729427B2 (enExample)
JP (1) JP5634497B2 (enExample)
KR (1) KR101729671B1 (enExample)
CN (1) CN102348529B (enExample)
TW (1) TWI535516B (enExample)
WO (1) WO2010110991A2 (enExample)

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US7633033B2 (en) 2004-01-09 2009-12-15 General Lasertronics Corporation Color sensing for laser decoating
WO2008118365A1 (en) 2007-03-22 2008-10-02 General Lasertronics Corporation Methods for stripping and modifying surfaces with laser-induced ablation
US8383984B2 (en) 2010-04-02 2013-02-26 Electro Scientific Industries, Inc. Method and apparatus for laser singulation of brittle materials
US10112257B1 (en) 2010-07-09 2018-10-30 General Lasertronics Corporation Coating ablating apparatus with coating removal detection
KR102035619B1 (ko) * 2010-07-26 2019-12-16 하마마츠 포토닉스 가부시키가이샤 레이저 가공방법
JP6392514B2 (ja) * 2010-12-30 2018-09-19 スリーエム イノベイティブ プロパティズ カンパニー レーザー切断方法及びこれにより製造された物品
JP2012196689A (ja) * 2011-03-22 2012-10-18 Fujitsu Ltd レーザ加工方法及びそのプログラム
US9895771B2 (en) 2012-02-28 2018-02-20 General Lasertronics Corporation Laser ablation for the environmentally beneficial removal of surface coatings
US9387041B2 (en) * 2013-03-15 2016-07-12 University Of North Texas Laser-assisted machining (LAM) of hard tissues and bones
US10188519B2 (en) 2013-03-15 2019-01-29 University Of North Texas Laser-assisted machining (LAM) of hard tissues and bones
KR102199211B1 (ko) * 2013-10-11 2021-01-07 삼성디스플레이 주식회사 레이저 가공 장치 및 이를 이용한 가공 방법
US10086597B2 (en) 2014-01-21 2018-10-02 General Lasertronics Corporation Laser film debonding method
KR102859580B1 (ko) * 2023-05-25 2025-09-12 현대모비스 주식회사 레이저 라우팅 방법

Citations (2)

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JP2000288752A (ja) * 1999-04-02 2000-10-17 Mitsubishi Electric Corp レーザ加工方法及びレーザ加工装置
JP2005161322A (ja) * 2003-11-28 2005-06-23 Seiko Epson Corp 硬質材料の加工方法

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CN1015610B (zh) * 1990-05-03 1992-02-26 江西省机械工业设计研究院 钢结硬质合金模具激光切割工艺
JP2720669B2 (ja) 1991-11-11 1998-03-04 株式会社大林組 レーザービームによる厚板の溶断方法
DE4316012C2 (de) * 1993-05-13 1998-09-24 Gehring Gmbh & Co Maschf Verfahren zur Feinbearbeitung von Werkstück-Oberflächen
JP3159593B2 (ja) * 1994-02-28 2001-04-23 三菱電機株式会社 レーザ加工方法及びその装置
JP3534807B2 (ja) 1994-02-28 2004-06-07 三菱電機株式会社 レーザ切断方法
US6987786B2 (en) * 1998-07-02 2006-01-17 Gsi Group Corporation Controlling laser polarization
EP1262315B8 (de) 2001-05-25 2005-01-05 Stork Prints Austria GmbH Verfahren und Vorrichtung zur Herstellung einer Druckform
SG108262A1 (en) * 2001-07-06 2005-01-28 Inst Data Storage Method and apparatus for cutting a multi-layer substrate by dual laser irradiation
JP3753657B2 (ja) * 2001-12-27 2006-03-08 本田技研工業株式会社 ツインスポットパルスレーザ溶接方法および装置
US20060097430A1 (en) * 2004-11-05 2006-05-11 Li Xiaochun UV pulsed laser machining apparatus and method
JP2007277636A (ja) * 2006-04-06 2007-10-25 Yamazaki Mazak Corp レーザ焼入れ方法
US8624157B2 (en) 2006-05-25 2014-01-07 Electro Scientific Industries, Inc. Ultrashort laser pulse wafer scribing
US9029731B2 (en) 2007-01-26 2015-05-12 Electro Scientific Industries, Inc. Methods and systems for laser processing continuously moving sheet material
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JP2009049390A (ja) * 2007-07-25 2009-03-05 Rohm Co Ltd 窒化物半導体素子およびその製造方法

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Publication number Priority date Publication date Assignee Title
JP2000288752A (ja) * 1999-04-02 2000-10-17 Mitsubishi Electric Corp レーザ加工方法及びレーザ加工装置
JP2005161322A (ja) * 2003-11-28 2005-06-23 Seiko Epson Corp 硬質材料の加工方法

Also Published As

Publication number Publication date
US20100243625A1 (en) 2010-09-30
CN102348529B (zh) 2015-08-26
TW201034781A (en) 2010-10-01
WO2010110991A2 (en) 2010-09-30
JP2012521888A (ja) 2012-09-20
JP5634497B2 (ja) 2014-12-03
WO2010110991A3 (en) 2011-01-06
US8729427B2 (en) 2014-05-20
TWI535516B (zh) 2016-06-01
CN102348529A (zh) 2012-02-08
KR20120002599A (ko) 2012-01-06

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