JP2012521888A5 - - Google Patents

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Publication number
JP2012521888A5
JP2012521888A5 JP2012502069A JP2012502069A JP2012521888A5 JP 2012521888 A5 JP2012521888 A5 JP 2012521888A5 JP 2012502069 A JP2012502069 A JP 2012502069A JP 2012502069 A JP2012502069 A JP 2012502069A JP 2012521888 A5 JP2012521888 A5 JP 2012521888A5
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JP
Japan
Prior art keywords
routing
tool path
routings
laser
sheet material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012502069A
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English (en)
Japanese (ja)
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JP2012521888A (ja
JP5634497B2 (ja
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Publication date
Priority claimed from US12/413,084 external-priority patent/US8729427B2/en
Application filed filed Critical
Publication of JP2012521888A publication Critical patent/JP2012521888A/ja
Publication of JP2012521888A5 publication Critical patent/JP2012521888A5/ja
Application granted granted Critical
Publication of JP5634497B2 publication Critical patent/JP5634497B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012502069A 2009-03-27 2010-02-26 レーザー使用による材料除去中の熱効果の最小化方法 Active JP5634497B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/413,084 2009-03-27
US12/413,084 US8729427B2 (en) 2009-03-27 2009-03-27 Minimizing thermal effect during material removal using a laser
PCT/US2010/025639 WO2010110991A2 (en) 2009-03-27 2010-02-26 Minimizing thermal effect during material removal using a laser

Publications (3)

Publication Number Publication Date
JP2012521888A JP2012521888A (ja) 2012-09-20
JP2012521888A5 true JP2012521888A5 (enExample) 2013-04-11
JP5634497B2 JP5634497B2 (ja) 2014-12-03

Family

ID=42781749

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012502069A Active JP5634497B2 (ja) 2009-03-27 2010-02-26 レーザー使用による材料除去中の熱効果の最小化方法

Country Status (6)

Country Link
US (1) US8729427B2 (enExample)
JP (1) JP5634497B2 (enExample)
KR (1) KR101729671B1 (enExample)
CN (1) CN102348529B (enExample)
TW (1) TWI535516B (enExample)
WO (1) WO2010110991A2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7633033B2 (en) 2004-01-09 2009-12-15 General Lasertronics Corporation Color sensing for laser decoating
WO2008118365A1 (en) 2007-03-22 2008-10-02 General Lasertronics Corporation Methods for stripping and modifying surfaces with laser-induced ablation
US8383984B2 (en) 2010-04-02 2013-02-26 Electro Scientific Industries, Inc. Method and apparatus for laser singulation of brittle materials
US10112257B1 (en) 2010-07-09 2018-10-30 General Lasertronics Corporation Coating ablating apparatus with coating removal detection
KR102035619B1 (ko) * 2010-07-26 2019-12-16 하마마츠 포토닉스 가부시키가이샤 레이저 가공방법
JP6392514B2 (ja) * 2010-12-30 2018-09-19 スリーエム イノベイティブ プロパティズ カンパニー レーザー切断方法及びこれにより製造された物品
JP2012196689A (ja) * 2011-03-22 2012-10-18 Fujitsu Ltd レーザ加工方法及びそのプログラム
US9895771B2 (en) 2012-02-28 2018-02-20 General Lasertronics Corporation Laser ablation for the environmentally beneficial removal of surface coatings
US9387041B2 (en) * 2013-03-15 2016-07-12 University Of North Texas Laser-assisted machining (LAM) of hard tissues and bones
US10188519B2 (en) 2013-03-15 2019-01-29 University Of North Texas Laser-assisted machining (LAM) of hard tissues and bones
KR102199211B1 (ko) * 2013-10-11 2021-01-07 삼성디스플레이 주식회사 레이저 가공 장치 및 이를 이용한 가공 방법
US10086597B2 (en) 2014-01-21 2018-10-02 General Lasertronics Corporation Laser film debonding method
KR102859580B1 (ko) * 2023-05-25 2025-09-12 현대모비스 주식회사 레이저 라우팅 방법

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1015610B (zh) * 1990-05-03 1992-02-26 江西省机械工业设计研究院 钢结硬质合金模具激光切割工艺
JP2720669B2 (ja) 1991-11-11 1998-03-04 株式会社大林組 レーザービームによる厚板の溶断方法
DE4316012C2 (de) * 1993-05-13 1998-09-24 Gehring Gmbh & Co Maschf Verfahren zur Feinbearbeitung von Werkstück-Oberflächen
JP3159593B2 (ja) * 1994-02-28 2001-04-23 三菱電機株式会社 レーザ加工方法及びその装置
JP3534807B2 (ja) 1994-02-28 2004-06-07 三菱電機株式会社 レーザ切断方法
US6987786B2 (en) * 1998-07-02 2006-01-17 Gsi Group Corporation Controlling laser polarization
JP3518405B2 (ja) 1999-04-02 2004-04-12 三菱電機株式会社 レーザ加工方法及びレーザ加工装置
EP1262315B8 (de) 2001-05-25 2005-01-05 Stork Prints Austria GmbH Verfahren und Vorrichtung zur Herstellung einer Druckform
SG108262A1 (en) * 2001-07-06 2005-01-28 Inst Data Storage Method and apparatus for cutting a multi-layer substrate by dual laser irradiation
JP3753657B2 (ja) * 2001-12-27 2006-03-08 本田技研工業株式会社 ツインスポットパルスレーザ溶接方法および装置
JP2005161322A (ja) 2003-11-28 2005-06-23 Seiko Epson Corp 硬質材料の加工方法
US20060097430A1 (en) * 2004-11-05 2006-05-11 Li Xiaochun UV pulsed laser machining apparatus and method
JP2007277636A (ja) * 2006-04-06 2007-10-25 Yamazaki Mazak Corp レーザ焼入れ方法
US8624157B2 (en) 2006-05-25 2014-01-07 Electro Scientific Industries, Inc. Ultrashort laser pulse wafer scribing
US9029731B2 (en) 2007-01-26 2015-05-12 Electro Scientific Industries, Inc. Methods and systems for laser processing continuously moving sheet material
US7817685B2 (en) 2007-01-26 2010-10-19 Electro Scientific Industries, Inc. Methods and systems for generating pulse trains for material processing
JP2009049390A (ja) * 2007-07-25 2009-03-05 Rohm Co Ltd 窒化物半導体素子およびその製造方法

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