JP5611355B2 - 金属張積層板 - Google Patents

金属張積層板 Download PDF

Info

Publication number
JP5611355B2
JP5611355B2 JP2012528710A JP2012528710A JP5611355B2 JP 5611355 B2 JP5611355 B2 JP 5611355B2 JP 2012528710 A JP2012528710 A JP 2012528710A JP 2012528710 A JP2012528710 A JP 2012528710A JP 5611355 B2 JP5611355 B2 JP 5611355B2
Authority
JP
Japan
Prior art keywords
metal
liquid crystal
crystal polymer
clad laminate
metal foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012528710A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2012020818A1 (ja
Inventor
有起 岡崎
有起 岡崎
慎悟 安藤
慎悟 安藤
昭平 荒井
昭平 荒井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel and Sumikin Chemical Co Ltd
Original Assignee
Nippon Steel and Sumikin Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel and Sumikin Chemical Co Ltd filed Critical Nippon Steel and Sumikin Chemical Co Ltd
Priority to JP2012528710A priority Critical patent/JP5611355B2/ja
Publication of JPWO2012020818A1 publication Critical patent/JPWO2012020818A1/ja
Application granted granted Critical
Publication of JP5611355B2 publication Critical patent/JP5611355B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204—Di-electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2012528710A 2010-08-12 2011-08-11 金属張積層板 Active JP5611355B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012528710A JP5611355B2 (ja) 2010-08-12 2011-08-11 金属張積層板

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2010180682 2010-08-12
JP2010180682 2010-08-12
PCT/JP2011/068340 WO2012020818A1 (ja) 2010-08-12 2011-08-11 金属張積層板
JP2012528710A JP5611355B2 (ja) 2010-08-12 2011-08-11 金属張積層板

Publications (2)

Publication Number Publication Date
JPWO2012020818A1 JPWO2012020818A1 (ja) 2013-10-28
JP5611355B2 true JP5611355B2 (ja) 2014-10-22

Family

ID=45567778

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012528710A Active JP5611355B2 (ja) 2010-08-12 2011-08-11 金属張積層板

Country Status (5)

Country Link
JP (1) JP5611355B2 (zh)
KR (1) KR101913368B1 (zh)
CN (1) CN103069933B (zh)
TW (1) TWI520841B (zh)
WO (1) WO2012020818A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6202905B2 (ja) * 2013-06-27 2017-09-27 株式会社クラレ 回路基板およびその製造方法
WO2015050080A1 (ja) 2013-10-03 2015-04-09 株式会社クラレ 熱可塑性液晶ポリマーフィルム、回路基板、およびそれらの製造方法
JP6653466B2 (ja) * 2014-06-05 2020-02-26 パナソニックＩｐマネジメント株式会社 金属箔付き液晶ポリマーフィルムの製造方法、金属箔付き液晶ポリマーフィルム、多層プリント配線板の製造方法
CN105470161B (zh) * 2015-12-10 2017-11-07 深圳市精诚达电路科技股份有限公司 一种监控fpc金手指金面粗糙的工艺方法
CN110832120B (zh) 2017-03-30 2022-01-11 古河电气工业株式会社 表面处理铜箔、以及使用该表面处理铜箔的覆铜板及印刷电路布线板
CN112969585A (zh) * 2018-11-08 2021-06-15 株式会社可乐丽 热塑性液晶聚合物膜和使用该膜的电路基板
TWI740515B (zh) 2019-12-23 2021-09-21 長春人造樹脂廠股份有限公司 液晶高分子膜及包含其之積層板
CN115298024A (zh) * 2020-03-24 2022-11-04 株式会社可乐丽 覆金属层叠体的制造方法
CN115279586A (zh) * 2020-03-24 2022-11-01 株式会社可乐丽 覆金属层叠体的制造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002240146A (ja) * 2001-02-19 2002-08-28 Kuraray Co Ltd インフレーション製膜方法とその装置
JP2005219379A (ja) * 2004-02-06 2005-08-18 Furukawa Circuit Foil Kk 基板用複合材及びそれを用いた回路基板
JP2006103189A (ja) * 2004-10-06 2006-04-20 Furukawa Circuit Foil Kk 表面処理銅箔並びに回路基板
JP2007146139A (ja) * 2005-10-26 2007-06-14 Sumitomo Chemical Co Ltd 樹脂含浸基材およびその製造方法
JP2010103339A (ja) * 2008-10-24 2010-05-06 Sumitomo Chemical Co Ltd 高周波回路基板
JP2010108251A (ja) * 2008-10-30 2010-05-13 Sumitomo Chemical Co Ltd 無線タグ及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4679679B2 (ja) * 1999-05-18 2011-04-27 株式会社クラレ 熱可塑性液晶ポリマーフィルムの製造方法
JP5041652B2 (ja) * 2003-05-21 2012-10-03 株式会社クラレ フィルムの製造方法
JP4722507B2 (ja) * 2005-02-17 2011-07-13 新日鐵化学株式会社 繰り返し屈曲用途向け両面フレキシブル回路基板
JP4391437B2 (ja) * 2005-03-30 2009-12-24 古河電気工業株式会社 積層回路基板、積層回路基板用表面処理銅箔及び表面処理銅箔
WO2006109507A1 (ja) * 2005-03-31 2006-10-19 Nippon Steel Chemical Co., Ltd. Hddサスペンション用積層体及びその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002240146A (ja) * 2001-02-19 2002-08-28 Kuraray Co Ltd インフレーション製膜方法とその装置
JP2005219379A (ja) * 2004-02-06 2005-08-18 Furukawa Circuit Foil Kk 基板用複合材及びそれを用いた回路基板
JP2006103189A (ja) * 2004-10-06 2006-04-20 Furukawa Circuit Foil Kk 表面処理銅箔並びに回路基板
JP2007146139A (ja) * 2005-10-26 2007-06-14 Sumitomo Chemical Co Ltd 樹脂含浸基材およびその製造方法
JP2010103339A (ja) * 2008-10-24 2010-05-06 Sumitomo Chemical Co Ltd 高周波回路基板
JP2010108251A (ja) * 2008-10-30 2010-05-13 Sumitomo Chemical Co Ltd 無線タグ及びその製造方法

Also Published As

Publication number Publication date
KR20130099935A (ko) 2013-09-06
WO2012020818A1 (ja) 2012-02-16
CN103069933A (zh) 2013-04-24
JPWO2012020818A1 (ja) 2013-10-28
KR101913368B1 (ko) 2018-10-30
CN103069933B (zh) 2014-06-04
TWI520841B (zh) 2016-02-11
TW201223750A (en) 2012-06-16

Similar Documents

Publication Publication Date Title
JP5611355B2 (ja) 金属張積層板
JP6656231B2 (ja) 金属張積層板の製造方法およびこれを用いた金属張積層板
JP6871910B2 (ja) 金属張積層板の製造方法および金属張積層板
JP4866853B2 (ja) 熱可塑性液晶ポリマーフィルムで被覆した配線基板の製造方法
JP6282230B2 (ja) フレキシブル金属張積層体およびその製造方法
KR102304510B1 (ko) 금속 클래드 적층판 및 그 제조방법
JP6019012B2 (ja) 高周波回路基板
JP6119433B2 (ja) めっき積層体およびその製造方法
JP2009172996A (ja) フレキシブル銅張積層板及びその製造方法
CN107278015B (zh) 铜箔、覆铜层叠板、以及柔性印刷基板和电子设备
JP2005105165A (ja) 低温積層可能な熱可塑性液晶ポリマーフィルム
JP4689263B2 (ja) 積層配線基板およびその製造法
JP5226035B2 (ja) 積層配線基板の製造法
JP2011216598A (ja) 高周波回路基板
JP6202905B2 (ja) 回路基板およびその製造方法
JP4389627B2 (ja) フレキシブル金属積層板の製造方法
WO2021193385A1 (ja) 多層回路基板の製造方法
JP2008177243A (ja) 多層プリント配線板の製造方法
JP2024019554A (ja) フレキシブル基板の製造方法
KR20230074140A (ko) 금속장 적층판 및 그 제조 방법
JP2021104624A (ja) 積層板
JP2003118060A (ja) 耐熱性フレキシブル積層板の製造方法
JP2014130926A (ja) 金属張積層板及び電子機器
JP2006130761A (ja) 銅張積層板の製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140403

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140826

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140902

R150 Certificate of patent or registration of utility model

Ref document number: 5611355

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250