JP5603470B2 - 軟性印刷回路基板のカバーレイ用組成物及びその製造方法 - Google Patents
軟性印刷回路基板のカバーレイ用組成物及びその製造方法 Download PDFInfo
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- 229920001721 polyimide Polymers 0.000 claims description 69
- 239000004642 Polyimide Substances 0.000 claims description 66
- 238000000034 method Methods 0.000 claims description 28
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 238000006116 polymerization reaction Methods 0.000 claims description 14
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- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 8
- 150000001412 amines Chemical class 0.000 claims description 8
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- 239000000377 silicon dioxide Substances 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 8
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 claims description 6
- 229920005575 poly(amic acid) Polymers 0.000 claims description 6
- 239000007810 chemical reaction solvent Substances 0.000 claims description 4
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 150000008064 anhydrides Chemical class 0.000 claims description 3
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical group C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 claims description 3
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 claims description 3
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 claims description 3
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 claims description 3
- NUIURNJTPRWVAP-UHFFFAOYSA-N 3,3'-Dimethylbenzidine Chemical compound C1=C(N)C(C)=CC(C=2C=C(C)C(N)=CC=2)=C1 NUIURNJTPRWVAP-UHFFFAOYSA-N 0.000 claims description 2
- XUSNPFGLKGCWGN-UHFFFAOYSA-N 3-[4-(3-aminopropyl)piperazin-1-yl]propan-1-amine Chemical compound NCCCN1CCN(CCCN)CC1 XUSNPFGLKGCWGN-UHFFFAOYSA-N 0.000 claims description 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 claims description 2
- CQMIJLIXKMKFQW-UHFFFAOYSA-N 4-phenylbenzene-1,2,3,5-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C(O)=O)=C1C1=CC=CC=C1 CQMIJLIXKMKFQW-UHFFFAOYSA-N 0.000 claims description 2
- 102000006602 glyceraldehyde-3-phosphate dehydrogenase Human genes 0.000 claims description 2
- 108020004445 glyceraldehyde-3-phosphate dehydrogenase Proteins 0.000 claims description 2
- 238000007650 screen-printing Methods 0.000 claims description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 3
- KMKWGXGSGPYISJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KMKWGXGSGPYISJ-UHFFFAOYSA-N 0.000 claims 1
- 150000003852 triazoles Chemical class 0.000 claims 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 claims 1
- 239000012787 coverlay film Substances 0.000 description 13
- 239000010410 layer Substances 0.000 description 13
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- 229910000679 solder Inorganic materials 0.000 description 6
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- 150000004985 diamines Chemical class 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- MHABMANUFPZXEB-UHFFFAOYSA-N O-demethyl-aloesaponarin I Natural products O=C1C2=CC=CC(O)=C2C(=O)C2=C1C=C(O)C(C(O)=O)=C2C MHABMANUFPZXEB-UHFFFAOYSA-N 0.000 description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- -1 perfluoroisopropylidene Chemical group 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- KHYXYOGWAIYVBD-UHFFFAOYSA-N 4-(4-propylphenoxy)aniline Chemical compound C1=CC(CCC)=CC=C1OC1=CC=C(N)C=C1 KHYXYOGWAIYVBD-UHFFFAOYSA-N 0.000 description 1
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical group FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 description 1
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- PKWIYNIDEDLDCJ-UHFFFAOYSA-N guanazole Chemical compound NC1=NNC(N)=N1 PKWIYNIDEDLDCJ-UHFFFAOYSA-N 0.000 description 1
- 238000009998 heat setting Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- RKFCDGOVCBYSEW-AUUKWEANSA-N tmeg Chemical compound COC=1C(OC)=CC(C(OC(C=2OC)=C34)=O)=C3C=1OC(=O)C4=CC=2O[C@@H]1O[C@H](CO)[C@@H](O)[C@H](O)[C@H]1O RKFCDGOVCBYSEW-AUUKWEANSA-N 0.000 description 1
- DQJCHOQLCLEDLL-UHFFFAOYSA-N tricyclazole Chemical compound CC1=CC=CC2=C1N1C=NN=C1S2 DQJCHOQLCLEDLL-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1085—Polyimides with diamino moieties or tetracarboxylic segments containing heterocyclic moieties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
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- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Paints Or Removers (AREA)
Description
Resist)が使用される。ソルダレジストの重要な特性としては、回路保護、絶縁、耐熱性などが挙げられる。ソルダレジストは、片面、多層基板、パッケージ用基板、硬軟性(Rigid−Flexible)基板など殆どの印刷回路基板に使用されているが、硬化後には硬くなって屈曲特性がなくなる。
以下、このようにして得られた液状ポリイミドカバーレイ用組成物を印刷回路基板に塗布する工程を、図3を参照して説明する。
このようにして形成されたポリイミドカバーレイ層の厚さは、図1に示されたように25μmであった。
Claims (9)
- ポリイミド10.0〜45.0wt%、消泡剤0.01〜5.0wt%、レベリング剤0.01〜5.0wt%、分散剤0.01〜5.0wt%、変性ポリイミド0.1〜15.0wt%、シリカ1.0〜15.0wt%を含み、残部がソルベントであることを特徴とする印刷回路基板のカバーレイ用組成物。
- 前記ポリイミドが、酸無水物とアミンとの重合によって形成されることを特徴とする請求項1に記載の印刷回路基板のカバーレイ用組成物。
- 前記酸無水物が、PMDA(pyromellitic dianhydride)、PA(phthalic anhydride)、BPDA(3,3´4,4´‐biphenyltetracarboxylic dianhydride)、BTDA(3,3´4,4´‐benzophenonetetracarboxylic dianhydride)、ODPA(4´4‐oxydiphthalic anhydride)、TMEG(trimellitic ethylene glycol)、BPADA(4,4´´‐(4´4‐isopropylbiphenoxy)bi phthalic anhydride)、4‐PEPA(4‐phenylethynyl phthalic anhydride)、6FDA(perfluoroisopropylidene containing acid dianhydride)、TMA(trimellitic anhydride)のうちいずれか1つ以上であることを特徴とする請求項2に記載の印刷回路基板のカバーレイ用組成物。
- 前記アミンが、ODA(4,4´‐diamino diphenyl)、p‐PDA(p‐phenyl diamine)、4,4´‐ODA4,4´‐oxydianiline、BAPP(2,2‐bis(4‐(4‐aminophenoxy)‐phenyl)propane、p‐MDA(p‐methylenedianiline)、GAPD(propyltetramethyl disiloxane)、jeffamine(AP‐22 polyaromatic amine)、TPE‐R、DDS(4,4´‐diaminodiphenyl sulfone)、TFDB(2,2´‐bis(trifluoromethyl)‐4,4´‐diaminobiphenyl)、Triazole(3,5‐diamino‐1,2,4‐triazole)、MDA(4,4´diamino‐diphenyl methane)、OTB(3,3´‐dimethyl benzidine)のうちいずれか1つ以上であることを特徴とする請求項2に記載の印刷回路基板のカバーレイ用組成物。
- 軟性印刷回路基板のカバーレイ用組成物の製造方法であって、
アミンを反応溶媒に入れて1次重合する段階と、
酸無水物を別途の反応溶媒に入れて2次重合する段階と、
前記1次重合による生成物と2次重合による生成物とを混合してポリアミック酸を形成する段階と、
前記ポリアミック酸に消泡剤、レベリング剤、分散剤、変性ポリイミド及びシリカを添加する段階と、を含み、
ポリイミドの組成が10.0〜45.0wt%、消泡剤0.01〜5.0wt%、レベリング剤0.01〜5.0wt%、分散剤0.01〜5.0wt%、変性ポリイミド0.1〜15.0wt%、シリカ1.0〜15.0wt%であることを特徴とする軟性印刷回路基板のカバーレイ用組成物の製造方法。 - 所望の印刷パターンを有するマスクを軟性印刷回路基板の回路に用意する段階と、
前記マスクの開放部に請求項1に記載のカバーレイ用組成物を塗布する段階と、
前記カバーレイ用組成物が塗布された印刷回路基板を硬化する段階と、を含むことを特徴とする、軟性印刷回路基板にポリイミドカバーレイを形成する方法。 - 前記印刷がシルクスクリーン印刷によって行われることを特徴とする請求項6に記載の、軟性印刷回路基板にポリイミドカバーレイを形成する方法。
- 前記硬化がオーブンで約200℃で行われることを特徴とする請求項6に記載の、軟性印刷回路基板にポリイミドカバーレイを形成する方法。
- 前記硬化されたポリイミド組成物の厚さが10〜60μmであることを特徴とする請求項6に記載の、軟性印刷回路基板にポリイミドカバーレイを形成する方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020120099344A KR101397950B1 (ko) | 2012-09-07 | 2012-09-07 | 연성인쇄회로기판 커버레이용 조성물 및 그 제조 방법 |
KR10-2012-0099344 | 2012-09-07 |
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JP2014053602A JP2014053602A (ja) | 2014-03-20 |
JP5603470B2 true JP5603470B2 (ja) | 2014-10-08 |
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JP2013167404A Active JP5603470B2 (ja) | 2012-09-07 | 2013-08-12 | 軟性印刷回路基板のカバーレイ用組成物及びその製造方法 |
Country Status (4)
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US (1) | US20140072701A1 (ja) |
JP (1) | JP5603470B2 (ja) |
KR (1) | KR101397950B1 (ja) |
CN (1) | CN103666244A (ja) |
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JP2019046871A (ja) * | 2017-08-30 | 2019-03-22 | タツタ電線株式会社 | 電磁波シールドフィルム、シールドプリント配線板、及び、シールドプリント配線板の製造方法 |
EP3481162B1 (en) | 2017-11-06 | 2023-09-06 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with two component carrier portions and a component being embedded in a blind opening of one of the component carrier portions |
KR102185327B1 (ko) * | 2018-11-06 | 2020-12-01 | (주)이녹스첨단소재 | Fpic 필름 및 이의 제조방법 |
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KR20210116067A (ko) * | 2020-03-17 | 2021-09-27 | 주식회사 두산 | 내흡습 및 흡수 특성을 갖는 폴리이미드 필름 |
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US5554684A (en) * | 1993-10-12 | 1996-09-10 | Occidental Chemical Corporation | Forming polyimide coating by screen printing |
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US5882388A (en) * | 1996-10-16 | 1999-03-16 | Brady Usa, Inc. | Water resistant ink jet recording media topcoats |
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JP2007099852A (ja) | 2005-10-03 | 2007-04-19 | Hitachi Chem Co Ltd | 樹脂組成物及びそれを含む被膜形成材料 |
JP4666682B2 (ja) * | 2006-03-17 | 2011-04-06 | 日立マクセル株式会社 | 油性インク組成物 |
US20100233476A1 (en) * | 2006-06-20 | 2010-09-16 | Makoto Uchida | Copper foil with primer resin layer and laminated sheet using the same |
CN100413911C (zh) * | 2006-09-06 | 2008-08-27 | 湖北省化学研究院 | 一种无胶型挠性覆铝板及其使用的聚酰亚胺基体树脂 |
KR100925757B1 (ko) * | 2007-12-27 | 2009-11-11 | 삼성전기주식회사 | 인쇄회로기판용 절연체, 이를 구비한 인쇄회로기판 및 그제조방법 |
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US20140072701A1 (en) | 2014-03-13 |
KR20140032707A (ko) | 2014-03-17 |
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